JPH0415074U - - Google Patents
Info
- Publication number
- JPH0415074U JPH0415074U JP5344290U JP5344290U JPH0415074U JP H0415074 U JPH0415074 U JP H0415074U JP 5344290 U JP5344290 U JP 5344290U JP 5344290 U JP5344290 U JP 5344290U JP H0415074 U JPH0415074 U JP H0415074U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- upper lid
- socket
- board
- sockets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 4
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａ，ｂは本考案の第１の実施例の側面図
及び平面図、第２図は第１図ａ，ｂのソケツト部
の部分拡大側面図、第３図は本考案の第２の実施
例の斜視図、第４図は従来のＢＴ基板の一例の側
面図である。
１，１１……ストツパ、２，１２……上ぶた、
３……ＩＣ、４……スプリング、５……基板、６
……ソケツト、７……電源入力部、８……配線、
９……カセツト式ソケツト。
Figures 1a and b are side views and plan views of the first embodiment of the present invention, Figure 2 is a partially enlarged side view of the socket portion of Figures 1a and b, and Figure 3 is a second embodiment of the present invention. FIG. 4 is a side view of an example of a conventional BT board. 1, 11... Stoppa, 2, 12... Upper lid,
3...IC, 4...spring, 5...board, 6
...Socket, 7...Power input section, 8...Wiring,
9...Cassette type socket.
Claims (1)
複数のソケツトと、前記ＩＣを前記ソケツトに押
圧し固定する上ぶたと、該上ぶたを前記基板と所
定間隔に保持するボルト状のストツパと、該スト
ツパの周囲に捲かれたスプリングとを有するＢＴ
（Ｂｕｒｎ ｉｎ Ｔｅｓｔ）基板。 ２ 前記ソケツトが複数個連結され一体化したカ
セツト式ソケツトを形成し前記基板と前記上ぶた
間に挿入、引き出しができるようにしたことを特
徴とする請求項１記載のＢＴ基板。[Claims for Utility Model Registration] 1. A substrate, a plurality of IC mounting sockets arranged on the substrate, an upper lid for pressing and fixing the IC to the socket, and a predetermined connection between the upper lid and the substrate. A BT having a bolt-shaped stopper held at an interval and a spring wound around the stopper.
(Burn in Test) substrate. 2. The BT board according to claim 1, wherein a plurality of said sockets are connected to form an integrated cassette type socket which can be inserted into and pulled out between said board and said upper lid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5344290U JPH0415074U (en) | 1990-05-22 | 1990-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5344290U JPH0415074U (en) | 1990-05-22 | 1990-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415074U true JPH0415074U (en) | 1992-02-06 |
Family
ID=31574629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5344290U Pending JPH0415074U (en) | 1990-05-22 | 1990-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415074U (en) |
-
1990
- 1990-05-22 JP JP5344290U patent/JPH0415074U/ja active Pending
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