JPH04173585A - Package for chip-shaped electronic component - Google Patents

Abstract

PURPOSE:To reduce a relative moving distance between a chuck mechanism to take out a chip-shaped electronic component and a package by a method wherein when a chip shaped electronic component series, which has a tape shape, is pulled out, a winding core which is rotatably held by first and second wall materials is rotated. CONSTITUTION:On a first wall material 11, an expanded part 17 which provides a recessed part 16 to store a chip-shaped electronic component series 2 which is wound around a winding core 10 is formed. The forming of such an expanded part 17 is performed by embossing process. On the expanded part 17, a first bearing hole 18 which receives a first circular stage part 14 of the winding core 10 rotatably, and a window 19 from which the chip shaped electronic component series 2 is pulled out are formed. On a second wall material 12, a second bearing hole 20 which receives a second circular stage part 15 of the winding core 10 rotatably is formed. Also, the second wall material 12 is joined to the first wall material 11 in such a manner that the second wall material 12 closes the opening of the recessed part 16 formed on the first wall material 11. For the joining, e.g. heat-welding is used.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a package for a chip-shaped electronic component, and in particular, a package containing a chip-shaped electronic component for automatic mounting. The present invention relates to a packaging form for removably storing a series of tape-shaped chip-shaped electronic components in which a plurality of cavities are distributed in the length direction.

[Prior Art] When automatically mounting a chip-shaped electronic component onto a printed circuit board, etc., a tape-shaped chip-shaped component in which a plurality of cavities storing the chip-shaped electronic components are distributed in the length direction is used. An electronic component chain is advantageously used.

Such a series of tape-shaped chip-shaped electronic components is usually wound on a reel and shipped from the chip-shaped electronic component manufacturer, and the consumer of the chip-shaped electronic components The reel is directly attached to the automatic mounting machine. In an automatic mounting machine, tape-shaped chip-shaped electronic components are pulled out from a reel, and the chip-shaped electronic components stored in the cavity are taken out one after another.
It is automatically mounted on a printed circuit board, etc.

[Problems to be Solved by the Invention] However, in the package for a chip-shaped electronic component as described above, the following problems were involved in using a reel to be solved.

First, the outer width of the reel is relatively large compared to the width of the tape-like chip-like electronic component series. Currently, due to the thickness of the flange provided on the reel, the outer width of the reel is approximately twice as large as the width of the tape-shaped chip-shaped electronic component series. Therefore, in automatic mounting machines for chip-shaped electronic components,
A space for mounting such a reel is required to be at least twice as wide as the width of the series of chip-shaped electronic components in the width direction of the reel.

A typical automatic mounting machine can hold 10 reels like this.
It is possible to attach about 0 reels, but as mentioned above, if space is taken up for attaching the reel,
The automatic mounting machine occupies a large floor area, which becomes an obstacle to improving productivity per unit area.

In addition, as mentioned above, since the reel has a relatively large outer width, the packaging volume per unit of chip-shaped electronic components becomes large during transportation, and as a result,
This results in increased transportation costs.

Therefore, it is an object of the present invention to provide a package for chip-shaped electronic components that does not use reels as described above and that can solve the problems posed by reels.

[Means for Solving the Problems] The chip-shaped electronic components packaged by the package according to the present invention are in the form of a series of tape-shaped chip-shaped electronic components. That is, a tape-like series of chip-like electronic components is used in which a plurality of cavities containing chip-like electronic components are distributed in the length direction. Such a series of chip-shaped electronic components is wound around a winding core. The series of chip-shaped electronic components wound around the core is housed in a recess provided by a bulge formed in the first wall material. A first bearing hole for rotatably receiving the first end of the winding core and a window for drawing out the series of chip-shaped electronic components are formed in this bulge. Also,
A second wall member is provided having a second bearing hole for rotatably receiving the second end of the winding core, the second wall member being adapted to close the opening of the recess provided by the bulge. is joined to the first wall material.

[Operation] The package for a chip-shaped electronic component according to the present invention is transported in its original form and is mounted on an automatic mounting machine. In an automatic mounting machine, when a series of tape-shaped chip-shaped electronic components is pulled out, the first and second
A winding core rotatably held in the wall material rotates to permit such withdrawal.

[Effects of the Invention] As described above, according to the present invention, the first and second wall materials and the winding core function as a conventional reel. The first and second wall materials can be composed of, for example, relatively thin plates of plastic, and if necessary,
The side end portions of the series of chip-shaped electronic components wound around the core can be brought into contact with the inner surface of the bulge portion of the first wall material. Therefore, the outer width provided by the first and second wall members can be reduced in size compared to the outer width of conventional reels.

Therefore, the space required to mount a predetermined number of packages on an automatic mounting machine can be reduced compared to the case where reels are used, and the floor space occupied by the automatic mounting machine can be reduced. productivity can be improved. In addition, given the same amount of space on an automatic mounting machine, more packages can be mounted than when using a reel. Many types of electronic parts can be made.

In addition, since the distance between each package arranged on the automatic mounting machine can be reduced, in the automatic mounting machine, the gap between the packages and the chuck mechanism for taking out the chip-shaped electronic components from the individual chip-shaped electronic component series can be reduced. Since the relative movement distance can be reduced, the automatic mounting process can be made faster.

Furthermore, the package according to the present invention can reduce the packaging volume per unit of chip-shaped electronic components compared to the case where a conventional reel is used, and therefore can reduce transportation costs.

Furthermore, since the first and second wall materials used in the package according to the present invention can be made of plastic plates, etc., as described above, their own manufacturing costs are reduced compared to conventional reels. can be reduced.

In addition, since the winding core around which the series of chip-shaped electronic components is wound is already rotatably held by the first and second wall materials, when such a package is mounted on an automatic mounting machine, The second wall material does not need to be rotatably held like a reel. Therefore, the mechanism for mounting the package in the automatic mounting machine can be simplified.

Embodiment FIG. 1 is a perspective view showing a package 1 according to an embodiment of the present invention. FIG. 2 is a sectional view taken along line nm in FIG. 1.

1 and 2, a series of tape-shaped chip-shaped electronic components 2 is schematically shown.

The detailed structure of this chip-shaped electronic component series 2 is shown in FIG.

Referring to FIG. 3, the chip-shaped electronic component series 2 includes a tape-shaped storage body 4 in which a plurality of cavities 3 are distributed in the length direction. A chip-shaped electronic component 5 is housed within each cavity 3.

In this embodiment, the tape-shaped storage body 4 is a bottom tape 6.
, has a three-layer laminated structure consisting of a storage tape 7 and a top tape 8. The cavity 3 described above is provided as a hole passing through the storage tape 7, and the bottom tape 6 and the top tape 8 are attached to the storage tape 7 so as to close the openings on the lower and upper surfaces of the cavity 3, respectively. . Further, the storage tape 7 is provided with a plurality of feed holes 9 in a fixed positional relationship with the cavity 3.

Note that the chip-shaped electronic component series 2 may be replaced with a structure other than that shown in Figure jIa.

The chip-shaped electronic component chain 2 is wound around the winding core 1o,
This winding core 10 has a first wall material 11 and a second wall material 12.
Rotatably held by.

Details of the structure of the winding core 10 and the first and second wall members 11 and 12 will be described with reference to FIG. 4 in addition to FIGS. 1 and 2.

The winding core 10 has a through hole 13 at its center.

The through hole 13 preferably has a cross-sectional shape such that it receives a knurled shaft and is prevented from rotating thereabout. A first circular stepped portion 14 having a relatively small diameter is provided at the first and second ends of the winding core 1o, respectively.
And a second circular step portion 15 is formed.

The first and second wall materials 11 and 12 are made of, for example, plastic plates with a thickness of about 0.5 mm.

The first wall material 11 has a bulge 17 that provides a recess 16 for accommodating the series of chip-shaped electronic components 2 wound around the winding core 10.
is formed. Formation of such a bulging portion 17 is performed, for example, by embossing. The bulging portion 17 is formed with a first bearing hole 18 for rotatably receiving the circular stepped portion 14 of the core 10, and a window 19 for drawing out the series of chip-shaped electronic components 2.

A second bearing hole 20 is formed in the second wall material 12 to rotatably receive the second circular stepped portion 15 of the winding core 10 .

Further, the second wall material 12 is joined to the first wall material 11 so as to close the opening of the recess 16 formed in the first wall material 11. For example, thermal welding is used for this joining.

To obtain the package 1 shown in FIGS. 1 and 2,
First, the first wall material 11 is set in a winder (not shown), and the winding shaft of the winder is received in the bearing hole 18 on the east side. A knurling is formed on this winding shaft.

Next, the winding core 10 is fitted onto the winding shaft. At this time, mutual rotation is prohibited between the winding shaft and the winding core 10, and the rotation of the winding shaft is reliably transmitted to the winding core 10.

Next, the chip-shaped electronic component chain 2 is passed through the window 19 of the first wall material 11, and its end portion is fixed to the outer circumferential surface of the winding core 10.

Next, the second wall material 12 is set on the winder.

In this state, the winding shaft of the winder is rotated, and the winding core 10 is rotated, whereby the series of chip-shaped electronic components 2 is wound around the winding core 10.

When winding of the chip-shaped electronic component series 2 of a predetermined length is finished,
The core 10 is removed from the winder together with the first and second wall members 11 and 12.

Next, the first wall material 11 and the second wall material 12 are joined to each other.

In this way, a package 1 as shown in FIGS. 1 and 2 is obtained.

The chip-shaped electronic component 5 is shipped in the form of such a package 1. Furthermore, on the consumer side, the package 1 is mounted on an automatic mounting machine in its original form.

5 and 6 show the state in which the package 1 is mounted on an automatic mounting machine in a top view and a front view, respectively.

5 and 6, a cassette 21 for mounting the package 1, which forms part of an automatic mounting machine, is shown. The cassette 21 can be attached to and detached from the main body of the automatic mounting machine while holding the package 1.

The cassette 21 includes a pedestal 22 having a shape that substantially follows the outer shape of the package 1. A positioning groove 23 is provided on the inner surface of the base 22. The positioning groove 23 positions the package 1 by receiving the outer peripheral portion of the package 1 therein.

A series of chip-shaped electronic components 2 pulled out from a package 1 mounted on a cassette 21 is guided onto a table 24 extending from a pedestal 22 and guided under a holding plate 25. A sprocket wheel is attached to the end of the table 24, and when the sprocket wheel is rotated while the sprocket 26 formed on the sprocket wheel is engaged with the feed hole 9 of the chip-shaped electronic component series 2, the chip is rotated. A series of electronic components 2 are sent. A window 27 is formed in the pressing plate 25, and the top tape 8 of the series of chip-shaped electronic components 2 is peeled off through this window 27, and this top tape 8 is wound up on a take-up roll 28. When the top tape 8 is peeled off, the upper surface opening of the cavity 3 (FIG. 3) is opened, and the chip-shaped electronic component 5 housed therein is transferred to the chuck mechanism (not shown).
and subjected to an automatic mounting process.

FIG. 7 shows a first wall material 2 provided in another embodiment of the present invention.
9 and a perspective view showing the second wall material 3o.

The first and second wall materials 29 and 30 shown in FIG. 7 are characterized in that they are integrally formed with a bent portion 31 interposed therebetween. According to this embodiment, the first and second wall members 29
and 30 can be more easily combined and joined together.

In addition, in FIG. 7, the recess 3 formed in the first wall material 29
2 and a second bearing hole 33 formed in the second wall material 30
is illustrated.

FIG. 8 shows a first embodiment included in yet another embodiment of the present invention.
FIG. 3 is a cross-sectional view showing only the respective sections of the wall material 34 and the second wall material 35;

In this embodiment, a joining tape 36 is used to join the first wall material 34 and the second wall material 35 to each other. The joining tape 36 is made of, for example, a film having a two-layer structure of polyester and polyethylene, and is joined to the first and second wall materials 34 and 35 by thermal welding.

Note that a pressure-sensitive adhesive film may be used instead of the joining tape 36 as described above.

In addition, in FIG. 8, in the first wall material 34, the recess 37
Also shown is a bulge 38 that provides a.

In the package 1 according to the present invention, for example, as shown by imaginary lines in FIG.
It may also be pasted on the outer circumferential surface of the bulged portion 17. This display label 39 is used to indicate the type, etc. of the chip-shaped electronic component 5 housed in the package 1. If the display label 39 is attached to such a position, the display label 39 can be visually checked even when the display label 39 is attached to the automatic mounting machine.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a package 1 according to an embodiment of the present invention. FIG. 2 is a sectional view taken along the line ■--■ in FIG. 1. FIG. 3 is a plan view showing details of the structure of the chip-shaped electronic component array 2 shown in FIGS. 1 and 2. FIG. FIG. 4 shows the winding core 10 shown in FIGS. 1 and 2. 1st
FIG. 3 is an exploded perspective view showing the wall material 11 and the second wall material 12 of FIG. FIG. 5 is a top view showing the state in which the package 1 is mounted on a cassette 21 provided in an automatic mounting machine. FIG. 6 is a front view of the state shown in FIG. 5. FIG. 7 is a perspective view showing first and second wall members 29 and 30 in another embodiment of the invention. FIG. 8 shows a first embodiment included in yet another embodiment of the present invention.
FIG. 3 is a cross-sectional view showing each section of second wall materials 34 and 35. In the figure, 1 is a package, 2 is a chain of chip-shaped electronic components, 3 is a cavity, 4 is a tape-shaped storage body, 5 is a chip-shaped electronic component, 10 is a winding core, 11, 29° 34 is a first wall material, 12.30.35 is the second wall material, 14 is the first circular step (first end), 15 is the second circular step (second end), 16. 32.degree. 37 is a recessed portion, 17.38 is a bulge, 18 is a first bearing hole, 19 is a window, and 20.33 is a second bearing hole. Figure 5 Figure 6 Figure 7 Figure 8

Claims (1)

[Scope of Claims] A tape-shaped series of chip-shaped electronic components in which a plurality of cavities storing chip-shaped electronic components are distributed in the length direction; A bulge is formed in the bulge to provide a recess for accommodating the winding core, and the series of chip-shaped electronic components wound around the winding core. a first wall material formed with a first bearing hole for rotatably receiving a first end of the core, and a window for drawing out the series of chip-shaped electronic components; and a second end of the core. a second wall material having a second bearing hole for rotatably receiving the second wall material and joined to the first wall material so as to close the opening of the recess provided by the bulge; A package for chip-shaped electronic components.