JPH0414915Y2

JPH0414915Y2 -

Info

Publication number: JPH0414915Y2
Application number: JP1986083322U
Authority: JP
Priority date: 1986-05-30
Filing date: 1986-05-30
Publication date: 1992-04-03
Also published as: JPS62193719U

Description

【考案の詳細な説明】産業上の利用分野本考案は、両端に、導電性パターンに直接半田
付けする電極を設けた電子部品に関するものであ
る。[Detailed Description of the Invention] Industrial Application Field The present invention relates to an electronic component having electrodes provided at both ends to be directly soldered to a conductive pattern.

従来の技術従来、この種電子部品は、第２図に示すよう
に、部品本体１の両端並びに両端外周に、銀ペー
スト並びに半田を積層被着して、電極２，２を形
成したもので、導電性パターン３上の電極４，４
に、クリーム半田を介して電極２，２を対接載置
し、加熱炉中で電極２，２の半田及びクリーム半
田を溶融することにより、半田層５，５を形成し
て、電子部品を導電性パターンに取り付けてい
た。BACKGROUND ART Conventionally, as shown in FIG. 2, this type of electronic component is one in which electrodes 2, 2 are formed by laminating silver paste and solder on both ends of a component body 1 and the outer periphery of both ends. Electrodes 4, 4 on conductive pattern 3
Then, the electrodes 2, 2 are placed facing each other through cream solder, and the solder of the electrodes 2, 2 and the cream solder are melted in a heating furnace to form solder layers 5, 5, and the electronic component is assembled. It was attached to a conductive pattern.

考案が解決しようとする問題点しかし、この取り付け時、半田が溶融すると、
半田中の持込み空気により気泡を発生し、この気
泡のために電子部品が、前後左右に揺動して、所
定取付位置よりずれ、隣接する他の電子部品とシ
ヨートしたり、電子部品間の耐圧が悪くなつたり
する欠点があつた。Problems that the invention aims to solve: However, when the solder melts during installation,
Air brought in during soldering generates air bubbles, and these air bubbles can cause electronic components to swing back and forth, side to side, move out of the designated mounting position, and cause the electronic components to shoot with other adjacent electronic components, or cause pressure resistance between the electronic components to oscillate. It had the disadvantage that it got worse.

問題点を解決するための手段本考案は、上記欠点を解決するために提案され
たもので、両端に電極を設けた四角形状の電子部
品において、前記電極に、電極との接合界面に、
上端より下端の電子部品取付面に達する空隙を形
成して金属製キヤツプを固着したことを特徴とす
る。Means for Solving the Problems The present invention was proposed in order to solve the above-mentioned drawbacks. In a rectangular electronic component with electrodes provided at both ends, the electrodes are provided with a bonding interface between the electrodes and the electrodes.
It is characterized in that a metal cap is fixed by forming a gap extending from the upper end to the electronic component mounting surface at the lower end.

実施例以下、本考案の一実施例を図面により説明する
と、第１図において、１１はコンデンサ、抵抗等
の四角柱状の部品本体、１２，１２は銀ペースト
並びに半田を積層被着して形成した電極１３，１
３は電極１２，１２に被冠させたコの字型の金属
製キヤツプで、その中央部の電極１２，１２に接
合する界面に、頂部外方より底部の電子部品取付
面に達する空隙１４，１４を設けてある。EXAMPLE Hereinafter, an example of the present invention will be explained with reference to the drawings. In FIG. 1, 11 is a rectangular prism-shaped component body such as a capacitor, a resistor, etc., and 12 is formed by laminating silver paste and solder. Electrode 13,1
Reference numeral 3 denotes a U-shaped metal cap that covers the electrodes 12, 12, and a gap 14, which reaches from the outside of the top to the electronic component mounting surface at the bottom, is provided at the interface bonded to the electrodes 12, 12 at the center. 14 are provided.

而して、この金属製キヤツプ１３，１３は、予
め電極１２，１２の半田を溶融して固着してもよ
いし、又、金属製キヤツプ１３，１３を嵌合させ
たままで、電子部品のプリントキヤツプへの取付
時に、同時に固着するようにしてもよい。 The metal caps 13, 13 may be fixed by melting the solder of the electrodes 12, 12 in advance, or the electronic parts may be printed while the metal caps 13, 13 are still fitted. It may be fixed at the same time when it is attached to the cap.

尚、上記実施例では、金属製キヤツプ１３，１
３をコの字型にしたが、これに限定されるもので
はなく、又空隙１４，１４も適当位置に設けるこ
とができる。さらに、金属製キヤツプ１３，１３
の形状によつては、金属製キヤツプ１３，１３の
外表面に予め半田層を形成しておくこともでき
る。 In addition, in the above embodiment, the metal caps 13, 1
3 is made into a U-shape, but it is not limited to this, and the gaps 14, 14 can also be provided at appropriate positions. Furthermore, metal caps 13, 13
Depending on the shape of the metal caps 13, a solder layer may be formed on the outer surfaces of the metal caps 13, 13 in advance.

考案の効果本考案は以上のような構成であるから、電子部
品取付時に発生する気泡は、キヤツプに設けた空
隙を通して逃がすことができるので、気泡による
取付位置ずれが防止できる。Effects of the Invention Since the present invention has the above-described configuration, air bubbles generated when installing electronic components can escape through the gap provided in the cap, thereby preventing displacement of the mounting position due to air bubbles.

又、溶融した半田は、気泡を逃がした後、空隙
内にも侵入し、電子部品の取付強度も増大するこ
ととなる。 Moreover, after the molten solder releases the air bubbles, it also enters into the gaps, increasing the mounting strength of the electronic component.

[Brief explanation of the drawing]

第１図は本考案に係る電子部品の斜視図、第２
図は従来の電子部品とその取付構造を示す側面図
である。１２……電極、１３……金属製キヤツプ、１４
……空隙。 Figure 1 is a perspective view of an electronic component according to the present invention, Figure 2 is a perspective view of an electronic component according to the present invention;
The figure is a side view showing a conventional electronic component and its mounting structure. 12... Electrode, 13... Metal cap, 14
...Void.

Claims

[Claims for Utility Model Registration] 1. In a rectangular prism-shaped electronic component with electrodes provided at both ends, a gap is formed in the electrode at the bonding interface with the electrode from the outside of the top to the electronic component mounting surface at the bottom to form a metal An electronic component characterized by a fixed cap made of aluminum. 2. The electronic component according to claim 1, wherein the metal cap has a U-shape.