JPH0413566U - - Google Patents
Info
- Publication number
- JPH0413566U JPH0413566U JP5344390U JP5344390U JPH0413566U JP H0413566 U JPH0413566 U JP H0413566U JP 5344390 U JP5344390 U JP 5344390U JP 5344390 U JP5344390 U JP 5344390U JP H0413566 U JPH0413566 U JP H0413566U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor products
- adhesive
- taping member
- adhering
- combining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000004806 packaging method and process Methods 0.000 claims 1
Landscapes
- Packages (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
従来の粘着式テーピング部材の一例の平面図であ
る。 １……紙テープ、２，２ａ，２ｂ……粘着テー
プ。
従来の粘着式テーピング部材の一例の平面図であ
る。 １……紙テープ、２，２ａ，２ｂ……粘着テー
プ。
Claims (1)
- 半導体製品の包装に使用する半導体製品用粘着
式テーピング部材において、前記半導体製品を粘
着する粘着テープを少くとも２本組み合せて構成
したことを特徴とする半導体製品用粘着式テーピ
ング部材。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5344390U JPH0413566U (ja) | 1990-05-22 | 1990-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5344390U JPH0413566U (ja) | 1990-05-22 | 1990-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0413566U true JPH0413566U (ja) | 1992-02-04 |
Family
ID=31574631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5344390U Pending JPH0413566U (ja) | 1990-05-22 | 1990-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0413566U (ja) |
-
1990
- 1990-05-22 JP JP5344390U patent/JPH0413566U/ja active Pending