JPH0414948Y2 - - Google Patents
Info
- Publication number
- JPH0414948Y2 JPH0414948Y2 JP1984171982U JP17198284U JPH0414948Y2 JP H0414948 Y2 JPH0414948 Y2 JP H0414948Y2 JP 1984171982 U JP1984171982 U JP 1984171982U JP 17198284 U JP17198284 U JP 17198284U JP H0414948 Y2 JPH0414948 Y2 JP H0414948Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- board
- lower flange
- frame
- flange portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】
「産業上の利用分野」
本考案は、アウトサート成型法により、基板に
樹脂部品を一体成型した基板構造に関する。[Detailed Description of the Invention] "Industrial Application Field" The present invention relates to a board structure in which resin parts are integrally molded onto a board by an outsert molding method.
「従来の技術」
従来のこの種の基板構造として、第４図および
第５図で示すものがあつた。図面において、Ａは
基板で、この基板Ａにはアウトサート成型法によ
り、樹脂製のボスＢ、ランナーＣ、ゲートＤ、枠
部Ｅなどが形成されている。ここで、枠部Ｅは基
板Ａの外周Ａ１に形成されており、縦断面形状が
「コ」の字形状で、基板Ａの側面と当接する周回
部Ｅ１と、基板Ａの表裏に当接するフランジ部Ｅ
２，Ｅ３とから構成されている。"Prior Art" Conventional substrate structures of this type include those shown in FIGS. 4 and 5. In the drawing, A is a substrate, and resin bosses B, runners C, gates D, frame E, etc. are formed on this substrate A by outsert molding. Here, the frame part E is formed on the outer periphery A1 of the board A, and has a U-shaped vertical cross section, and has a circumferential part E1 that comes into contact with the side surface of the board A, and a flange that comes into contact with the front and back sides of the board A. Part E
2 and E3.
「考案が解決しようとする問題点」
しかし、上記のような従来の基板構造におい
て、基板Ａの外周Ａ１に形成された枠部Ｅは、成
型後の外周Ａ１方向の冷却収縮によつて、枠部Ｅ
の一部が破断し、その周辺が外周Ａ１から剥離す
る。また、枠部Ｅの冷却収縮により基板Ａを変形
させるなどの欠点があつた。``Problems to be solved by the invention'' However, in the conventional substrate structure as described above, the frame portion E formed on the outer periphery A1 of the substrate A shrinks due to cooling shrinkage in the outer periphery A1 direction after molding. Part E
A part of it breaks, and its periphery peels off from the outer periphery A1. Further, there was a drawback that the substrate A was deformed due to cooling shrinkage of the frame portion E.
「問題点を解決するための手段」
本考案は、上記のような欠点を解決するために
なされたもので、基板の外周に形成する枠部の一
部を分断し、その両端部をそれぞれ基板の中央方
向に屈曲するとともに、基板に係止することによ
り、枠部の成型後の冷却収縮による欠点を除去す
るにある。"Means for Solving the Problems" The present invention was made to solve the above-mentioned drawbacks, and consists of dividing a part of the frame formed around the outer periphery of the board, and attaching each end to the board. By bending toward the center of the frame and locking it to the substrate, defects caused by cooling shrinkage of the frame after molding can be eliminated.
「考案の構成」
以下、本考案を図面の実施例にもとづいて説明
する。"Structure of the Invention" The present invention will be explained below based on the embodiments shown in the drawings.
第１図は本考案にかかる基板構造の一部を示す
斜視図で、第２図は同縦断面図で、第３図は成型
後の冷却収縮状態を示す斜視図である。 FIG. 1 is a perspective view showing a part of the substrate structure according to the present invention, FIG. 2 is a longitudinal cross-sectional view of the same, and FIG. 3 is a perspective view showing a cooling shrinkage state after molding.
図面において、１は平面が方形形状の基板で、
２はその外周部、３はアウトサート成型法により
基板１の外周部２に一体成型した樹脂製の枠部で
ある。 In the drawing, 1 is a substrate with a rectangular plane;
Reference numeral 2 designates the outer peripheral portion thereof, and reference numeral 3 designates a resin frame portion integrally molded with the outer peripheral portion 2 of the substrate 1 by an outsert molding method.
そして、この枠部３は縦断面が「コ」の字形状
で、基板１の側面に当接する周回部３ａと、基板
１の表裏面に当接する上下フランジ部３ｂ，３
b′，３ｃ，３c′とから構成されている。 The frame portion 3 has a U-shape in vertical section, and includes a circumferential portion 3a that contacts the side surface of the board 1, and upper and lower flange portions 3b, 3 that contact the front and back surfaces of the board 1.
It is composed of b', 3c, and 3c'.
上記の枠部３は、基板１の外周部２の一で周回
部３ａと上下フランジ部３ｂ，３b′，３ｃ，３
c′とにそれぞれ分離する。かつ、上下フランジ部
の端部３ｄ，３d′，３ｅ，３e′をそれぞれ上下屈
曲部４ａ，４a′，４ｂ，４b′を介して基板１の内
側中央方向に屈曲形成する。この場合、周回部３
ａは、基板１の厚さと同一の高さを有するように
設定する。 The frame portion 3 is one of the outer peripheral portions 2 of the substrate 1, and includes a circumferential portion 3a and upper and lower flange portions 3b, 3b', 3c, and 3.
Separate into c′ and c′. In addition, the ends 3d, 3d', 3e, 3e' of the upper and lower flange portions are bent toward the inner center of the substrate 1 via the upper and lower bent portions 4a, 4a', 4b, and 4b', respectively. In this case, the orbiting part 3
a is set to have the same height as the thickness of the substrate 1.
また、上下フランジ部の端部３ｄ，３d′，３
ｅ，３e′は、上記基板１に離間して形成した小孔
５ａ，５ｂを介して連結する。 In addition, the ends 3d, 3d', 3 of the upper and lower flange parts
e and 3e' are connected through small holes 5a and 5b formed in the substrate 1 apart from each other.
「考案の作用」 次に、上記の実施例の作用について説明する。"The action of invention" Next, the operation of the above embodiment will be explained.
アウトサート成型法により基板１の外周部２に
樹脂製の枠部３一体成型し、成型後に枠部３に冷
却収縮が起こつた場合、枠部３は矢印で示すよう
に基板１の周囲方向に引張力を受ける。この引張
力は、枠部３の任意の場所で均一にかかるので、
冷却収縮により破断するとすれば、第３図で示す
ように、断面積が最も小さい周回部３ａで破断す
る。 When a resin frame 3 is integrally molded on the outer periphery 2 of the substrate 1 using the outsert molding method, and if cooling shrinkage occurs in the frame 3 after molding, the frame 3 will move in the direction around the substrate 1 as shown by the arrow. subjected to tensile force. This tensile force is applied uniformly at any location on the frame 3, so
If it were to break due to cooling shrinkage, it would break at the circumferential portion 3a having the smallest cross-sectional area, as shown in FIG.
また、上下屈曲部４ａ，４a′，４ｂ，４b′は、
上下フランジ部の端部３ｄ，３d′，３ｅ，３e′が
連結されている小孔５ａ，５ｂを支点として、第
３図の点線の位置から実線の位置に弾性変形して
引張応力を吸収する。 In addition, the vertical bent portions 4a, 4a', 4b, 4b' are
The small holes 5a and 5b to which the ends 3d, 3d', 3e, and 3e' of the upper and lower flange parts are connected are used as fulcrums to elastically deform from the dotted line position to the solid line position in Figure 3 to absorb tensile stress. .
「考案の効果」
本考案は、叙上のように、基板１の外周部２に
樹脂からなる断面コ字形状の枠部３を一体成型し
た基板構造において、
上記枠部３は上記基板１の側面に当接するとと
もに当該基板１の厚さと同一の高さを有する周回
部３ａと当該基板１の表裏面に当接する上下フラ
ンジ部３ｂ，３b′，３ｃ，３c′とから構成し、上
記基板１の外周部２の一で上記枠部３を上記周回
部３ａと上記上下フランジ部３ｂ，３b′，３ｃ，
３c′とにそれぞれ分離し、かつ、当該上下フラン
ジ部の端部３ｄ，３d′，３ｅ，３e′をそれぞれ上
下屈曲部４ａ，４a′，４ｂ，４b′を介して当該基
板１の内側中央方向に屈曲形成し、
上記上下フランジ部の端部３ｄ，３d′，３ｅ，
３e′は上記基板１に離間して形成した小孔５ａ，
５ｂを介して連結したものである。"Effects of the Invention" As described above, the present invention provides a board structure in which a frame part 3 made of resin and having a U-shaped cross section is integrally molded on the outer peripheral part 2 of the board 1. It is composed of a circumferential portion 3a that abuts the side surface and has the same height as the thickness of the substrate 1, and upper and lower flange portions 3b, 3b', 3c, and 3c' that abut the front and back surfaces of the substrate 1. The frame part 3 is connected to the circumferential part 3a and the upper and lower flange parts 3b, 3b', 3c,
3c', and the ends 3d, 3d', 3e, 3e' of the upper and lower flange parts are connected to the inner center of the board 1 through the upper and lower bent parts 4a, 4a', 4b, 4b', respectively. The ends 3d, 3d', 3e, of the upper and lower flange parts are bent to
3e' are small holes 5a, which are formed at a distance in the substrate 1;
5b.
従つて、枠部に成型後の冷却収縮が起こつて
も、フランジ部の屈曲部が弾性変形で吸収し、枠
部および基板に悪影響を及ぼすことがなく、また
金型の製作上の工数も最小とすることができる。 Therefore, even if cooling shrinkage occurs in the frame part after molding, the bent part of the flange part absorbs it through elastic deformation, and there is no adverse effect on the frame part or the board, and the man-hours for manufacturing the mold are minimized. It can be done.
第１図は本考案にかかる基板構造の一部を示す
斜視図で、第２図は同縦断面図で、第３図は成型
後の冷却収縮状態を示す斜視図で、第４図は従来
の基板構造を示す斜視図で、第５図は同基板構造
の縦断面図である。
１……基板、２……外周部、３……枠部、３ａ
……周回部、３ｂ，３b′，３ｃ，３c′……上下フ
ランジ部、３ｄ，３d′，３ｅ，３e′……端部、４
ａ，４a′，４ｂ，４b′……上下屈曲部、５ａ，５
ｂ……小孔。
Fig. 1 is a perspective view showing a part of the substrate structure according to the present invention, Fig. 2 is a longitudinal cross-sectional view of the same, Fig. 3 is a perspective view showing the cooling shrinkage state after molding, and Fig. 4 is a conventional 5 is a perspective view showing the substrate structure of FIG. 5, and FIG. 5 is a longitudinal sectional view of the same substrate structure. 1... Board, 2... Outer periphery, 3... Frame, 3a
...Rounding part, 3b, 3b', 3c, 3c'...Upper and lower flange part, 3d, 3d', 3e, 3e'...End part, 4
a, 4a', 4b, 4b'...vertical bent part, 5a, 5
b...Small hole.
Claims (1)
の枠部３を一体成型した基板構造において、 上記枠部３は上記基板１の側面に当接するとと
もに当該基板１の厚さと同一の高さを有する周回
部３ａと当該基板１の表裏面に当接する上下フラ
ンジ部３ｂ，３b′，３ｃ，３c′とから構成し、 上記基板１の外周部２の一で上記枠部３を上記
周回部３ａと上記上下フランジ部３ｂ，３b′，３
ｃ，３c′とにそれぞれ分離し、かつ、当該上下フ
ランジ部の端部３ｄ，３d′，３ｅ，３e′をそれぞ
れ上下屈曲部４ａ，４a′，４ｂ，４b′を介して当
該基板１の内側中央方向に屈曲形成し、 上記上下フランジ部の端部３ｄ，３d′，３ｅ，
３e′は上記基板１に離間して形成した小孔５ａ，
５ｂを介して連結した ことを特徴とする基板構造。[Claims for Utility Model Registration] In a board structure in which a frame part 3 made of resin and having a U-shaped cross section is integrally molded on the outer peripheral part 2 of a board 1, the frame part 3 abuts the side surface of the board 1 and 1, and upper and lower flange portions 3b, 3b', 3c, and 3c' that contact the front and back surfaces of the substrate 1. The frame portion 3 is connected to the circumferential portion 3a and the upper and lower flange portions 3b, 3b', 3.
c and 3c', and the ends 3d, 3d', 3e, 3e' of the upper and lower flange parts are connected to the inside of the substrate 1 through the upper and lower bent parts 4a, 4a', 4b, 4b', respectively. The ends 3d, 3d', 3e of the upper and lower flange portions are bent toward the center.
3e' are small holes 5a, which are formed in the substrate 1 at a distance.
A substrate structure characterized in that the substrates are connected via 5b.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984171982U JPH0414948Y2 (en) | 1984-11-13 | 1984-11-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984171982U JPH0414948Y2 (en) | 1984-11-13 | 1984-11-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6186966U JPS6186966U (en) | 1986-06-07 |
| JPH0414948Y2 true JPH0414948Y2 (en) | 1992-04-03 |
Family
ID=30729656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984171982U Expired JPH0414948Y2 (en) | 1984-11-13 | 1984-11-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0414948Y2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49106566A (en) * | 1973-02-09 | 1974-10-09 | ||
| JPS6041847Y2 (en) * | 1980-07-29 | 1985-12-20 | 株式会社小林コ−セ− | Bar-shaped cosmetic dispenser container |
-
1984
- 1984-11-13 JP JP1984171982U patent/JPH0414948Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6186966U (en) | 1986-06-07 |
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