JPH0415535U - - Google Patents
Info
- Publication number
- JPH0415535U JPH0415535U JP5708590U JP5708590U JPH0415535U JP H0415535 U JPH0415535 U JP H0415535U JP 5708590 U JP5708590 U JP 5708590U JP 5708590 U JP5708590 U JP 5708590U JP H0415535 U JPH0415535 U JP H0415535U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- heating elements
- arrangement pitch
- heating
- heat transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 5
- 239000002470 thermal conductor Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
- Electronic Switches (AREA)
Description
第１図は本考案の一実施例を示す縦断側面図、
第２図はその発熱エレメントと放熱補助部材との
配設位置の関係を示す平面図である。
１……基板、２……発熱エレメント、３……発
熱素子、５……エレメント空間部、６……放熱補
助部材、７……電熱部材、８……熱伝導体。
FIG. 1 is a longitudinal sectional side view showing an embodiment of the present invention;
FIG. 2 is a plan view showing the positional relationship between the heat generating element and the heat dissipation assisting member. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Heat generating element, 3... Heat generating element, 5... Element space, 6... Heat radiation auxiliary member, 7... Electric heating member, 8... Heat conductor.
Claims (1)
もつて形成された発熱素子と、この発熱素子の前
記発熱エレメントの直下に位置して形成されたエ
レメント空間部と、前記発熱エレメント間の直下
の前記エレメント空間部の間に位置して一定の配
列ピツチをもつて配設された熱伝導率の高い放熱
補助部材と、この放熱補助部材に密着して形成さ
れた伝熱部材と、この伝熱部材と接続された放熱
用の熱伝導体とよりなることを特徴とするサーマ
ルヘツド。 A heating element in which heating elements are formed with a constant arrangement pitch on a substrate, an element space formed immediately below the heating elements of this heating element, and the element directly below between the heating elements. A heat dissipation auxiliary member with high thermal conductivity that is located between the spaces and arranged with a constant arrangement pitch, a heat transfer member that is formed in close contact with this heat dissipation assist member, and this heat transfer member. A thermal head comprising a thermal conductor for heat dissipation connected thereto.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5708590U JPH0415535U (en) | 1990-05-30 | 1990-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5708590U JPH0415535U (en) | 1990-05-30 | 1990-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415535U true JPH0415535U (en) | 1992-02-07 |
Family
ID=31581481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5708590U Pending JPH0415535U (en) | 1990-05-30 | 1990-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415535U (en) |
-
1990
- 1990-05-30 JP JP5708590U patent/JPH0415535U/ja active Pending
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