JPH04142795A - Multilayer wiring board - Google Patents

Abstract

PURPOSE:To reduce noises induced by an electromagnetic coupling between signal patterns to a minimum so as to enable a multilayer wiring board to transmit signals well by a method wherein a conductor is provided on both the sides of the signal patterns along the direction of the pattern. CONSTITUTION:A signal pattern 5 is arranged in a signal layer 3, the same ground layers 2 and 4 are provided adjacent to both the sides of the pattern 5 along the direction of the pattern 5, the same power supply layers 8 and 9 are provided, and conductors 7 are provided to connect the ground layers 2 and 4 together or the power supply layers 8 and 9 together. That is, the signal layer 3 is sandwiched between the ground layers 2 and 4 through the intermediary of an interlaminar insulating layer 1, and signal patterns 5 and 7 are provided to the signal layer 3. The conductors 7 connected to the ground layers 2 and 4 are provided on both the sides of the signal pattern 5. The conductors 7 are provided along the direction of the signal pattern 5.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a multilayer wiring board, and particularly to a multilayer wiring board applied to high-speed signal transmission.

[Conventional technology]

Conventionally, in this type of multilayer wiring board, a ground layer 12 and a power supply layer 18 are laminated above and below a signal layer 13 with an interlayer insulating layer 11 in between, as shown in a cross-sectional view in FIG. 2(a). There is. Further, as shown in a plan view in FIG. 2(b), the signal layer 13 has a large number of signal patterns 15 and 16, and in order to avoid noise due to mutual electromagnetic coupling, a GND pattern 17 is placed along the signal pattern 15. was established. The GND pattern 17 is connected to the ground layer 12 via a through hole 21, and the multilayer wiring board 20 also has a ground layer 14. A power supply layer 19 was provided.

[Problem to be solved by the invention]

The conventional multilayer wiring board mentioned above has a structure that avoids noise caused by electromagnetic coupling with other signal lines by simply placing a pattern connected to the ground along the signal line, so the effect of shielding this electromagnetic coupling is The disadvantage is that it is weak.

[Means to solve the problem]

The present invention provides a multilayer wiring board having a signal layer and the same ground layer or the same power layer layered above and below the signal layer with an interlayer insulating layer in between. At least one conductor is provided near both sides of the signal pattern along the pattern direction and connects the same ground layer or the same power layer provided above and below the signal layer.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1(a) is a sectional view of one embodiment of the present invention, FIG. 1(b)
) is a plan view of the signal layer in this example.

In this embodiment, a multilayer wiring board 10 has a signal layer 3 and the same ground layers 2 and 4 or the same power supply layers 8 and 9 which are laminated above and below the signal layer 3 with an interlayer insulating layer 1 in between. A signal pattern 5 arranged in the signal layer 3, and the same ground layer 2.4 or the same power supply layer 8.9 provided along the pattern direction near both sides of the signal pattern 5.
It has a plurality of conductors 7 that connect the conductors.

That is, the signal layer 3 is connected to the ground layer 2 through the interlayer insulating layer 1.
4, and this signal layer 3 is provided with the corresponding signal pattern 5 and other signal patterns 6. On both sides of the signal pattern 5 are a plurality of conductors 7 connected to the ground layers 2 and 4. As is clear from the plan view of the signal layer 3 shown in FIG. 1(b), the conductor 7 is provided along the pattern direction of the signal pattern 5.

According to this embodiment, the electromagnetic coupling between the signal patterns 5 and 6 is weakened by the plurality of conductors 7, and the signal pattern 5 can minimize noise from the signal pattern 6.

〔Effect of the invention〕

As described above, in the present invention, by providing conductors along the pattern direction on both sides of the signal pattern, electromagnetic coupling between the signal patterns can be extremely weakened, and a shielding effect can be obtained. Therefore, noise due to electromagnetic coupling between signal patterns can be minimized, and there is an effect that good signal transmission is possible.

[Brief explanation of drawings]

FIG. 1(a) is a sectional view of one embodiment of the present invention, FIG. 1(b)
) is a plan view of the signal layer in this embodiment, FIG. 2(a) is a cross-sectional view of an example of a multilayer wiring board according to the prior art, and FIG.
b) is a plan view of a signal layer in a conventional example. 1.11... interlayer insulating layer, 2, 4, 12.14...
Ground layer, 3.13...Signal layer, 5.6.15゜1
6...Signal pattern, 7...Conductor, 8,9,18°19...Power supply layer, 10.20...Multilayer wiring board, 1
7...GND pattern, 21...Through hole.

Claims (1)

[Claims] In a multilayer wiring board having a signal layer and the same ground layer or the same power layer layered above and below the signal layer via an interlayer insulating layer, a signal pattern arranged in the signal layer and a signal pattern of this signal pattern are provided. A multilayer wiring board, comprising: at least one conductor provided along the pattern direction near both sides and connecting the same ground layer or the same power supply layer provided above and below the signal layer.