JPH0415260U - - Google Patents
Info
- Publication number
- JPH0415260U JPH0415260U JP5632990U JP5632990U JPH0415260U JP H0415260 U JPH0415260 U JP H0415260U JP 5632990 U JP5632990 U JP 5632990U JP 5632990 U JP5632990 U JP 5632990U JP H0415260 U JPH0415260 U JP H0415260U
- Authority
- JP
- Japan
- Prior art keywords
- support arm
- circuit board
- flat plate
- package
- locking part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 239000006247 magnetic powder Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の実施例を示す斜視図、第２図
は部品の図示を省略した実施例の分解斜視図、第
３図は本考案の他の実施例を示す正面図、第４図
は第１従来例の斜視図、第５図は第２従来例の分
解斜視図、第６図は第３従来例の分解斜視図、第
７図は第４従来例の分解斜視図である。
１０，３０……基板保持用パツケージ、１１，
３１……平板部、１２，３２Ａ，３２Ｂ……支持
腕部、１３Ａ，１３Ｂ，３３Ａ，３３Ｂ……係止
溝、１５……電子部品、２０Ａ，２０Ｂ……回路
基板、２５，２５Ａ，２５Ｂ……蓋基板。
Fig. 1 is a perspective view showing an embodiment of the invention, Fig. 2 is an exploded perspective view of the embodiment with parts not shown, Fig. 3 is a front view showing another embodiment of the invention, and Fig. 4. 5 is an exploded perspective view of the second conventional example, FIG. 6 is an exploded perspective view of the third conventional example, and FIG. 7 is an exploded perspective view of the fourth conventional example. 10, 30...Package for holding substrate, 11,
31... Flat plate part, 12, 32A, 32B... Support arm part, 13A, 13B, 33A, 33B... Locking groove, 15... Electronic component, 20A, 20B... Circuit board, 25, 25A, 25B... ...Lid board.
Claims (1)
腕部の中間部に少なくとも１つの係止部を設けた
ことを特徴とする基板保持用パツケージ。 (2) 前記支持腕部が平板部両面に立設されてい
る請求項１記載の基板保持用パツケージ。 (3) 支持腕部を平板部に一体に立設し、該支持
腕部の中間部に少なくとも１つの係止部を設けて
なる基板保持用パツケージの前記係止部にて回路
基板を係止することを特徴とする多段回路基板組
立体。 (4) 樹脂に磁性体粉末を混合した成形体で前記
基板保持用パツケージを構成した請求項３記載の
多段回路基板組立体。[Claims for Utility Model Registration] (1) A package for holding a circuit board, characterized in that a support arm is integrally erected on a flat plate part, and at least one locking part is provided in the middle of the support arm. . (2) The substrate holding package according to claim 1, wherein the support arm portions are provided upright on both sides of the flat plate portion. (3) The circuit board is locked by the locking part of the board holding package, which has a support arm integrally erected on the flat plate part and at least one locking part provided in the middle part of the support arm. A multi-stage circuit board assembly characterized by: (4) The multi-stage circuit board assembly according to claim 3, wherein the board holding package is formed of a molded body of resin mixed with magnetic powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5632990U JPH0415260U (en) | 1990-05-29 | 1990-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5632990U JPH0415260U (en) | 1990-05-29 | 1990-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415260U true JPH0415260U (en) | 1992-02-06 |
Family
ID=31580056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5632990U Pending JPH0415260U (en) | 1990-05-29 | 1990-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415260U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2008139546A1 (en) * | 2007-05-01 | 2010-07-29 | 富士通株式会社 | Electronics |
-
1990
- 1990-05-29 JP JP5632990U patent/JPH0415260U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2008139546A1 (en) * | 2007-05-01 | 2010-07-29 | 富士通株式会社 | Electronics |
| US7924575B2 (en) | 2007-05-01 | 2011-04-12 | Fujitsu Limited | Electronic apparatus |
| JP4669562B2 (en) * | 2007-05-01 | 2011-04-13 | 富士通株式会社 | Electronics |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0415260U (en) | ||
| JPH02108363U (en) | ||
| JPH0220372U (en) | ||
| JPH0167771U (en) | ||
| JPH0224502U (en) | ||
| JPS58162302U (en) | Mounting device for resin molded products | |
| JPH01116194U (en) | ||
| JPS6416640U (en) | ||
| JPH01157464U (en) | ||
| JPH0169315U (en) | ||
| JPS6440127U (en) | ||
| JPH0249072U (en) | ||
| JPH037U (en) | ||
| JPH03113961U (en) | ||
| JPH02138457U (en) | ||
| JPS6197889U (en) | ||
| JPS60116222U (en) | resin encapsulated capacitor | |
| JPS62162851U (en) | ||
| JPS61153282U (en) | ||
| JPS62180953U (en) | ||
| JPS63136345U (en) | ||
| JPS6073217U (en) | molded capacitor | |
| JPH0330463U (en) | ||
| JPS6242285U (en) | ||
| JPH0241447U (en) |