JPH04155991A - Electronic parts and their mounting method - Google Patents
Electronic parts and their mounting methodInfo
- Publication number
- JPH04155991A JPH04155991A JP2282464A JP28246490A JPH04155991A JP H04155991 A JPH04155991 A JP H04155991A JP 2282464 A JP2282464 A JP 2282464A JP 28246490 A JP28246490 A JP 28246490A JP H04155991 A JPH04155991 A JP H04155991A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- pin member
- flange
- pin
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
本発明は電子部品、特に混成集積回路装置とその実装方
法に関する。The present invention relates to electronic components, and particularly to a hybrid integrated circuit device and its mounting method.
従来、広く知られている電子部品、特に混成集積回路装
置は、例えば第４図に示すように、回路配線が形成され
た回路基板１の上に電子部品２．２・・・を搭載し、さ
らに回路基板１の側縁から端子リード１１、ｌｌ・・・
が導出された構造を育する。このような混成集積回路装
置を同回路基板１０へ実装するときは、回路基板１から
導出している端子リード１１１１１・・・を劇として、
回路基板１を同回路基板１０上に載置し、その後、同回
路基板１０上に形成されたランド電極１２．１２・・・
と端子リード１１．１１・・・とを半田付けしている。
さらに、混成集積回路装置の他の従来例として、例えば
第５図に示すように、回路基板１の側縁部に形成された
電極パッド１３．１３・・・に、下面が平坦な端子電極
１４．１４を取り付けたものが知られている。この混成
集積回路装置では、前記端子電極１４．１４・・・を脚
として回路基板ｌを母回路基板上に搭載すると共に、端
子電極１４．１４・・・を母回路基板上のランド電極に
半田付けする。Conventionally, widely known electronic components, especially hybrid integrated circuit devices, have electronic components 2, 2, etc. mounted on a circuit board 1 on which circuit wiring is formed, as shown in FIG. 4, for example. Further, from the side edge of the circuit board 1, terminal leads 11, ll...
develop the derived structure. When mounting such a hybrid integrated circuit device on the circuit board 10, the terminal leads 11111 led out from the circuit board 1 are
The circuit board 1 is placed on the circuit board 10, and then the land electrodes 12, 12, . . . formed on the circuit board 10 are placed on the circuit board 10.
and terminal leads 11, 11... are soldered. Furthermore, as another conventional example of a hybrid integrated circuit device, for example, as shown in FIG. A version with a .14 installed is known. In this hybrid integrated circuit device, a circuit board l is mounted on a mother circuit board using the terminal electrodes 14, 14... as legs, and the terminal electrodes 14, 14... are soldered to land electrodes on the mother circuit board. Attach.
上記のような混成集積回路装置では、ランド電極１２．
１２・・・と端子リード１１，１１・・・とが半田付け
によって固定される前に、何らかの理由で発生した振動
で回路基板１が同回路基板１０上で位置がずれることが
ある。さらに、同回路基板１０が傾いたような場合、回
路基板１がその上から滑り落ちて、適正に実装すること
ができないという課題があった。
そこで、本発明の目的は、上記の課題を解決でき、同回
路基板への実装時に容易にずれず、確実に搭載できる電
子部品とその実装方法を提供することにある。In the hybrid integrated circuit device as described above, the land electrode 12.
12... and the terminal leads 11, 11... are fixed by soldering, the position of the circuit board 1 may shift on the circuit board 10 due to vibrations generated for some reason. Furthermore, if the circuit board 10 is tilted, there is a problem that the circuit board 1 will slide off from above and cannot be mounted properly. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic component that can solve the above-mentioned problems and that can be reliably mounted on a circuit board without being easily displaced, and a method for mounting the electronic component.
前記目的を達成するため、′本発明では、以下の手段を
提示する。
すなわち、電子回路が構成された回路基板ｌと、同回路
基板１の縁部に形成された端子電極３．３・・・の列と
を存する電子部品であって、前記端子電極３．３・・・
の列が形成された縁部にピン部材４が突設され、該ピン
部材４に回路基板ｌの縁面とほぼ平行なフランジ５．５
′が少なくとも１片形成されていることを特徴とする電
子部品である。
また、電子回路が構成された回路基板ｌと、同回路基板
ｌの縁部に形成された端子電極３．３・・・の列とを有
し、さらに、前記端子電極３．３・・・の列が形成され
た縁部にピン部材４が突設され、該ピン部材４に回路基
板１の縁面とほぼ平行なフランジ５．５′が少なくとも
１片形成されている電子部品と、前記フランジ５より広
い開口部６ａと、前記ピン部材４より僅かに広いスリッ
ト部６ｂとからなる貫通孔６と、前記端子電極３．３・
・・の列と同じピッチで電極パッド１１．１１・・・が
形成された同回路基板１０とを用意し、前記ピン部材４
に取り付けられたフランジ５を同回路基板１０の貫通孔
６の開口部６ａから挿入し、さらにピン部材４をスリッ
ト部６ｂに押し込んで、回路基板ｌを同回路基板１０の
上に起立した状態で保持し、さらに前記端子電極３．３
・・・を電極パッド１１．１１・・・に半田付けするこ
とを特徴とする電子部品の実装方法である。In order to achieve the above object, the present invention presents the following means. That is, it is an electronic component that includes a circuit board 1 on which an electronic circuit is configured and a row of terminal electrodes 3.3 formed on the edge of the circuit board 1.・・・
A pin member 4 is provided protruding from the edge where the rows are formed, and the pin member 4 has a flange 5.5 substantially parallel to the edge surface of the circuit board l.
This is an electronic component characterized in that at least one piece of ' is formed. Further, it has a circuit board l on which an electronic circuit is configured, and a row of terminal electrodes 3.3 formed on the edge of the circuit board l, and further includes the terminal electrodes 3.3... an electronic component having a pin member 4 protruding from the edge where the rows are formed, and at least one flange 5.5' substantially parallel to the edge surface of the circuit board 1 is formed on the pin member 4; A through hole 6 consisting of an opening 6a wider than the flange 5 and a slit 6b slightly wider than the pin member 4, and the terminal electrode 3.3.
The same circuit board 10 having electrode pads 11, 11, . . . formed at the same pitch as the rows of .
Insert the flange 5 attached to the circuit board 10 from the opening 6a of the through hole 6 of the same circuit board 10, and further push the pin member 4 into the slit part 6b, with the circuit board l standing up on the circuit board 10. holding and further said terminal electrode 3.3
This is an electronic component mounting method characterized by soldering... to electrode pads 11, 11...
【作 用］
前記本発明による電子部品の実装方法によれば、ピン部
材４を介して回路基板１に連結されたフランジ５が貫通
孔６に挿入され、さらにスリット部６ｂの部分で同回路
基板１０の背後に嵌め込まれるため、回路基板１はこの
７ランジ５が抜は止めとなって、ピン部材４により同回
路基板ｌＯに連結される。これにより、回路基板ｌが同
回路基板１０から容易に分離しないように保持される。
さらに、回路基板１をこのように同回路基板１０に保持
させるためには、貫通孔６の開口部６ａからフランジ５
を差込み、ピン部材４をスリット部６ｂに押し込めばよ
いので、回路基板ｌを同回路基板１０に簡単に仮止めす
ることができる。
【実 施 例】
本発明の一実施例である混成集積回路装置を第１図に示
し、これに従って同実施例について説明する。この混成
集積回路装置は、例えばセラミックスやガラス−エポキ
シ系樹脂等を材料とする絶縁基板に、金属ペーストや抵
抗ペースト等の厚膜印刷材料を印刷し、これを焼成し、
所定の配線パターンを形成し、回路基板ｌを構成する。
そして、この回路基板ｌに電子部品２．２・・・を搭載
している。さらに同回路基板１の一縁部に一定の間隔で
端子電極３．３・・・が形成されている。
本発明では、回路基板ｌの前記端子電極３．３・・・が
形成された縁部の両端部分から、ピン部材４．７を突設
している。このうち一方のピン部材４には、回路基板１
の縁面に平行な一対のフランジ５．５′が設けられてお
り、これらフランジ５．５′の間隔は、後に述べる母基
板１０の厚さより僅かに広く設定されている。
第１図の場合、他方のピン部材７には、フランジ５．５
′が設けられておらず、単なる直線状のピンからなる。
しかし、双方が同じようなフランジ５．５′を育するピ
ン部材４．４であってもよい。さらに、これらピン部材
４．７は、金属等の良導電体で形成し、これに回路配線
の例えばアース側配線等を接続しておくことができる。
このような回路基板ｌを搭載する行回路基板１０には、
前記ピン端子４を嵌め込む貫通孔６．８が開設され、さ
らに同回路基板１０の上には、前記端子電極３．３・・
・を半田付けするためのランド電極１１１１１・・・が
形成されている。貫通孔６．８は、回路基板１のピン部
材４．７の位置に対応して開設され、ランド電極１１．
１１・・・は、これら貫通孔６．８の間に前記端子電極
３．３・・・と同じ間隔で形成されている。
フランジ５．５′を存するピン端子４を嵌め込む側の貫
通孔６は、第２図に示すように、下側のフランジ５が容
易に嵌合できるよう、同フランジ５より僅かに大きなサ
イズの開口部６ａと、それに連なるスリット部６ａとか
らなり、全体が丁字形をなすよう形成されている。スリ
ット部６ａの幅は、ピン部材４の太さより僅かに広く形
成されている。
第２図（ａ）と（ｂ）には、この貫通孔６にピン部材４
を嵌め込む手順を示している。すなわち、まずフランジ
５を大きい開口部６ａに嵌め込み、下側のフランジ５が
行回路基板１０の下に抜けたところで、第２図（ａ）に
２点鎖線で示すように、ピン端子４をスリット部６ｂ側
に押し込む。これにより、行回路基板１０が２つのフラ
ンジ５．５′に挟まれ、回路基板１と行回路基板１０と
がピン部材４を介して連結される。
他方、フランジ５．５′を有しないピン部材７を嵌め込
むための貫通孔８は、第１図に示すように、細長いスリ
ット状であり、これは、前記貫通孔６のスリット部６ｂ
と互いの延長線上に形成されている。またこの貫通孔８
は、第２図（ａ）において実線から二点鎖線で示すよう
に、ピン端子４を貫通孔６の開口部６ａがらスリット部
６ｂに押し込む際に、ピン部材７側が移動する軌跡をカ
バーする位置と長さだけ形成されている。従って、ピン
部材４側を貫通孔６に嵌め込むときは、ピン部材７が前
記貫通孔８に沿ってスライド移動する。
なお、ピン部材７側に、これに代えて前記ピン部材４と
同様のフランジ５．５′を有するものを設けたときは、
これを嵌合するために、貫通孔８に代えて、前記と同様
の丁字形の貫通孔６を設けることは言うまでもない。
このようにして、ピン部材４．７を用いて回路基板１を
行回路基板１０の上に仮固定した状態で、ランド電極１
１，１１・・・は、端子電極３．３・・・とほぼ接する
位置に形成されている。このランド電極１１．１１・・
・の上には予めペースト半田を塗布しておき、仮固定の
状態で端子電極 。
３．３・・・をランド電極１１，１１・・・に半田付け
する。この場合、ピン部材４．７を良導体で形成した場
合は、前記貫通孔６．８の壁面にも予め導体膜を形成し
ておき、ここにピン部材４、７を各々半田付けする。こ
れにより、回路基・１が行回路基板１０に固定されると
共に、そ。
らの回路が電気的に接続される。
次に、第３図の実施例について説明すると、この実施例
では、ピン部材４に１つだけのフンジ５が設けられてお
り、他方のフランジ５′の代わりに回路基板１の下縁面
が使用される。
従うで、フランジ５と回路基板１の下縁面と（間隔は、
回路基板１が搭載される行回路基板０の厚さよりやや広
く設定されている。他の載や回路基板１の搭載法は、前
記第１図及び第Ｓ図の実施例と同様である。
【発明の効果］
以上説明した通り、本発明によれば、回路過板１を行回
路基板１０に仮止めした状態で半日付けができることに
より、回路基板１を確実？ζ母回路基板１０に搭載し、
半田付けすること力できる電子部品とそのＷＩ載方法が
提供でき、０期の目的を達成することができる。[Function] According to the electronic component mounting method according to the present invention, the flange 5 connected to the circuit board 1 via the pin member 4 is inserted into the through hole 6, and the circuit board is further mounted at the slit portion 6b. 10, the circuit board 1 is connected to the same circuit board 10 by the pin member 4, with the seven flange 5 serving as a stopper for removal. Thereby, the circuit board 1 is held so as not to be easily separated from the circuit board 10. Furthermore, in order to hold the circuit board 1 on the circuit board 10 in this manner, the flange 5 must be inserted from the opening 6a of the through hole 6.
Since it is only necessary to insert the pin member 4 into the slit portion 6b, the circuit board l can be easily temporarily fixed to the circuit board 10. [Embodiment] A hybrid integrated circuit device which is an embodiment of the present invention is shown in FIG. 1, and the embodiment will be explained according to the drawing. This hybrid integrated circuit device is produced by printing a thick film printing material such as metal paste or resistance paste on an insulating substrate made of, for example, ceramics or glass-epoxy resin, and then firing it.
A predetermined wiring pattern is formed to configure the circuit board l. Electronic components 2.2... are mounted on this circuit board l. Further, terminal electrodes 3, 3, . . . are formed at regular intervals on one edge of the circuit board 1. In the present invention, pin members 4.7 are provided protruding from both end portions of the edge of the circuit board l where the terminal electrodes 3.3... are formed. One of the pin members 4 has a circuit board 1
A pair of flanges 5.5' are provided parallel to the edge surface of the substrate, and the distance between these flanges 5.5' is set to be slightly wider than the thickness of the motherboard 10, which will be described later. In the case of FIG. 1, the other pin member 7 has a flange 5.5.
' is not provided, and it consists of a simple straight pin. However, it is also possible for both pin members 4.4 to have similar flanges 5.5'. Furthermore, these pin members 4.7 can be formed of a good conductor such as metal, and circuit wiring such as ground wiring can be connected thereto. The row circuit board 10 on which such a circuit board l is mounted includes:
A through hole 6.8 into which the pin terminal 4 is fitted is formed, and further on the circuit board 10 are the terminal electrodes 3.3...
Land electrodes 11111 . . . for soldering are formed. The through hole 6.8 is opened corresponding to the position of the pin member 4.7 of the circuit board 1, and the through hole 6.8 is opened to correspond to the position of the pin member 4.7 of the circuit board 1.
11... are formed between these through holes 6.8 at the same intervals as the terminal electrodes 3.3.... As shown in FIG. 2, the through hole 6 on the side in which the pin terminal 4 is fitted, which has a flange 5.5', has a size slightly larger than that of the lower flange 5 so that the lower flange 5 can be easily fitted therein. It consists of an opening part 6a and a slit part 6a connected to the opening part 6a, and is formed so as to form a T-shape as a whole. The width of the slit portion 6a is slightly wider than the thickness of the pin member 4. In FIGS. 2(a) and 2(b), a pin member 4 is inserted into this through hole 6.
This shows the procedure for fitting the . That is, first, the flange 5 is fitted into the large opening 6a, and when the lower flange 5 passes under the row circuit board 10, the pin terminal 4 is inserted into the slit as shown by the two-dot chain line in FIG. 2(a). Push it into the part 6b side. As a result, the row circuit board 10 is sandwiched between the two flanges 5.5', and the circuit board 1 and the row circuit board 10 are connected via the pin member 4. On the other hand, the through hole 8 into which the pin member 7 having no flange 5.5' is fitted has an elongated slit shape, as shown in FIG.
and are formed as an extension of each other. Also, this through hole 8
2(a), the position covers the locus of movement of the pin member 7 when pushing the pin terminal 4 into the slit 6b through the opening 6a of the through hole 6. It is formed only by the length. Therefore, when the pin member 4 side is fitted into the through hole 6, the pin member 7 slides along the through hole 8. Note that when a flange 5.5' similar to that of the pin member 4 is provided on the pin member 7 side instead of this,
Needless to say, in order to fit this, a T-shaped through hole 6 similar to that described above is provided in place of the through hole 8. In this way, with the circuit board 1 temporarily fixed on the row circuit board 10 using the pin member 4.7, the land electrode 1
1, 11, . . . are formed at positions substantially in contact with the terminal electrodes 3, 3, . This land electrode 11.11...
・Apply paste solder on the top of the terminal electrode in advance and temporarily fix it. 3. Solder 3... to the land electrodes 11, 11... In this case, if the pin member 4.7 is made of a good conductor, a conductive film is also formed on the wall surface of the through hole 6.8 in advance, and the pin members 4 and 7 are soldered thereon. As a result, the circuit board 1 is fixed to the row circuit board 10, and the circuit board 1 is fixed to the row circuit board 10. These circuits are electrically connected. Next, the embodiment shown in FIG. 3 will be explained. In this embodiment, only one flange 5 is provided on the pin member 4, and the lower edge surface of the circuit board 1 is provided in place of the other flange 5'. used. Accordingly, the distance between the flange 5 and the lower edge surface of the circuit board 1 is
The thickness is set slightly wider than the thickness of the row circuit board 0 on which the circuit board 1 is mounted. The other mountings and the method of mounting the circuit board 1 are the same as in the embodiments shown in FIGS. 1 and S. [Effects of the Invention] As described above, according to the present invention, it is possible to attach the circuit board 1 to the row circuit board 10 for half a day with the circuit board 1 temporarily attached to the row circuit board 10. ζ mounted on the mother circuit board 10,
It is possible to provide an electronic component that can be soldered and a method for mounting it on a WI, thereby achieving the purpose of the first period.
阪 第１図は、本発明の実施例による混成集積口ｉ
路基板とそれを搭載する行回路基板の分解した状態
の斜視図、第２図（ａ）は、同混成集積回路基板と行回
路基板のピン部材部分の要部横断ラ 平面図、同図（
ｂ）は、同（ａ）のＢ−Ｂ線断面図、第３図は、他の実
施例による混成集積回路基板の要部側面図、第４図は、
従来例による） 混成集積回路基板とそれをＨ！ｌ載
する行回路基板ｌ の分解した状態の斜視図、第５
図は、他の従来χ 例による混成集積回路基板の斜視
図である。
２ １・・・回路基板 ３・・・端子電極 ４．７・
・・ピン端子 ５．５′・・・フランジ ６．８・・・
貫通孔 １０・・・行回路基板
（特許出願人 太陽誘電株式会社
１ 代 理 人 弁理士北條和由？Figure 1 shows a hybrid accumulation port i according to an embodiment of the present invention.
Figure 2(a) is an exploded perspective view of the integrated circuit board and the row circuit board on which it is mounted, and a cross-sectional plan view of the main parts of the pin member portion of the hybrid integrated circuit board and the row circuit board (Fig.
b) is a sectional view taken along the line B-B in (a), FIG. 3 is a side view of the main parts of a hybrid integrated circuit board according to another embodiment, and FIG.
Based on conventional example) Hybrid integrated circuit board and H! 5th perspective view of the exploded state of the row circuit board l mounted on the
The figure is a perspective view of a hybrid integrated circuit board according to another conventional example. 2 1... Circuit board 3... Terminal electrode 4.7.
...Pin terminal 5.5'...Flange 6.8...
Through hole 10... row circuit board (Patent applicant: Taiyo Yuden Co., Ltd. 1 Agent: Kazuyoshi Hojo, patent attorney)
Claims (3)
１の縁部に形成された端子電極３、３・・・の列とを有
する電子部品であって、前記端子電極３、３・・・の列
が形成された縁部にピン部材４が突設され、該ピン部材
４に回路基板１の縁面とほぼ平行なフランジ５、５’が
少なくとも１片形成されていることを特徴とする電子部
品。(1) An electronic component comprising a circuit board 1 on which an electronic circuit is configured and a row of terminal electrodes 3, 3, . . . formed on the edge of the circuit board 1, the terminal electrodes 3, A pin member 4 is provided protruding from the edge where the rows of . Featured electronic components.
１の縁部に形成された端子電極３、３・・・の列とを有
し、さらに、前記端子電極３、３・・・の列が形成され
た縁部にピン部材４が突設され、該ピン部材４に回路基
板１の縁面とほぼ平行なフランジ５、５’が少なくとも
１片形成されている電子部品と、 前記フランジ５より広い開口部６ａと、前記ピン部材４
より僅かに広いスリット部６ｂとからなる貫通孔６と、
前記端子電極３、３・・・の列と同じピッチで電極パッ
ド１１、１１・・・が形成された母回路基板１０とを用
意し、 前記ピン部材４に取り付けられたフランジ５を母回路基
板１０の貫通孔６の開口部６ａから挿入し、さらにピン
部材４をスリット部６ｂに押し込んで、回路基板１を母
回路基板１０の上に起立した状態で保持し、さらに前記
端子電極３、３・・・を電極パッド１１、１１・・・に
半田付けすることを特徴とする電子部品の実装方法。(2) It has a circuit board 1 on which an electronic circuit is configured and a row of terminal electrodes 3, 3, . . . formed on the edge of the circuit board 1; An electronic component in which a pin member 4 is protruded from the edge where the rows are formed, and at least one flange 5, 5' substantially parallel to the edge surface of the circuit board 1 is formed on the pin member 4; An opening 6a wider than the flange 5 and the pin member 4
A through hole 6 consisting of a slightly wider slit portion 6b,
A mother circuit board 10 is prepared in which electrode pads 11, 11, . . . are formed at the same pitch as the rows of the terminal electrodes 3, 3, . 10 through the opening 6a of the through hole 6, and then push the pin member 4 into the slit 6b to hold the circuit board 1 upright on the mother circuit board 10, and then . . . is soldered to electrode pads 11, 11 . . .
が良導体で形成され、これら貫通孔６の壁面に形成され
た導体層に電気的に接続されたことを特徴とする電子部
品の実装方法。(3) In Claim 2, the pin member 4
A method for mounting an electronic component, characterized in that the through holes 6 are made of a good conductor and are electrically connected to a conductor layer formed on the wall surface of the through holes 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2282464A JPH04155991A (en) | 1990-10-19 | 1990-10-19 | Electronic parts and their mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2282464A JPH04155991A (en) | 1990-10-19 | 1990-10-19 | Electronic parts and their mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04155991A true JPH04155991A (en) | 1992-05-28 |
Family
ID=17652770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2282464A Pending JPH04155991A (en) | 1990-10-19 | 1990-10-19 | Electronic parts and their mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04155991A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1035759A3 (en) * | 1999-03-11 | 2003-02-12 | Lucent Technologies Inc. | Edge-mountable integrated circuit package and method of attaching the same to a printed wiring board |
-
1990
- 1990-10-19 JP JP2282464A patent/JPH04155991A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1035759A3 (en) * | 1999-03-11 | 2003-02-12 | Lucent Technologies Inc. | Edge-mountable integrated circuit package and method of attaching the same to a printed wiring board |
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