JPH04164304A - Chip part for electronic circuit - Google Patents

Abstract

PURPOSE:To manufacture the title chip part in less stress concentration capable of avoiding any defective connection to a conductive paste and the electrical shortcircuit between electrodes by forming oblique electrodes in the chip part. CONSTITUTION:The title chip part is manufactured by forming and setting the electrodes 2 using an electrode forming conductive paste discharged onto both ends of the main body 1 from a rated volume discharging device. A wiring 4 is formed on a substrate 3 and after mounting said chip part through the intermediary of the conductive paste 5 printed on the wiring 4, the whole surface is coated with a sealing regin 6. Through these procedures, the chip part, when mounted, is structured in less stress concentration and relatively wide bonding area onto the wiring 4 of the substrate 3 furthermore, in intensive connection strength even if it is connected using a bit of conductive paste in the printing mode, etc., so that the connection in high reliability and resistant to the stress may be made.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to chip components for electronic circuits.

[Conventional technology]

Conventional chip components for electronic circuits (hereinafter referred to as chip components)
As shown in FIGS. 4 and 6, electrodes 2 are formed at the ends of a rectangular parallelepiped or cylindrical main body 1. This electrode 2
This is a shape in which the bottom and part of the side surfaces of the main body 1 are covered with a conductive material having a certain thickness.

Chip components are usually made with the assumption that they will be connected by soldering, and as shown in FIG. The connection area of the connection portion is small, and the connection has a shape that is weak in terms of stress.

[Problem to be solved by the invention]

When connecting a chip component to an external circuit such as a circuit board, the simplest method is to print conductive paste in advance on the part of the circuit board etc. where the connection is planned, place the chip component there, and allow the conductive paste to harden and connect. There is a way to do it.

For conventional chip components - When connecting using this method, there are limitations due to the thickness of the conductive paste applied by printing, and the types of components that can be mounted on the same board at the same time. As a result, the connection strength is structurally insufficient, and the applied mechanical and thermal stress can cause the conductive paste at the connection part to crack, resulting in connection failure. be.

Furthermore, even if a sufficient amount of conductive paste can be applied onto a circuit board, etc. by transferring or dispensing the paste, when a chip component is mounted thereon, the conductive paste at the bottom of the chip component may be pushed out. There was a problem in that the extruded conductive paste caused an electrical short circuit between the electrodes of the chip component.

An object of the present invention is to provide a chip component that is free from poor connection of conductive pastes and electrical short circuits between electrodes.

[Means to solve the problem]

In the electronic circuit chip component of the present invention, the area of the connection surface of the electrode connected to the wiring of an external circuit is increased, and the end face has a slope.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a side view of a first embodiment of the invention.

In the first embodiment, as shown in FIG. 1, first, a main body part 1 and a part of an electrode 2 are formed by the same method as in the conventional method. Next, the chip component forming part of the electrode 2 is placed on a heat-resistant tape with poor adhesion, and the conductive paste for electrode formation is discharged onto both ends of the main body 1 using a quantitative dispensing device. Then, the electrode 2 is formed and hardened. Finally, the heat-resistant tape is peeled off to obtain the chip component of the first example.

Next, to give a dimensional example, in FIG. 1, the height is 1 mm, and the length of the upper part of the electrode is 0.5 mm.

A chip component having an electrode with a length of 1 mm at the bottom of the electrode can be obtained.

FIG. 2 is a sectional view of the chip component shown in FIG. 1 mounted on a board.

As shown in FIG. 2, a wiring 4 is formed on a substrate 3, and the chip component of the first embodiment shown in FIG. 1 is mounted on this wiring 4 via a printed conductive paste 5. , covered with sealing resin 6.

As described above, when a chip component is mounted, stress due to the difference in thermal expansion of each material and mechanical stress are applied to the chip component during the process, but the chip component according to this example has a structure that reduces stress concentration. The bonding area between the board 3 and the wiring 4 is relatively large, and the connection strength is high even with a small amount of conductive paste 5 using a printing method, etc., and the connection is resistant to stress and has high reliability. You can get it.

To give an example of a comparison between a conventional product having a common main body 1 and a product according to this embodiment, the connection strength of the former is approximately 1, Okgf.
On the other hand, the latter is more than 2.5 kgf.

FIG. 3 is a side view of a second embodiment of the invention.

In the second embodiment, as shown in FIG. 2, the main body l formed by mold resin sealing or the like has t[!] similar to the first embodiment. 2, and obtains the same effect.

〔Effect of the invention〕

As explained above, the present invention has a structure in which the end face of each electrode of a chip component is inclined, thereby reducing stress concentration and increasing the connection area. This has the effect that a highly reliable connection can be realized even with a small amount of conductive paste.

[Brief explanation of the drawing]

FIG. 1 is a side view of the first embodiment of the present invention, and FIG. 2 is a side view of the first embodiment of the present invention.
3 is a side view of the embodiment of the present invention shown in FIG. 2, FIG. 4 is a side view of an example of a conventional chip component, and FIG. 5 is a sectional view of the chip component shown in FIG. FIG. 6 is a cross-sectional view of a chip component mounted on a board, and FIG. 6 is a side view of another example of the conventional chip component. 1... Main body, 2... Electrode, 3... Substrate, 4...
- Wiring, 5... Conductive paste, 6... Sealing resin.

Claims (1)

[Claims] A chip component for an electronic circuit, characterized in that the area of the connection surface of an electrode connected to the wiring of an external circuit is increased so that the end face has a slope.