JPH04146145A - Sample holder for screen printing and metallizing method employing sample holder - Google Patents
Sample holder for screen printing and metallizing method employing sample holderInfo
- Publication number
- JPH04146145A JPH04146145A JP27100190A JP27100190A JPH04146145A JP H04146145 A JPH04146145 A JP H04146145A JP 27100190 A JP27100190 A JP 27100190A JP 27100190 A JP27100190 A JP 27100190A JP H04146145 A JPH04146145 A JP H04146145A
- Authority
- JP
- Japan
- Prior art keywords
- sample holder
- face
- chip
- metallization
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007650 screen-printing Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title abstract description 13
- 238000001465 metallisation Methods 0.000 claims abstract description 31
- 239000011800 void material Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000010304 firing Methods 0.000 claims 1
- 238000004904 shortening Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 239000011195 cermet Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001000 nickel titanium Inorganic materials 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910017566 Cu-Mn Inorganic materials 0.000 description 1
- 229910017871 Cu—Mn Inorganic materials 0.000 description 1
- 229910017945 Cu—Ti Inorganic materials 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 235000015842 Hesperis Nutrition 0.000 description 1
- 235000012633 Iberis amara Nutrition 0.000 description 1
- 229910018651 Mn—Ni Inorganic materials 0.000 description 1
- -1 Ti-V-Mo Inorganic materials 0.000 description 1
- 229910003126 Zr–Ni Inorganic materials 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
Landscapes
- Screen Printers (AREA)
- Cutting Tools, Boring Holders, And Turrets (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、主として超硬合金、サーメット。[Detailed description of the invention] (Industrial application field) The present invention mainly relates to cemented carbide and cermet.
セラミックスの焼結体からなるチップの少なくとも２面
にメタライズ層を塗布するのに適したスクリーン印刷用
試料保持器及びそれを用いて行うメタライズ処理方法に
関する。The present invention relates to a screen printing sample holder suitable for applying a metallization layer to at least two surfaces of a chip made of a sintered ceramic body, and a metallization treatment method using the same.
（従来の技術）
超硬合金、サーメット、セラミックスの焼結体からなる
チップを鋼等に接合した複合材料が。(Prior technology) A composite material made by bonding a chip made of a sintered body of cemented carbide, cermet, or ceramic to steel, etc.
切削工具、耐摩工具、土木建設工具として用いられてい
る。この複”金材料の１つに、チップと鋼との間にメタ
ライズ層を介在させて接合したものがある。Used as cutting tools, wear-resistant tools, and civil engineering construction tools. One of these composite metal materials is one in which a chip and steel are bonded with a metallized layer interposed between them.
例えば、外壁材料、床材料、内装材料などの建築材料、
炉壁材料などの耐火材料、又は宇宙ロケットに用いられ
る断熱材料などを切断するためのチップソーは、超硬合
金、サーメット又はセラミックス製の小さいチップの２
面がメタライズ層を介在して円板状の鋼に接合されたも
のである。For example, building materials such as exterior wall materials, floor materials, interior materials,
Tipped saws are used to cut refractory materials such as furnace wall materials, or heat insulating materials used in space rockets.
The surface is joined to a disc-shaped steel via a metallized layer.
（発明が解決しようとする課題）
メタライズ層を介在した複合材料を例えばチップソーと
して実用した場合、メタライズ層の厚さが均一でないと
チップに加わる荷重が不均一になり、その結果チップの
欠損又は脱落が生じるという問題がある。(Problem to be Solved by the Invention) When a composite material with a metallized layer is used as a chip saw, for example, if the thickness of the metallized layer is not uniform, the load applied to the chip will be uneven, resulting in chipping or falling off. There is a problem that occurs.
また、特に小さいチップの表面にメタライズ層を均一に
形成させること、しかもチップの複数面へメタライズ層
を形成させること、その中でも隣接面へメタライズ層を
形成させることは、非常に困難であるという問題がある
。Another problem is that it is extremely difficult to uniformly form a metallized layer on the surface of a particularly small chip, and moreover, to form a metallized layer on multiple surfaces of a chip, especially on adjacent surfaces. There is.
本発明は、上述のような問題点を解決したもので、具体
的には、スクリーン印刷法を応用してチップの表面にメ
タライズ層を形成するために用いる治具及びその治具を
用いて行なうメタライズ処理方法を提供することを目的
とするものである。The present invention solves the above-mentioned problems, and specifically includes a jig used for forming a metallized layer on the surface of a chip by applying a screen printing method, and a jig used for forming a metallized layer on the surface of a chip. The purpose of this invention is to provide a metallization processing method.
（課題を解決するための手段）
本発明のスクリーン印刷用試料保持器は、多角形状又は
円形状の端面と外周面とでなる板状体の該端面に凹状に
形成された試料保持用の空隙部を複数個設けてなる試料
保持器であって、該端面に対する垂直断面からの該空隙
部における形状が該端面から該空隙部の底面に向って少
なくとも辺を傾斜状に形成してなる傾斜状面を該空隙部
に有することを特徴とするものである。(Means for Solving the Problems) The screen printing sample holder of the present invention has a sample holding cavity formed in a concave shape on the end surface of a plate-shaped body consisting of a polygonal or circular end surface and an outer peripheral surface. The sample holder is provided with a plurality of parts, and the shape of the cavity in a cross section perpendicular to the end face is an inclined shape in which at least one side is sloped from the end face toward the bottom of the cavity. The cavity is characterized by having a surface in the cavity.
このスクリーン印刷用試料保持器の例は、第１図に示し
たように、端面（２）と外周面（３） とでなる角状の
板状体でなる保持器（１）の端面（２）に凹状の空隙部
（４）を複数個設けたもので、保持器（１１の形状は、
特に制限を受けるものでなく、作業性、能率性などを考
慮して決めればよく、この保持器＋１１の端面（２）に
設ける空隙部（４）の形状は、メタライズ層を形成しよ
うとするチップの形状及びメタライズ層厚さに従って決
定される。この空隙部（４）の例は、端面（２）に対す
る垂直断面からの断面図として示した第２図のように、
端面（２）から底面（５）に向って傾斜状に形成した傾
斜状面（６）を設けたもので、この傾斜状面（５）の傾
斜角は、メタライズ処理時に用いるメタライズの粘性な
どで考慮する必要があるが、メタライズの粘度及び作業
性でカバーできることから特に制限を受けるものではな
く、この空隙部（４）の底面（５）からもう一方の端面
である裏面（７）に貫通した貫通孔（８）を設けておく
と、メタライズ処理時に貫通孔（８）を通して減圧吸引
力でチップを保持した状態にして保持器の移動を行うこ
と、又は保持器からのチップの離脱などが容易に行うこ
とができるので好ましいことである。An example of this sample holder for screen printing is, as shown in Fig. 1, an end face (2) of the holder (1), which is made up of an angular plate-like body consisting of an end face (2) and an outer circumferential face (3). ) is provided with a plurality of concave voids (4), and the shape of the cage (11) is as follows:
There are no particular restrictions, and it may be determined by considering workability, efficiency, etc. The shape of the cavity (4) provided on the end face (2) of this cage is determined according to the shape and metallization layer thickness. An example of this cavity (4) is as shown in FIG.
It is provided with an inclined surface (6) formed in an inclined shape from the end surface (2) toward the bottom surface (5), and the inclination angle of this inclined surface (5) is determined by the viscosity of the metallization used during metallization processing. Although it is necessary to take this into consideration, there is no particular restriction as it can be covered by the viscosity and workability of the metallization. By providing the through-hole (8), it is easy to move the retainer while holding the chip by vacuum suction through the through-hole (8) during metallization processing, or to easily remove the chip from the retainer. This is preferable because it can be done in a number of ways.
このスクリーン印刷用試料保持器をも用いて行う本発明
のメタライズ処理方法は、
（イ）上述のスクリーン印刷用試料保持器の空隙部にチ
ップを配列させる工程、
（ワ）チップの配列された試料保持器の端面にメタライ
ズの厚さを制御するための制御板を重ね合わせる工程、
（ハ）該制御板の上からペースト状メタライズを塗布し
、試料保持器の空隙部に設けた傾斜状面にもペースト状
メタライズを浸入させ、空隙部に配列したチップの少な
くとも２面に同時にメタライズを塗布する工程。The metallization processing method of the present invention using this screen printing sample holder also includes: (a) arranging chips in the voids of the above-mentioned screen printing sample holder; (b) sample with the chips arranged; A step of superimposing a control plate for controlling the thickness of metallization on the end face of the holder; (c) Applying paste-like metallization from above the control plate and applying it to the inclined surface provided in the cavity of the sample holder. A process of infiltrating paste-like metallization and simultaneously applying the metallization to at least two surfaces of the chips arranged in the gaps.
（副メタライズの塗布されたチップを空隙部に設けた状
態のまま、試料保持器を乾燥する工程、
（本）乾燥したチップを加熱焼成する工程、かならる方
法である。(The process of drying the sample holder while the chip coated with the sub-metalization is placed in the cavity; (Main) The process of heating and baking the dried chip.
このメタライズ処理方法において用いる制御板は、保持
器の端面と同形状に合わせておくのが好ましく、この制
御板の厚さは２チツプの表面に塗布しようとするメタラ
イズ層の厚さに合わせて形成する必要がある。また、制
御板には、保持器の空隙部と合致する開孔部を設けてお
く必要があるが、その大きさはチップの他面に塗布しよ
うとするメタライズ層の厚さを考慮した状態にしておく
必要があること、その数は保持器の空隙部と一致させて
おくことが好ましいことである。保持器の空隙部にチッ
プを設置して、この空隙部に制御板の開孔部を合致させ
た状態の例は、第３図に示したように、保持器（１）に
設けられた空隙部（４）にチップ（ｌＯ）を配置し、こ
の空隙部（４）に制御板（９）に設けた開孔部（１１）
を合致させる。特に、チップの２面を一度にメタライズ
させる場合におけるチップ表面のメタライズ層の厚さ制
御は、制御板の厚さ調整の他に、開孔部（Ｉｌｌとチッ
プ（１０）と空隙部（４）との位置関係が重要になる。It is preferable that the control plate used in this metallization treatment method has the same shape as the end face of the cage, and the thickness of this control plate is formed to match the thickness of the metallization layer to be applied to the surface of the two chips. There is a need to. In addition, it is necessary to provide an opening in the control plate that matches the cavity in the cage, but the size of the opening should be determined in consideration of the thickness of the metallized layer to be applied to the other side of the chip. The number of holes should preferably match the number of gaps in the cage. An example of a state in which the chip is installed in the cavity of the cage and the opening of the control plate is aligned with this cavity is shown in Fig. 3. A chip (lO) is placed in the part (4), and an opening (11) provided in the control plate (9) is placed in this gap (4).
Match. In particular, when metalizing two sides of a chip at once, the thickness of the metallized layer on the chip surface can be controlled in addition to adjusting the thickness of the control plate. The positional relationship with is important.
すなわち、制御板（９）とチップ（ｌＯ）との隙間から
メタライズが侵入して空隙部（４）の傾斜状面（６）に
残存し、その結果第４図に例示したようなチップ（１０
）の表面にメタライズ層（１２）が形成されたメタライ
ズ層付きチップが得られる。That is, the metallization penetrates through the gap between the control plate (9) and the chip (lO) and remains on the inclined surface (6) of the cavity (4), and as a result, the chip (lO) as illustrated in FIG.
) A chip with a metallized layer is obtained, in which a metallized layer (12) is formed on the surface of the metallized layer (12).
このときのチップ及びメタライズ層は、特に制限を受け
るものではないが、例えば、チップは超硬合金、サーメ
ット、セラミックスなど、メタライズ層はＡｇ−Ｔｉ、
Ａｇ−Ｃｕ−Ｔｉ、＾ｇ−Ｃｕ−Ｉｎ−Ｔｉ、 Ａｇ
−Ｎｉ−Ｔｉ、 Ｃｕ−Ｉｎ−Ｔｉ、 Ｃｕ−Ａｌ２−
Ｔｉ、 Ｎｉ−Ｔｉ、Ｔｉ−Ｖ−Ａｆｉ。The chip and metallized layer at this time are not particularly limited, but for example, the chip may be made of cemented carbide, cermet, ceramics, etc., the metallized layer may be made of Ag-Ti,
Ag-Cu-Ti, ^g-Cu-In-Ti, Ag
-Ni-Ti, Cu-In-Ti, Cu-Al2-
Ti, Ni-Ti, Ti-V-Afi.
Ｔｉ−Ｖ−Ｃｒ、Ｔｉ−Ｖ−Ｎｂ、 Ｔｉ−Ｖ−Ｍｏ、
Ｚｒ−Ｎｉ、 Ｚｒ−Ｆｅ、 Ａｌ２Ｓｉ、 Ａｌ
−Ｃｕ、 Ｃｕ−Ｍｎ、 Ｍｏ−Ｍｎ−Ｎｉなどを挙
げることができる。Ti-V-Cr, Ti-V-Nb, Ti-V-Mo,
Zr-Ni, Zr-Fe, Al2Si, Al
-Cu, Cu-Mn, Mo-Mn-Ni, etc. can be mentioned.
（作用）
本発明のスクリーン印刷用試料保持器は、空隙部に設け
た傾斜状面によりチップの複数面、特に隣接面を含めた
２面へのメタライズが１度塗りで行うことができること
、空隙部に設けた貫通孔からの減圧吸引又は大気圧状態
への切換えにより、多数のチップを保持させた状態の保
持器を移動させること及び保持器からのチップ離脱が短
時間で簡単に、かつ容易に行うことができる。(Function) The sample holder for screen printing of the present invention has the following features: metallization on multiple surfaces of the chip, especially two surfaces including the adjacent surfaces, can be performed in one coat due to the inclined surface provided in the void; By suctioning reduced pressure through the through-hole provided in the section or switching to atmospheric pressure, the holder holding a large number of chips can be moved and the chips can be easily removed from the holder in a short time. can be done.
また、この保持器を用いて行う本発明のメタライズ処理
方法は、制御板の厚さを調整することによりメタライズ
層の厚さのコントロールが容易に行うことができること
、この制御板の形状及び大きさを保持器の端面に合致さ
せて、かつ制御板の開孔部と保持器の空隙部を合致させ
ることにより、チップの少なくとも２面へメタライズ層
を形成することが容易に、かつ量産的にできるものであ
る。In addition, the metallization treatment method of the present invention using this cage is characterized in that the thickness of the metallization layer can be easily controlled by adjusting the thickness of the control plate, and that the shape and size of the control plate can be easily controlled. By matching the end face of the holder with the opening of the control plate and the cavity of the holder, it is possible to easily form a metallized layer on at least two sides of the chip and in mass production. It is something.
（実施例）
実施例１
ＳｉＪ４− Ａ氾Ｎ−Ｙ２Ｏ１組成成分の市販５ｉＪａ
基セラミックス焼結体チップ（形状２．ＯＸ２．４ Ｘ
６．Ｏｎ＋ｍ）を第１図に示した板状体の保持器（１）
の空隙部（４）に設置し、この保持器（１）の端面（２
）の側に制御板（９）を合わせて第３図に示した状態に
した。次いで、スクリーン印刷機を用いて、７０ｗｔ％
Ａｇ −２６ｗｔ％Ｃｕ −４ｗｔ％Ｔｉ組成の金属粉
末とエチルセルロースとテレピネオールとを混練したペ
ースト状混合物を制御板の上からチップの２面に一度で
塗布した。次に、乾燥した後、保持器からチップを取り
出して、Ｉｎ−’Ｔｏｒｒの真空中、９００℃−５分間
保持及び冷却処理でもって、チップの表面にメタライズ
層を形成した。(Example) Example 1 Commercially available 5iJa of SiJ4-A flood N-Y2O1 composition component
Base ceramic sintered chip (shape 2.OX2.4
6. On+m) is shown in Figure 1 as a plate-shaped cage (1).
The end face (2) of this cage (1) is installed in the cavity (4) of the cage (1).
) and the control plate (9) was placed on the side shown in FIG. 3. Then, using a screen printing machine, 70 wt%
A paste-like mixture obtained by kneading a metal powder having a composition of Ag-26wt%Cu-4wt%Ti, ethyl cellulose, and terpineol was applied at once to two sides of the chip from above the control plate. Next, after drying, the chip was taken out from the holder, held at 900° C. for 5 minutes in an In-'Torr vacuum, and cooled to form a metallized layer on the surface of the chip.
こうして得たメタライズ層付チップを円板状の鋼製本体
ＴＳＫ５）に設置し、Ａｇ−Ｃｕロー材による差しロー
及びフラックスを用いて高周波ロー付法でもって接合し
、２８枚刃付チップソーを作製した。The chips with the metallized layer obtained in this way were installed in a disc-shaped steel main body TSK5) and joined by high-frequency brazing using Ag-Cu brazing material and flux to produce a 28-blade chip saw. did.
比較として、上記と同一チップ及び同一混合物を用いて
、チップの一面に塗布後、さらに隣接面に塗布するとい
う二度処理し、他は上記と同様にして２８枚刃付チップ
ソーを作製した。For comparison, a 28-blade tipped saw was fabricated using the same tip and the same mixture as above, applying the coating to one side of the tip and then applying it to the adjacent side, but otherwise in the same manner as above.
こうして得た本発明の保持器及びそれを用いたメタライ
ズ処理方法によるチップソーと比較のチツブソーのそれ
ぞれについて、そのロー付時によるチップへのクラック
の発生状態及びグラスファイバー入りセメントの切断に
よる実用試験を行った結果、本発明はの保持器及びこの
保持器を用いてメタライズ処理したときの処理時間は、
従来のように一面塗布後また一面塗布したものに比べて
、約４３％の時間を短縮できたにもかかわらず。Practical tests were conducted on the cage of the present invention obtained in this way, the chip saw produced by the metallization treatment method using the same, and the comparative chip saw, examining the occurrence of cracks in the chip during brazing and cutting of cement containing glass fiber. As a result, the cage of the present invention and the processing time when metallizing using this cage are as follows:
This was despite the fact that the time was reduced by about 43% compared to the conventional method of applying one coat and then another coat.
チップへのクラックの発生状態及び実用試験時における
寿命は殆んど同等であった。The state of crack occurrence in the chips and the lifespan during the practical test were almost the same.
（発明の効果）
本発明のスクリーン印刷用試料保持器は、チップの複数
面を一度で塗布できること、この結果メタライズ処理時
間が短縮できること、メタライズ層厚さが均一でバラツ
キが少なくなるという効果がある。(Effects of the Invention) The sample holder for screen printing of the present invention has the following effects: multiple sides of a chip can be coated at once, metallization processing time can be shortened, and metallization layer thickness is uniform and variation is reduced. .
また、本発明のメタライズ処理方法は、多量のチップの
処理が短時間で行うことができること５さらに連続化処
理もできるものである。Further, the metallization processing method of the present invention can process a large number of chips in a short time5 and can also perform continuous processing.
第１図は、本発明の保持器を例示した斜視図、第２図は
、本発明の保持器の空隙部における端面に対する垂直断
面図、第３図は、本発明の保持器にチップと制御板を配
置した状態の空隙部における端面に対する垂直断面図、
第４図は、本発明のメタライズ処理方法でもって処理し
たメタライズ層付チップの断面図を示す。
図中、ｌ：保持器、２：端面、３：外周面、４：空隙部
、５：底面、６：傾斜状面、７：裏面、８：貫通穴、９
：制御板、１０：チップ、１１：開孔部、１２：メタラ
イズ層
特許出願人 東芝タンガロイ株式会社
図
第２図FIG. 1 is a perspective view illustrating the cage of the present invention, FIG. 2 is a vertical sectional view of the cage of the present invention with respect to an end face in the cavity, and FIG. 3 is a cage of the present invention with a chip and a control. A vertical cross-sectional view of the end face of the cavity with the plate placed therein;
FIG. 4 shows a cross-sectional view of a chip with a metallized layer treated by the metallized treatment method of the present invention. In the figure, l: cage, 2: end surface, 3: outer peripheral surface, 4: void, 5: bottom surface, 6: inclined surface, 7: back surface, 8: through hole, 9
: Control board, 10: Chip, 11: Opening part, 12: Metallized layer Patent applicant: Toshiba Tungaloy Corporation Figure 2
Claims (3)
体の該端面に凹状に形成された試料保持用の空隙部を複
数個設けてなる試料保持器であって、 該端面に対する垂直断面からの該空隙部における形状が
該端面から該空隙部の底面に向って少なくとも一辺を傾
斜状に形成してなる傾斜状面を該空隙部に有することを
特徴とするスクリーン印刷用試料保持器。(1) A sample holder comprising a plate-shaped body having a polygonal or circular end face and an outer circumferential surface, and a plurality of recessed sample holding cavities formed in the end face of the plate, wherein A sample holder for screen printing, characterized in that the cavity has an inclined surface in which the shape of the cavity seen from a vertical cross section is such that at least one side is sloped from the end face toward the bottom of the cavity. vessel.
成された端面からもう一方の端面である裏面へ貫通孔が
形成されていることを特徴とする特許請求の範囲第１項
記載のスクリーン印刷用試料保持器。(2) The void portion has a through hole formed from the bottom surface of the void portion to the back surface, which is the other end surface, from the end surface where the void portion is formed. Specimen holder for screen printing as described.
る板体の該端面に凹状に形成された試料保持用の空隙部
を複数個設けてなる試料保持器の該空隙部にチップを配
列させる工程、 （ロ）チップの配列された該試料保持器の端面に、該チ
ップの少なくとも一面に塗布するメタライズの厚さを制
御するための制御板を重ね合わせる工程、 （ハ）該制御板の上からペースト状メタライズを塗布し
、該試料保持器の端面に対する垂直断面からの該空隙部
の形状が該端面から該空隙部の底面に向って少なくとも
一辺が傾斜状になっている傾斜状面にもペースト状メタ
ライズを浸入させ、該空隙部に配列したチップの少なく
とも２面に同時にメタライズを塗布する工程、 （ニ）メタライズの塗布されたチップを該空隙部に設け
てなる試料保持器を乾燥する工程、 （ホ）乾燥したチップを加熱焼成する工程、かならるこ
とを特徴とするメタライズ処理方法。(3) (a) A sample holder is provided with a plurality of concave sample holding gaps in the end face of a plate consisting of a polygonal or circular end face and an outer peripheral surface. a step of arranging the chips; (b) a step of superposing a control plate for controlling the thickness of metallization applied to at least one surface of the chips on the end surface of the sample holder where the chips are arranged; Paste-like metallization is applied from above the control plate, and the shape of the cavity when viewed from a cross section perpendicular to the end face of the sample holder is such that at least one side is sloped from the end face toward the bottom of the cavity. a step of simultaneously infiltrating paste-like metallization into the shaped surfaces and simultaneously applying the metallization to at least two surfaces of the chips arranged in the gap; (d) a sample holder comprising chips coated with metallization provided in the gap; (e) a step of heating and firing the dried chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27100190A JP2948297B2 (en) | 1990-10-09 | 1990-10-09 | Screen printing sample holder and metallizing method using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27100190A JP2948297B2 (en) | 1990-10-09 | 1990-10-09 | Screen printing sample holder and metallizing method using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04146145A true JPH04146145A (en) | 1992-05-20 |
| JP2948297B2 JP2948297B2 (en) | 1999-09-13 |
Family
ID=17494028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27100190A Expired - Fee Related JP2948297B2 (en) | 1990-10-09 | 1990-10-09 | Screen printing sample holder and metallizing method using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2948297B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103552366A (en) * | 2013-11-08 | 2014-02-05 | 中国兵器工业集团第二一四研究所苏州研发中心 | Four-chip synchronous side printing device and method for small-sized LTCC (low temperature co-fired ceramic) chip circuit |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108453473B (en) * | 2018-03-16 | 2020-10-09 | 昆山市杰尔电子科技股份有限公司 | Environment-friendly forming process of liquid crystal display cover |
-
1990
- 1990-10-09 JP JP27100190A patent/JP2948297B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103552366A (en) * | 2013-11-08 | 2014-02-05 | 中国兵器工业集团第二一四研究所苏州研发中心 | Four-chip synchronous side printing device and method for small-sized LTCC (low temperature co-fired ceramic) chip circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2948297B2 (en) | 1999-09-13 |
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