JPH04137585A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To prevent the peeling and erosion of a conductor pattern by fitting a terminal board with lead inserting holes for discrete parts to the conductor pattern and electrically connecting the lead terminals of discrete parts inserted into the lead inserting holes from the opposite side of a hybrid integrated circuit board to the terminal board. CONSTITUTION:Lead terminals 4 are inserted into the lead inserting holes of a substrate 1 from the side of the substrate 1 opposite to the conductor pattern 5 forming surface and electrically connected to a terminal board 11 which is soldered 6 to the pattern 5 in advance by soldering 6. The terminal board 11 has holes 12 for passing the lead terminals 4 of discrete parts 2 and is fitted to the conductor pattern 5 by solder 6 so that the holes 12 can meet the lead inserting holes of the substrate 1. Therefore, the peeling of the conductor pattern can be prevented when the discrete parts 2 are mounted and the mechanical strength of the connecting sections between the discrete parts and lead terminals can be increased, resulting in improvement in reliability of the vibration and weather resistances.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention provides a method for adding discrete components (
The present invention relates to a hybrid integrated circuit board device with an improved method for mounting (circuit elements).

(Prior Art) In a hybrid integrated circuit as shown in FIG. 6, when discrete components 2 such as capacitors, crystals, filters, etc. are attached to a hybrid integrated circuit board 1, conventionally, as shown in FIG. The lead terminals 4 of the discrete components 2 are inserted into the lead insertion holes 3 drilled in the integrated circuit board 1, and soldered 6 onto the conductive patterns 5 formed on the surface of the board 1 opposite to the surface on which the discrete components 2 are mounted. was. Note that the reference numeral 7 in the figure is a lead frame.

(Problems to be Solved by the Invention) However, in the conventional method of soldering the lead terminals of such discrete components onto the conductor pattern, (1) peeling of the conductor pattern is likely to occur.

■The mechanical strength of the mounting part is weak, and the reliability is low in terms of vibration resistance and weather resistance against external forces such as impacts.

■When replacing discrete parts, the conductor pattern may peel off or be eaten away.

There were other problems.

The present invention was made to solve the above problems, and
The object of the present invention is to provide a hybrid integrated circuit device that prevents conductor patterns from peeling off or being eaten away, improves vibration resistance and weather resistance, and facilitates the replacement of discrete components.

[Configuration of the Invention (Means for Solving the Problems) That is, the hybrid integrated circuit device of the present invention forms a conductor pattern around the lead insertion hole of a discrete component drilled in a hybrid integrated circuit board, and A terminal board with lead insertion holes for discrete components is attached to the conductor pattern, and the lead terminals of the discrete components inserted into these lead insertion holes from the hybrid integrated circuit board side are electrically connected and fixed to the terminal board. It is something to do.

(Function) In the hybrid integrated circuit board device of the present invention, since the lead terminals of the discrete components are electrically connected to the conductor pattern via the terminal board having a certain area, external forces such as shocks are applied to the discrete components. The force is also dispersed by the terminal board, which prevents the conductor pattern from peeling off.

Therefore, vibration resistance is improved, and weather resistance and the like are also improved. Furthermore, since the lead terminals of the discrete components are not directly attached to the conductor pattern, the discrete components can be easily replaced without causing any damage or damage to the pattern.

(Example) Hereinafter, an example of the present invention will be described based on the drawings. Note that the same parts as those in the conventional example are denoted by the same reference numerals, and the description thereof will be omitted.

FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a perspective view of the main parts thereof. In the hybrid integrated circuit device, chip components 10 and discrete components 2 are mounted on a substrate 1 having a conductor pattern 5 formed on one or both sides,
The circuit is configured. In this embodiment, a crystal is used as the circuit element (discrete component 2). This crystal lead terminal 4 is inserted into the lead insertion hole 3 of the substrate 1 from the side opposite to the surface on which the conductor pattern 5 is formed, and is soldered 6 to the terminal plate 11 that has been soldered 6 on the conductor pattern 5 in advance. A connection has been made.

As shown in FIG. 3, the terminal plate 11 has a hole 12 formed therein through which the lead terminal 4 of the discrete component 2 passes. It is attached by soldering 6.

For example, such a terminal board 11 has a thickness of 0 and an In+
It is preferable to use a piece of Cu with a thickness of about 100 yen (m) with a tin plate or the like, but of course it may also be made of metal such as soft iron or brass that can be soldered.

Further, the shape of the terminal plate 11 is not limited to the circular plate with holes 12 as shown in FIG.
As shown in the figure, the lead terminal 4 can be held even if the outer shape is square, triangular, or hexagonal, or even if the periphery of the hole 12 of the terminal plate 11 is partially cut out. That's fine.

As is clear from the above description, in the hybrid integrated circuit device of the present invention, when the discrete components are mounted on the hybrid integrated circuit board, the lead terminals of the discrete components are attached to the terminal board bonded by soldering or the like on the conductor pattern. Since the discrete components are connected and fixed by attaching them or the like, the discrete components are held on the hybrid integrated circuit board via the lead terminals, terminal plates, and conductor patterns, thereby improving the mounting strength. Therefore, even if an external force such as an impact is applied to the discrete component, the stress is dispersed by the terminal board and is not concentrated on a part of the conductor pattern, thereby preventing the pattern from peeling off. Furthermore, since the lead terminals of the discrete components are not directly bonded to the conductor patterns, the conductor patterns will not be peeled off or eaten away when replacing the discrete components.

[Effects of the Invention] As explained above, according to the present invention, the ease with which the conductor pattern comes off due to the attachment of the discrete component is improved, the mechanical strength of the connection portion of the lead terminal of the discrete component is increased, and vibration resistance is improved. Reliability in terms of durability, weather resistance, etc. is improved. Furthermore, discrete components can be easily replaced without peeling or eating away the conductive patterns.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a hybrid integrated circuit device according to an embodiment of the present invention, FIG. 2 is a perspective view of the main part of FIG. 1, and FIGS.
6 is a perspective view showing an example of a terminal board according to the present invention, FIG. 6 is a perspective view of a hybrid integrated circuit device, and FIG. 7 is a sectional view showing a conventional hybrid integrated circuit device. DESCRIPTION OF SYMBOLS 1... Hybrid integrated circuit board, 2... Discrete component, 3... Lead insertion hole, 4... Lead terminal, 5... Conductor pattern, 6... Soldering, 11... Terminal board

Claims (1)

[Claims] (1) A conductive pattern is formed around the lead insertion holes of the discrete components drilled in the hybrid integrated circuit board, a terminal board provided with the lead insertion holes of the discrete components is attached to the conductive pattern, and the lead insertion holes are attached to the terminal board. A hybrid integrated circuit device, wherein lead terminals of discrete components inserted from the opposite side of the hybrid integrated circuit board are electrically connected and fixed to the terminal board.