JPH0414207A - Compound component - Google Patents
Compound componentInfo
- Publication number
- JPH0414207A JPH0414207A JP2116597A JP11659790A JPH0414207A JP H0414207 A JPH0414207 A JP H0414207A JP 2116597 A JP2116597 A JP 2116597A JP 11659790 A JP11659790 A JP 11659790A JP H0414207 A JPH0414207 A JP H0414207A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic material
- ceramic
- sintered body
- composite
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000001875 compounds Chemical class 0.000 title abstract 2
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 52
- 239000011521 glass Substances 0.000 claims abstract description 23
- 239000000919 ceramic Substances 0.000 claims abstract description 16
- 239000011247 coating layer Substances 0.000 claims abstract description 16
- 239000002131 composite material Substances 0.000 claims description 44
- 238000010304 firing Methods 0.000 claims description 7
- 238000007747 plating Methods 0.000 abstract description 16
- 239000000463 material Substances 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000012466 permeate Substances 0.000 abstract 1
- 238000005304 joining Methods 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000005245 sintering Methods 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000006247 magnetic powder Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、例えばＬＣ複合部品のように異種のセラミッ
クス材を接合した構造を有する複合部品に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a composite component having a structure in which different types of ceramic materials are bonded together, such as an LC composite component.
電子部品の小型化、多機能化及び高性能化を果たすため
に、複数の電子部品素子を複合化した複合部品が普及し
てきている。この種の複合部品としては、誘電体セラミ
ックス材と磁性体セラミックス材とを一体化した構造を
有するＬＣ複合部品（特公昭６２−５７０４２号、実公
昭６３−３９９５８号等）や半導体セラミックス材と磁
性体セラミックス材とを貼り合わせたもの等種々のもの
が提案されている。2. Description of the Related Art In order to make electronic components smaller, more multifunctional, and higher in performance, composite components made by combining a plurality of electronic component elements are becoming popular. This type of composite parts include LC composite parts that have a structure in which dielectric ceramic material and magnetic ceramic material are integrated (Japanese Patent Publication No. 62-57042, Utility Model Publication No. 63-39958, etc.), semiconductor ceramic material and magnetic Various types of materials have been proposed, such as those in which the body is laminated with a ceramic material.
〔発明が解決しようとする技術的課題〕しかしながら、
上記のような複合部品では、異種のセラミックス材を接
合した構造を有するために、以下のような問題があった
。[Technical problem to be solved by the invention] However,
Since the composite parts described above have a structure in which different types of ceramic materials are bonded together, they have the following problems.
ｍＷ体セラミックス材単体であれば、成形及び焼成に際
し何ら問題が無い材料であっても、磁性体セラミックス
材と貼り合わせて一体焼成して得られた焼結体中に構成
された誘電体部分として評価すると、耐めっき性並びに
信転性（高温負荷時及び湿中負荷時等における信顧性）
に問題の生しることが多かった。Even if the mW ceramic material alone poses no problems when molded and fired, it can be used as a dielectric part in a sintered body obtained by bonding it with a magnetic ceramic material and firing it together. When evaluated, plating resistance and reliability (reliability under high temperature load, humid load, etc.)
This often caused problems.
これは、誘電体セラミックス材と磁性体セラミックス材
とを貼り合わせて一体焼成すると、焼成収縮率のような
各々の材料の焼結特性が異なることによるやすなわち、
焼結特性が異なるために、両材料の焼結が互いに阻害さ
れたり、焼結の進行が不足したり、相互拡散により組成
が変化したり、あるいは気孔の残留等が生じたりするた
めと考えられる。This is because when a dielectric ceramic material and a magnetic ceramic material are bonded together and fired together, the sintering characteristics of each material, such as the firing shrinkage rate, are different.
This is thought to be because the sintering properties of the two materials are different, resulting in mutual inhibition of sintering, insufficient sintering progress, composition changes due to mutual diffusion, or residual pores. .
上記のような問題は、誘電体セラミックス材と磁性体セ
ラミックス材とを貼り合わせて一体焼成した構造を有す
る複合部品だけでなく、他の複数種のセラミックス材を
貼り合わせてなる複合部品でも同様である。よって、上
記のような問題が生じ難い組合わせのセラミックス材を
選択することが必要であるが、一体焼成を行った後の耐
めっき性及び信頼性を満足する材料系は極めて少なく、
従って複合化の要望に応えることが非常に難しかった。The above problems occur not only in composite parts that have a structure in which dielectric ceramic materials and magnetic ceramic materials are laminated and fired as a single unit, but also in composite parts that are made by laminating multiple types of other ceramic materials. be. Therefore, it is necessary to select a combination of ceramic materials that will not cause the above problems, but there are very few material systems that satisfy the plating resistance and reliability after integral firing.
Therefore, it has been extremely difficult to meet the demand for compounding.
すなわち、従来の複合部品では、高性能化を図るために
異種のセラミックス材を接合して複合化したにも関わら
ず、逆に、複合化により耐めっき性や信頼性が低下する
という問題があった。In other words, although conventional composite parts are made by joining different types of ceramic materials to achieve higher performance, there is a problem in that the plating resistance and reliability deteriorate due to the composite parts. Ta.
本発明の目的は、異種のセラミックス材を接合した構造
を有する複合部品であって、耐めっき性及び信頼性に優
れたものを提供することにある。An object of the present invention is to provide a composite component having a structure in which different types of ceramic materials are bonded together, which has excellent plating resistance and reliability.
本発明は、少なくとも２種類のセラミックス材を一体焼
成により接合してなるセラミックス複合材と、セラミッ
クス複合材の外表面に形成されておりかつ外部との電気
的接続に用いられる外部電極とを備える複合部品であっ
て、下記の構成を備えることを特徴とする。The present invention provides a composite material comprising a ceramic composite material formed by joining at least two types of ceramic materials by integral firing, and an external electrode formed on the outer surface of the ceramic composite material and used for electrical connection with the outside. It is a part, and is characterized by having the following configuration.
すなわち、セラミックス複合材の外表面の外部電極が形
成されている領域を除いた残りの領域のうち、セラミッ
クス材同士の接合部分を少なくとも覆うようにガラスコ
ーティング層が設けられていることを特徴とする。That is, the glass coating layer is provided so as to cover at least the joints between the ceramic materials in the remaining area of the outer surface of the ceramic composite material excluding the area where the external electrodes are formed. .
異種のセラミックス材を接合する場合、グリーンシート
状態における積層面において、積層、圧着、カンティン
グあるいは焼成に際しクラ・ツクが発生し易い。また、
積層面には内部電極が形成されることが多く、この内部
電極は部品の外表面に形成された外部電極と電気的に接
続するために外部電極に連ねられていることが多い。従
って、この積層面においてめっき液が侵入したりあるい
は水分が侵入し易く、その結果、めっき液の侵入による
特性の劣化や水分の侵入による吸湿劣化が生じ易い。When joining different types of ceramic materials, cracks are likely to occur on the laminated surfaces in the green sheet state during lamination, crimping, canting, or firing. Also,
Internal electrodes are often formed on the laminated surface, and these internal electrodes are often connected to the external electrodes in order to electrically connect with the external electrodes formed on the outer surface of the component. Therefore, it is easy for plating solution or moisture to enter into this laminated surface, and as a result, deterioration of characteristics due to penetration of plating solution and hygroscopic deterioration due to penetration of moisture are likely to occur.
上記のように、複合部品における特性の劣化は、シート
の積層面すなわち異種のセラミックス材を接合した部分
において生じがちであることを考慮し、本発明は、セラ
ミックス複合材の外表面領域のうち、少なくともセラミ
ックス材同士の接合部分を覆うようにガラスコーティン
グ層を設け、それによって耐めっき性及び信頼性を改善
したことに特徴を有する。As mentioned above, in consideration of the fact that deterioration of properties in composite parts tends to occur at the laminated surface of the sheet, that is, at the part where different types of ceramic materials are joined, the present invention provides It is characterized in that a glass coating layer is provided so as to cover at least the bonded portion between the ceramic materials, thereby improving plating resistance and reliability.
第１図は、本発明の一実施例にかかる複合部品を示す斜
視図である０本実施例の複合部品１は、誘電体セラミッ
クス材２と磁性体セラミックス材３とを接合してなる焼
結体４を用いて構成されている。焼結体４の両端面には
、一対の外部電極５６が形成されており、焼結体４０両
側面中央領域にも外部電極７．７が形成されている。FIG. 1 is a perspective view showing a composite component according to an embodiment of the present invention.A composite component 1 of this embodiment is a sintered component made by joining a dielectric ceramic material 2 and a magnetic ceramic material 3. It is constructed using a body 4. A pair of external electrodes 56 are formed on both end faces of the sintered body 4, and external electrodes 7.7 are also formed in the central region of both sides of the sintered body 40.
本実施例の複合部品１の特徴は、焼結体４の側面領域に
おいて、外部電極７が形成されている部分を除いてガラ
スコーティング層８．９が設けられていることにある。A feature of the composite component 1 of this embodiment is that a glass coating layer 8.9 is provided on the side surface area of the sintered body 4 except for the area where the external electrode 7 is formed.
すなわち、焼結体４では、誘電体セラミックス材２と磁
性体セラミックス材３との接合部分が焼結体４の両側面
に露出しているが、この露出している部分を覆うように
、ガラスコーティングＮ８．９が設けられている。That is, in the sintered body 4, the joint portion between the dielectric ceramic material 2 and the magnetic ceramic material 3 is exposed on both sides of the sintered body 4, but a glass plate is placed so as to cover this exposed portion. Coating N8.9 is provided.
ガラスコーティング層８．９が設けられているため、焼
結体４にめっきを施す場合、めっき液が誘電体セラミッ
クス材２と磁性体セラミックス材３との接合面から内部
に侵入し難く、また湿度の高い雰囲気中に置かれても湿
気が該接合面から内部に侵入することが効果的に防止さ
れる。Since the glass coating layer 8.9 is provided, when plating the sintered body 4, it is difficult for the plating solution to enter the inside from the joint surface between the dielectric ceramic material 2 and the magnetic ceramic material 3, and it also prevents humidity. Even if it is placed in a high temperature atmosphere, moisture is effectively prevented from penetrating into the interior through the bonding surface.
次に、上記実施例の複合部品１の製造方法の−例を具体
的に説明することにより、上記実施例の構造をより詳し
く説明することにする。Next, the structure of the above embodiment will be explained in more detail by specifically explaining an example of a method for manufacturing the composite component 1 of the above embodiment.
まず、誘電体セラミックス材２を構成する材料として、
Ｐｂ系複合ペロブスカイト系材料であるＰｂＣＭｇ＋ｙ
ｚＮｂｔ／３）Ｏｚ ＰｂＴｉ０３Ｐ ｂ （Ｚ ｎ
１１２ Ｗ＋７２ ） Ｏｓ系粉末またはＰｂ（Ｎｉ
＋ｚｓ Ｎｂｚｙｓ ）Ｏｓ ＰｂＴｉＯｓ Ｐｂ
（Ｚ ｎ ｒ／ｌ Ｗｌ／２ ） Ｏｓ系粉末を用意ス
ル。他方、磁性体セラミックス材３を構成する材料とし
て、（ＮｉＯ−ＺｎＯ−Ｃｕｂ）Ｆｅｚ Ｏｓ粉末を用
意する。First, as a material constituting the dielectric ceramic material 2,
PbCMg+y, a Pb-based composite perovskite material
zNbt/3)Oz PbTi03P b (Z n
112W+72) Os-based powder or Pb(Ni
+zs Nbzys )Os PbTiOs Pb
(Z n r/l Wl/2) Prepare Os-based powder. On the other hand, (NiO-ZnO-Cub) Fez Os powder is prepared as a material constituting the magnetic ceramic material 3.
上記誘電体粉末及び磁性体粉末を、それぞれ、トルエン
及びエチルアルコールを容量比で１＝１の割合で混合し
てなる混合有機溶媒に分散させ、バインダとしてポリビ
ニルブチラール、可塑剤としてＤＯＰを加えて混合し、
それぞれのスラリーを得る。なお、ポリビニルブチラー
ルの混合量は、誘電体または磁性体粉末１００ｇあたり
６〜１２ｇであり、可塑剤の混合量は誘電体または磁性
体粉末１００ｇあたり１〜３ｇである。The above dielectric powder and magnetic powder are each dispersed in a mixed organic solvent made by mixing toluene and ethyl alcohol in a volume ratio of 1=1, and mixed with polyvinyl butyral as a binder and DOP as a plasticizer. death,
Obtain a slurry of each. The amount of polyvinyl butyral mixed is 6 to 12 g per 100 g of dielectric or magnetic powder, and the amount of plasticizer mixed is 1 to 3 g per 100 g of dielectric or magnetic powder.
上記のようにして得られた誘電体スラリー及び磁性体ス
ラリーを、それぞれ、ドクターブレード法により成形し
、シート状とする。次に、得られたシートを所定の寸法
の金型で打ち抜き、矩形状の誘電体セラミックグリーン
シート及び磁性体セラミックグリーンシートを得る。The dielectric slurry and magnetic slurry obtained as described above are each shaped into a sheet by a doctor blade method. Next, the obtained sheet is punched out using a die having a predetermined size to obtain a rectangular dielectric ceramic green sheet and a magnetic ceramic green sheet.
次に、第２図（ａ）〜（ｃ）に示すように、３枚の誘電
体セラミックグリーンシート１１〜１３を用意し、誘電
体セラミックグリーンシート１２゜１３の上面には、そ
れぞれ、容量取出しのための内部電極１４．１５を形成
するために導電ペーストを印刷する。Next, as shown in FIGS. 2(a) to 2(c), three dielectric ceramic green sheets 11 to 13 are prepared, and capacitance extraction is provided on the upper surface of the dielectric ceramic green sheets 12 and 13, respectively. Print conductive paste to form internal electrodes 14.15 for.
他方、第２図（ｄ）〜（ｆ）に示すように、３枚の磁性
体セラミックグリーンシート１６〜１８を用意し、グリ
ーンシート１７上に、インダクタンス取出し用の導電路
１９を形成するための２１１電ペーストを印刷する。On the other hand, as shown in FIGS. 2(d) to 2(f), three magnetic ceramic green sheets 16 to 18 are prepared, and a conductive path 19 for taking out the inductance is formed on the green sheet 17. Print the 211 electric paste.
次に、第２図（ａ）〜（ｆ）に示す誘電体セラミックグ
リーンシート１１〜１３及び磁性体セラミックグリーン
シート１６〜１８を積層し、１゜０トン／ ｃ４の圧力
をかけて厚み方向に圧着し、所定の大きさに切断して、
空気中１０００°Ｃの温度に１時間保持することにより
焼成し、第３図に示す焼結体４を得る。Next, the dielectric ceramic green sheets 11 to 13 and the magnetic ceramic green sheets 16 to 18 shown in FIGS. Crimp it, cut it to the specified size,
It is fired by holding it at a temperature of 1000° C. for 1 hour in air to obtain the sintered body 4 shown in FIG.
焼結体４では、焼成により、誘電体セラミックス材２と
磁性体セラミックス材３とが接合面４ａを介して接合さ
れている。In the sintered body 4, the dielectric ceramic material 2 and the magnetic ceramic material 3 are bonded via the bonding surface 4a by firing.
次に、第４図に示すように、焼結体４の両端面と側面中
央領域に導電ペーストを塗布し７５０°Ｃの温度に１分
間保持することにより、外部電極５〜７を形成する。Next, as shown in FIG. 4, external electrodes 5 to 7 are formed by applying a conductive paste to both end surfaces and the central region of the side surfaces of the sintered body 4 and maintaining the temperature at 750 DEG C. for 1 minute.
最後に、焼結体４の両側面に、硼珪亜鉛ガラスを含むガ
ラスフリット・ペーストを塗布し、７００°Ｃの温度に
１０分間保持することにより焼き付けて第１図に示され
ているガラスコーティング層８．９を形成する。Finally, a glass frit paste containing borosilicate zinc glass is applied to both sides of the sintered body 4 and baked by holding at a temperature of 700°C for 10 minutes to form the glass coating shown in FIG. Form layer 8.9.
上述のようにしてガラスコーティング層８，９が設けら
れた複合部品１では、誘電体セラミックス材２と磁性体
セラミックス材３との接合面がガラスコーティング層８
．９で覆われているため、耐めっき性及び信顧性が高め
られる。In the composite component 1 provided with the glass coating layers 8 and 9 as described above, the bonding surface between the dielectric ceramic material 2 and the magnetic ceramic material 3 is the glass coating layer 8.
．． 9, the plating resistance and reliability are improved.
本実施例のＬＣ複合部品ｌの場合には、外部電極５〜７
をＡｇ−Ｐｄで形成し、その上にＮｉめっきをした後に
おいても、誘電体部分の容量の変化率は±５％以内であ
り、８５°Ｃ１１０００時間及び１００■の負荷を与え
た後の絶縁抵抗（ＩＲ）の低下が１桁以下であり、ＩＲ
＞１０’Ωを維持していることが確かめられた。In the case of the LC composite component l of this embodiment, the external electrodes 5 to 7
Even after forming with Ag-Pd and plating Ni on it, the rate of change in capacitance of the dielectric part is within ±5%, and the insulation after 11,000 hours at 85°C and a load of 100μ The decrease in resistance (IR) is less than one digit, and the IR
It was confirmed that >10'Ω was maintained.
また、信顧性についても、７０°Ｃ５９５％ＲＨという
高湿度雰囲気中において、５０Ｖ負荷×５００時間経過
した後でさえ、容量変化率は±５％未満であり、ＩＲ＞
１０”Ωを維持していることが確かめられた。Regarding reliability, even after 50V load x 500 hours in a high humidity atmosphere of 70°C and 595%RH, the capacity change rate is less than ±5%, and IR>
It was confirmed that 10''Ω was maintained.
なお、上記実施例の複合部品１では、焼結体４の両側面
にガラスコーティング層８．９を設けたが、第５図に示
すように、焼結体４の外表面領域において外部電極５〜
７が形成されている領域以外の残りのすべての領域にガ
ラスコーティング層１０を形成してもよい。要するに、
少なくとも異なるセラミックス材同士が接合される面が
外表面領域に現れている部分を被覆するようにガラスコ
ーティング層が設けられれば、他の部分にガラスコーテ
ィング層を形成するか否かは任意である。In the composite component 1 of the above embodiment, the glass coating layers 8.9 were provided on both sides of the sintered body 4, but as shown in FIG. ~
The glass coating layer 10 may be formed in all the remaining areas other than the area where 7 is formed. in short,
As long as the glass coating layer is provided so as to cover at least the portion where the surfaces to which different ceramic materials are bonded appear in the outer surface region, it is optional whether or not the glass coating layer is formed on other portions.
また、上記実施例のＬＣ複合部品１では、ガラスコーテ
ィング層を形成するために、硼珪酸鉛系ガラスを用いた
が、ＬＣ複合部品では、硼珪酸鉛系ガラスが好適であり
、ガラス材の焼結体への拡散による特性の劣化はほとん
ど生じない。さらに、ガラスフリットのコーティング方
法については、上記実施例のペーストを塗布する方法に
限らず、ガラスフリット粉末を直接部品本体に付着させ
焼き付けてもよい。Further, in the LC composite component 1 of the above example, lead borosilicate glass was used to form the glass coating layer, but lead borosilicate glass is suitable for the LC composite component, and the sintering of the glass material There is almost no deterioration of characteristics due to diffusion into the solid body. Furthermore, the method of coating the glass frit is not limited to the method of applying the paste of the above embodiment, but may also be such that the glass frit powder is directly attached to the component body and baked.
なお、上記実施例では、誘電体セラミックス材２と磁性
体セラミックス材３とを積層してなる複合部品について
説明したが、他のセラミックス材、例えば半導体セラミ
ックス材と誘電体セラミックス材とを積層してなる複合
部品にも本発明を適用することができる。また、上記実
施例のように２種のセラミックス材を積層してなる複合
部品だけでなく、３種以上のセラミックス材を積層して
なる複合部品にも本発明を適用することができる。In addition, in the above embodiment, a composite component formed by laminating the dielectric ceramic material 2 and the magnetic ceramic material 3 was explained, but it may be made by laminating other ceramic materials, such as a semiconductor ceramic material and a dielectric ceramic material. The present invention can also be applied to composite parts. Further, the present invention can be applied not only to a composite part formed by laminating two types of ceramic materials as in the above embodiment, but also to a composite part formed by laminating three or more types of ceramic materials.
以上のように、本発明では、セラミックス複合材の外表
面に外部電極が形成されている領域を除いた残りの領域
のうち、セラミックス材同士の接合部分を少なくとも覆
うようにガラスコーティング層が設けられているため、
複合部品の耐めっき性及び信転性が高められる。従って
、高性能化を図るために異種のセラミックス材を接合し
てなる複合部品の特徴を活かした高性能かつ多機能の複
合部品であって、信転性に優れた部品を提供することが
可能となる。As described above, in the present invention, the glass coating layer is provided so as to cover at least the bonding portion between the ceramic materials in the remaining area excluding the area where the external electrode is formed on the outer surface of the ceramic composite material. Because
Plating resistance and reliability of composite parts are improved. Therefore, it is possible to provide high-performance, multi-functional composite parts that take advantage of the characteristics of composite parts made by joining different types of ceramic materials in order to improve performance, and that have excellent reliability. becomes.
第１図は本発明の一実施例にかかる複合部品を示す斜視
図、第２図（ａ）〜（ｆ）は、それぞれ、本発明の一実
施例の複合部品を得るのに用いられるグリーンシート及
びその上に形成される電極パターンの形状を説明するた
めの各平面図、第３図は本発明の一実施例において用意
される焼結体を示す斜視図、第４図は焼結体に外部電極
を形成した状態を示す斜視図、第５図は本発明の他の実
施例にかかる複合部品を示す斜視図である。
図において、１は複合部品、２は誘電体セラミックス材
、３は磁性体セラミックス材、４はセラミックス複合材
としての焼結体、５〜７は外部電極、８，９．１０はガ
ラスコーティング層を示す。FIG. 1 is a perspective view showing a composite component according to an embodiment of the present invention, and FIGS. 2(a) to (f) are green sheets used to obtain the composite component according to an embodiment of the present invention, respectively. 3 is a perspective view showing a sintered body prepared in an embodiment of the present invention, and FIG. 4 is a perspective view showing a sintered body prepared in an embodiment of the present invention. FIG. 5 is a perspective view showing a state in which external electrodes are formed, and FIG. 5 is a perspective view showing a composite component according to another embodiment of the present invention. In the figure, 1 is a composite component, 2 is a dielectric ceramic material, 3 is a magnetic ceramic material, 4 is a sintered body as a ceramic composite material, 5 to 7 are external electrodes, and 8, 9.10 are glass coating layers. show.
Claims (1)
て接合してなるセラミックス複合材と、前記セラミック
ス複合材の外表面に形成されており、かつ外部との電気
的接続に用いられる外部電極とを備える複合部品におい
て、 前記セラミックス複合材の外表面の前記外部電極が形成
されている領域を除いた残りの領域のうち、セラミック
ス材同士の接合部分を少なくとも覆うようにガラスコー
ティング層が設けられていることを特徴とする複合部品
。(1) A ceramic composite material made by integrally firing and bonding at least two types of ceramic materials, and an external electrode formed on the outer surface of the ceramic composite material and used for electrical connection with the outside. In the composite component provided, a glass coating layer is provided to cover at least a joint portion between the ceramic materials in the remaining area of the outer surface of the ceramic composite material excluding the area where the external electrode is formed. Composite parts characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2116597A JP2504281B2 (en) | 1990-05-02 | 1990-05-02 | Composite parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2116597A JP2504281B2 (en) | 1990-05-02 | 1990-05-02 | Composite parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0414207A true JPH0414207A (en) | 1992-01-20 |
| JP2504281B2 JP2504281B2 (en) | 1996-06-05 |
Family
ID=14691089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2116597A Expired - Lifetime JP2504281B2 (en) | 1990-05-02 | 1990-05-02 | Composite parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2504281B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019079949A (en) * | 2017-10-25 | 2019-05-23 | Tdk株式会社 | Electronic component |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01164012A (en) * | 1987-12-21 | 1989-06-28 | Tdk Corp | Structure of external terminal electrode of lamination application component |
| JPH0235432U (en) * | 1988-08-30 | 1990-03-07 |
-
1990
- 1990-05-02 JP JP2116597A patent/JP2504281B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01164012A (en) * | 1987-12-21 | 1989-06-28 | Tdk Corp | Structure of external terminal electrode of lamination application component |
| JPH0235432U (en) * | 1988-08-30 | 1990-03-07 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019079949A (en) * | 2017-10-25 | 2019-05-23 | Tdk株式会社 | Electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2504281B2 (en) | 1996-06-05 |
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