JPH0414896A - Air-cooling device of electronic equipment enclosure - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is applied to electronic equipment housings, particularly large electronic equipment housings in which a plurality of storage units are disposed inside the housing rack, so that individual The present invention relates to an improvement in an air cooling device that cools the temperature rise of each storage unit by introducing outside air.

BACKGROUND OF THE INVENTION FIG. 4 is a cross-sectional configuration diagram schematically showing an outline of a large electronic device housing equipped with a conventional air cooling device of this type.

In the conventional configuration shown in FIG. 4, reference numeral 1 denotes a large electronic device case, and here, from the lower side to the upper side in the internal space la, there are a plurality of individual cases for housing electronic device modules, etc. This is a so-called housing rack in which storage units 2, 3, and 4 are arranged respectively. Therefore, in this case rack l, each of the storage units 2.3.4
The air intake ports 5.6.7 are opened at the lower side of the front surface of each of the air intake ports 5.6.
7 includes convection guiding plates 8, 9.7 which also serve as shielding plates for introducing external air into each housing unit 2, 3.4.
10, and the back side is closed by a back panel 11, and an intake port 12 for promoting convection of internal air is provided on the bottom side, and an exhaust port 13 is provided on the top side for discharging the internal air whose temperature has increased. It is formed as appropriate.

Next, the operation of the air cooling device having the above conventional configuration will be described.

When the temperature in the internal space IO of the housing rack 1 rises due to the operation of the electronic equipment modules in each storage unit 2, 3.4, a temperature difference occurs between the outside air temperature and the pressure difference. The convective air a caused by the intake of outside air from the intake port 12 on the bottom side of the housing and the convective air a from the exhaust port 13 on the top side of the case are exhausted, and this convection action causes each storage unit 2 , 3.4, and external air C is sucked in from each air intake port 5, 6.7.
Further, the external air C is drawn into the interior of each storage unit 2.3.4 through the respective convection guide plates 8, 9.10, and the desired air cooling effect is achieved.

In other words, in this way, according to the conventional configuration, the internal space 1a in the housing rack l, and furthermore, each storage unit 2,
3.4 The electronic equipment modules etc. that are housed inside the
Air cooling can be achieved by introducing outside air.

Problems to be Solved by the Invention However, the conventional air cooling device for an electronic device case configured as described above has the following problems.

That is, in the configuration shown in FIG. 4, for example, if the temperature rise of each of the storage units 3 and 4 located on the upper side is greater than that of the storage unit 2 on the lowermost stage, it is natural that these As the pressure inside each storage unit 3.4 on the upper side increases, the pressure inside each storage unit 2.4 on the lower side increases. Furthermore, since the pressure on the lower side of the rack internal space 1a where the storage unit 2 exists is still low,
From inside each storage unit 3.4, a flow d of high temperature air is generated which is opposite to the flow of convective air a which is directed upward, which is the original convection effect, and this flow d of high temperature air is This obstructs the intended air cooling effect and has an unfavorable effect on air cooling efficiency.

The present invention is an attempt to solve these conventional problems, and is intended to deal with the temperature difference that occurs between each of the upper and lower storage units arranged in the housing rack. By introducing the required amount of outside air and making sure that the pressure difference induced by the rise in temperature always acts normally, it is possible to efficiently realize the air cooling effect for each storage unit. The object of the present invention is to provide an air cooling device for an electronic device housing of this type.

Means for Solving the Problems In order to achieve the above-mentioned object, the present invention provides for adjusting the temperature of the outside air introduced from the corresponding air intake port to correspond to the temperature of each individual storage unit arranged in the housing rack. It is equipped with outside air introduction control means for adjusting the amount of introduced air.

Effects Therefore, according to the present invention, the following effects can be achieved by constructing as described above.

In other words, the amount of outside air introduced from the corresponding air intake port can be adjusted by the outside air introduction control means in accordance with the internal temperature of each individual housing unit within the housing rack. The pressure difference induced within the housing rack as the temperature rises in each housing unit can always be maintained normally, and the air convection inside the housing rack is stabilized, allowing each housing unit to operate normally. This provides efficient air cooling for the unit.

Embodiment FIG. 1 is a partially exploded configuration explanatory diagram showing an outline of an electronic device housing to which an air cooling device according to a first embodiment of the present invention is applied, and FIG. FIG. 2 is a cross-sectional configuration diagram schematically showing the outline of the container housing.

Even in the configuration of the first embodiment shown in FIGS. 1 and 2, the internal space 1O of the housing rack 1 has space for storing electronic equipment modules, etc., from the lower side to the upper side. A plurality of storage units 2, 3.4 are respectively arranged. At the lower front side of each of these individual storage units 2.3.4, the air intake ports 5, 6.7 are opened respectively, and the air intake ports 5, 6.7 are opened. is provided with a convection guiding plate 8゜9, 10 which also serves as a shielding plate for introducing outside air into each storage unit 2.3.4, the back side is closed by the back panel 11, and the bottom side is closed. An intake port 12 for promoting convection of internal air, and an exhaust port 13 for discharging the internal air whose temperature has increased are formed on the upper surface side as appropriate.

In addition, for each of the storage units 2.3.4, especially for each storage unit 3.4 on the upper tier side excluding the bottom storage unit 2, each of the electronic devices stored inside Based on the operation of equipment modules, etc., each housing unit 3.
4 is provided with a temperature sensor 14.15 that detects and outputs when the internal temperature has risen above a predetermined set value, and each air intake port 6.4 corresponding to each of these storage units 3.4 is attached. Each part of the temperature sensor 14.7 has a respective temperature sensor 14.
Ventilation fans 16 and 17 for taking in outside air are provided whose operation is controlled by the detection output of 15.

That is, in the case of this first embodiment, each temperature sensor 14.15 detects the internal temperature of each storage unit 3.4, and the operation is controlled by each of these temperature sensors 14.15. Each ventilation fan 16.1
7 constitutes the outside air introduction control means here.

In addition, in the case of this first embodiment, the lowermost storage unit 2
The air intake port 5 is kept open without installing a ventilation fan, but this is because the storage unit 2 is located at the bottom, and as will be described later, the air intake port 5 is kept open. This is because the air cooling effect by convection is performed relatively smoothly, and if necessary, a ventilation fan may be provided in the same manner.

Next, the operation of the air cooling device according to the configuration of the first embodiment will be described.

Also in the configuration of the first embodiment, in a normal case, first, as the electronic device module in each housing unit 2.3.4 operates, the internal temperature of each housing unit 2, 3.4, and even , When the temperature in the internal space la of the housing rack l starts to rise, a temperature difference occurs between it and the outside air temperature, creating a pressure difference, and the air inlet 5 and Convection air a due to the intake of outside air from each of the intake ports 12 on the bottom side of the casing, and the exhaust ports 13 on the top side of the case.
The effect of exhausting the convective air a from
In the lowermost storage unit 2, its air intake port 5
Air cooling is achieved by the intake of external air C through the spider convection guide plate 8, and due to the convection effect thus generated, a pressure difference is also created inside each storage unit 3.4 on the upper stage side. occurs, and external air C is similarly sucked in from the respective air intake ports 6 and 7, and the respective convection guide plates 9. Since it is drawn into the interior via 1O, the air cooling effect of each storage unit 2.3.4 during the initial temperature rise here is achieved.

Then, despite the air cooling effect at the time of the initial temperature rise, when the internal temperature of each of these storage units 2.3.4 further increases and reaches a predetermined set value or higher, the storage units 2.3.4 are located on the upper side. In each storage unit 3.4, each temperature sensor 14.15 provided correspondingly detects an increase in the internal temperature above a set value, and each temperature sensor 14.
．． Based on the detection output from 15, each corresponding air intake port 6
By controlling the operation of each ventilation fan 16.17 installed in each of the air intake ports 6.7, and forcibly taking in a required amount of external air C adjusted in accordance with the temperature rise from each air intake port 6.7, the pressure is reduced. The difference is made to function normally, and the desired air cooling effect is obtained in each of these storage units 3.4. Based on the pressure difference that has returned to normal, the bottom storage unit 2 is also cooled in place. The desired air cooling effect can be obtained.

In other words, in the configuration of the first embodiment, as described above, the internal space 1a of the housing rack 1, and furthermore, the electronic equipment modules etc. that are housed inside each housing unit 2.3.4 are In the normal temperature rise range, by natural introduction of outside air based on convection, and in the temperature rise range exceeding a predetermined set value, by forced introduction of outside air adjusted to correspond to the temperature, Each ventilation fan 16, 17 can provide air cooling that avoids excessive cooling, and in order to prevent excessive air cooling from being forced into the outside air by each ventilation fan 16, 17, it can be adjusted to account for the temperature rise. There is no risk of generating noise.

Next, the third section is a cross-sectional configuration diagram schematically showing an outline of a large electronic device housing equipped with an air cooling device according to a second embodiment of the present invention.

In the configuration of the second embodiment shown in FIG. 3, each temperature sensor 1 serves as the outside air introduction control means in the configuration of the first embodiment.
4, 15 and each ventilation fan 16, 17, each corresponding air intake port 6, 7 in each storage unit 3, 4 concerned
Each of these storage units 3.4 is provided with an opening/closing plate 18.19 made of a shape memory alloy, which is directly controlled by the internal temperature of each storage unit 3.4.

Therefore, in the case of the configuration of this second embodiment, the opening/closing plate 18
．． 19 corresponds to the internal temperature of each storage unit 3, 4, and as the internal temperature rises, each air intake port 6, 7 is opened.
Opening/closing is controlled to increase the aperture ratio of each air intake port 6.7, and in a temperature rise range exceeding a predetermined set value, the aperture ratio of each air intake port 6.7 is automatically adjusted and changed to respond to the temperature rise. The required amount of external air C is naturally taken in, and the pressure difference is normally applied in the same way as in the configuration of the first embodiment, and the same functions and effects can be obtained here as well.

Effects of the Invention As is clear from the configurations of the above-mentioned embodiments, the present invention allows the outside air introduced from the corresponding air intake port to be adjusted in accordance with the internal temperature of each individual housing unit within the housing rack. Since the amount of introduced air can be adjusted by the outside air introduction control means, the pressure difference induced in the housing rack as the temperature of each of these storage units increases can always be maintained normally. As a result, air convection based on the temperature rise inside the enclosure rack is well stabilized,
It provides efficient and substantial air cooling to each storage unit while avoiding overcooling, and is also relatively simple in structure and easy to implement. It has its features.

[Brief explanation of drawings]

FIG. 1 is a partially exploded configuration explanatory diagram showing an overview of an electronic device casing to which an air cooling device according to a first embodiment of the present invention is applied, and FIG. 2 is an overview of a large electronic device casing equipped with the same air cooling device. FIG. 3 is a cross-sectional diagram schematically showing the outline of a large electronic device housing equipped with an air cooling device according to a second embodiment of the present invention, and FIG. 4 is a diagram schematically showing an air cooling device according to a conventional example. FIG. 1 is a cross-sectional configuration diagram schematically showing an outline of a large electronic device housing including a device. 1... Housing rack, la... Internal space of housing rack, 2, 3.4... Storage unit, 5.6.7... Air intake port, 8°9, lO...・Convection guide plate, 11...
Back panel, 12...Intake port, 13...Exhaust port, 1
4.15...Temperature sensor, 16.17...Ventilation fan, 18.19...Opening/closing plate 111 made of shape memory alloy
Illustration agent Patent attorney Shigetaka Awano Figure 1 Figure 12 Diagram of throat and mouth

Claims (1)

[Claims] In a configuration in which a plurality of storage units are arranged in a housing rack, and outside air is introduced from an air intake port opened for each required storage unit, the storage units can be air-cooled. An air cooling device for an electronic device housing, characterized in that an outside air introduction control means is provided for adjusting the amount of outside air introduced from the air intake port in accordance with the temperature of the housing unit.