JPH0414901Y2 - - Google Patents
Info
- Publication number
- JPH0414901Y2 JPH0414901Y2 JP15122087U JP15122087U JPH0414901Y2 JP H0414901 Y2 JPH0414901 Y2 JP H0414901Y2 JP 15122087 U JP15122087 U JP 15122087U JP 15122087 U JP15122087 U JP 15122087U JP H0414901 Y2 JPH0414901 Y2 JP H0414901Y2
- Authority
- JP
- Japan
- Prior art keywords
- pin
- spacer
- pin terminal
- bobbin
- winding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 125000006850 spacer group Chemical group 0.000 claims description 17
- 238000004804 winding Methods 0.000 claims description 14
- 229920005992 thermoplastic resin Polymers 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 description 14
- 238000005476 soldering Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
Landscapes
- Coils Of Transformers For General Uses (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、コイル用ピン端子付ボビンの構造に
関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to the structure of a bobbin with a pin terminal for a coil.
従来、熱可塑性樹脂で成型されたコイル用ピン
端子付ボビンに巻線をし、巻線のリード端をピン
端子にからげてからげ部を半田槽に浸漬して半田
付けする際に、熱可塑性樹脂で作られたボビンの
場合、ボビン突出部等と一体成型されているスペ
ーサ部はピン端子のからげ部が半田付けされる時
同時に半田にさらされる為、スペーサ部は半田の
熱により傷められ形状をとどめない状態になると
いう欠点があつた。又ピン端子のからげ部分を半
田ゴテを用いて局部的に半田付けをするという方
法がとられることもあるが、この方法では作業能
率が悪いという欠点があつた。
Conventionally, when winding a wire on a bobbin with a pin terminal for a coil molded from thermoplastic resin, tying the lead end of the winding to the pin terminal, and immersing the tangled part in a solder bath for soldering, heat was not applied. In the case of a bobbin made of plastic resin, the spacer part, which is integrally molded with the protruding part of the bobbin, is exposed to solder when the barbed part of the pin terminal is soldered, so the spacer part may be damaged by the heat of the solder. The drawback was that it would not hold its shape. Also, a method is sometimes used in which the exposed portions of the pin terminals are locally soldered using a soldering iron, but this method has the disadvantage of poor work efficiency.
本考案は、ピン端子部を半田槽に浸漬して半田
付けしても、スペーサ部が半田熱によつて侵され
ず、ボビン本体には熱可塑性樹脂を用いたピン端
子付きボビンを供給することを目的とする。
The present invention provides a bobbin with a pin terminal that is made of thermoplastic resin so that even if the pin terminal part is immersed in a solder bath and soldered, the spacer part is not corroded by soldering heat and the bobbin body is made of thermoplastic resin. With the goal.
本考案は、絶縁性のある熱可塑性樹脂よりなる
筒状巻芯の上下両端部に外方に張り出した鍔を設
け、下端の鍔の下面には左右平行に突出部を設
け、また前記突出部に巻線リード端をからげる為
のピン端子を複数本植設すると共に、コイルを基
板に取り付ける際、ピン端子リード端のからげ部
が基板に接触するのを防止するスペーサに、電器
絶縁性の熱硬化性樹脂のピンを前記突出部に植設
したことを特徴とするコイル用ボビンを提供する
ことにある。
In the present invention, a cylindrical winding core made of an insulating thermoplastic resin is provided with outwardly protruding flanges at both the upper and lower ends, a protrusion is provided on the lower surface of the lower edge of the flanges in parallel to the left and right, and the protrusion is In addition to planting multiple pin terminals to wrap around the winding lead ends, electrical insulation is added to the spacer to prevent the twisted portions of the pin terminal lead ends from coming into contact with the board when the coil is attached to the board. An object of the present invention is to provide a coil bobbin characterized in that a pin made of a thermosetting resin is implanted in the protrusion.
第3図は、熱可塑性樹脂を用いた従来のピン端
子付きボビンに巻線を施し、そのリード端をピン
端子にからげて、半田槽に浸漬して半田付けを行
なう状態を示す立面図である。巻芯1に巻線を施
して巻線部7を形成し、そのリード端8をピン端
子6にからげてからげ部9が半田付けされるよう
に、半田槽10の半田液面11にからげ部9を浸
漬する。この時からげ部9とスペーサ部5が同時
に半田浸漬される為、スペーサ部5が半田熱で侵
され熱可塑性樹脂の場合には熱により形状が崩れ
てしまう時さえある。
Figure 3 is an elevational view showing a state in which wire is wound on a conventional bobbin with a pin terminal made of thermoplastic resin, the lead end of the wire is tied to a pin terminal, and soldered by immersing it in a solder bath. It is. A wire is wound around the winding core 1 to form a winding part 7, and the lead end 8 of the winding part 7 is tied to the pin terminal 6, and the solder liquid level 11 of the solder tank 10 is placed so that the lead end 8 is tied to the pin terminal 6 and the tied part 9 is soldered. The dried part 9 is immersed. At this time, since the binder part 9 and the spacer part 5 are dipped in solder at the same time, the spacer part 5 is eroded by the solder heat, and in the case of a thermoplastic resin, the shape may even collapse due to the heat.
第1図及び第2図は本考案の一実施例を示す斜
視図及び立面図である。第1図において、熱可塑
性樹脂によつて成形された巻芯1の上下に鍔2,
3を設け、下側の鍔3には磁芯挿入部の両側に突
出部4が平行に設けてある。突出部4にはピン端
子6及び、熱硬化性樹脂を用いたスペーサ用ピン
12が突出部の4隅に植設されている。第2図に
おいて、本考案のピン端子付きボビンを用いて巻
芯1に巻線を施して巻線部7を形成し、そのリー
ド端8をピン端子6にからげてからげ部9を半田
付けするもので、第2図は半田槽10の液面11
にからげ部9を浸漬した状態を示した立面図であ
る。本考案は、スペーサ用ピン12に熱硬化性樹
脂を用いているため、スペーサ用ピンは半田熱に
よつて侵されて変形することは無くなる。 1 and 2 are a perspective view and an elevation view showing an embodiment of the present invention. In Fig. 1, flanges 2 are placed above and below a winding core 1 made of thermoplastic resin.
3, and the lower collar 3 is provided with protrusions 4 in parallel on both sides of the magnetic core insertion portion. The protrusion 4 has pin terminals 6 and spacer pins 12 made of thermosetting resin implanted at four corners of the protrusion. In FIG. 2, the winding core 1 is wound using the bobbin with a pin terminal of the present invention to form a winding part 7, the lead end 8 is tied to the pin terminal 6, and the twisted part 9 is soldered. Figure 2 shows the liquid level 11 of the solder tank 10.
FIG. 3 is an elevational view showing a state in which the dip portion 9 is immersed. In the present invention, since thermosetting resin is used for the spacer pin 12, the spacer pin will not be eroded and deformed by solder heat.
以上説明してきたように、本考案によれば、熱
可塑性樹脂を用いたピン端子付コイル用ボビンに
おいて、ボビン本体には熱可塑性樹脂を用いスペ
ーサ用ピンのみに熱硬化性樹脂を用いることによ
り半田熱によつてスペーサ用ピンは侵されること
なく、半田槽にピン端子のからげ部を浸漬して半
田付けすることができ、従来に比べて作業能率の
向上が可能となつた。尚、本考案ではスペーサ用
ピン12は機械的にもろい熱硬化性樹脂を用いて
いるが、熱硬化性樹脂は強度、太さを十分検討し
用いる。又熱硬化性樹脂を用いたスペーサ用ピン
12は予め作つておいたスペーサ用ピン12をボ
ビンモールド時にピン端子6等と一緒にモールド
形成する。
As explained above, according to the present invention, in a coil bobbin with a pin terminal made of thermoplastic resin, the bobbin body is made of thermoplastic resin and only the spacer pin is made of thermosetting resin, so that soldering is possible. The spacer pins are not corroded by heat, and the barbed portion of the pin terminal can be immersed in a solder tank for soldering, making it possible to improve work efficiency compared to the conventional method. In the present invention, the spacer pin 12 is made of mechanically brittle thermosetting resin, but the thermosetting resin is used after careful consideration of its strength and thickness. Further, the spacer pin 12 made of thermosetting resin is formed by molding the spacer pin 12 made in advance together with the pin terminal 6 and the like during bobbin molding.
第1図及び第2図は本考案の一実施例を示す斜
視図及び立面図。第3図は、従来のコイル用ボビ
ンを用いて、半田付けを行なつてる図。
1……巻芯、2,3……鍔、4……突出部、5
……スペーサ部、6……ピン端子、7……巻線
部、8……リード端、9……からげ部、10……
半田槽、11……半田液面、12……スペーサ用
ピン。
1 and 2 are a perspective view and an elevation view showing an embodiment of the present invention. FIG. 3 is a diagram showing soldering using a conventional coil bobbin. 1... Core, 2, 3... Tsuba, 4... Projection, 5
...Spacer part, 6...Pin terminal, 7...Winding part, 8...Lead end, 9...Tangled part, 10...
Solder tank, 11...Solder liquid level, 12...Spacer pin.
Claims (1)
両端部に外方に張り出した鍔を設け、下端の鍔の
下面には前記巻芯のコアを挿入する内壁に、左右
平行に突出部を設け、また前記突出部に巻線のリ
ード端をからげる為のピン端子を複数本植設する
と共に、コイルを基板に取り付ける際ピン端子リ
ード端のからげ部が基板に接触するのを防止する
ため、スペーサに絶縁性のある熱硬化性樹脂のピ
ンを前記突出部に植設したことを特徴とするコイ
ル用ボビン。 A cylindrical winding core made of insulating thermoplastic resin is provided with outwardly projecting flanges at both the upper and lower ends, and on the lower surface of the lower flanges, protrusions are formed parallel to the left and right on the inner wall into which the core of the winding core is inserted. In addition, a plurality of pin terminals for tying the lead ends of the winding wire are planted in the protrusion, and the tangled portions of the pin terminal lead ends are prevented from coming into contact with the board when the coil is attached to the board. A coil bobbin characterized in that a pin made of an insulating thermosetting resin is implanted in the protruding portion of the spacer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15122087U JPH0414901Y2 (en) | 1987-09-30 | 1987-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15122087U JPH0414901Y2 (en) | 1987-09-30 | 1987-09-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0165112U JPH0165112U (en) | 1989-04-26 |
| JPH0414901Y2 true JPH0414901Y2 (en) | 1992-04-03 |
Family
ID=31425071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15122087U Expired JPH0414901Y2 (en) | 1987-09-30 | 1987-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0414901Y2 (en) |
-
1987
- 1987-09-30 JP JP15122087U patent/JPH0414901Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0165112U (en) | 1989-04-26 |
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