JPH04178605A - Optical semiconductor device - Google Patents

Abstract

PURPOSE:To maintain the airtightness of an optical semiconductor element and to prevent the deterioration thereof by treating a coaxial optical semiconductor module so that the front end of the cap of the optical semiconductor element is not wetted with molten solder in a holder fixing stage. CONSTITUTION:An optical fiber 1 and an optical lens 2 are fixed by a resin and the optical semiconductor element 3 is fixed by the solder 5. The holder 4 is applied with nickel-gold alloy so as to be well wetted with the solder 5. The nickel-gold alloy is similarly applied on the cap part 31 of the optical semiconductor element 3. The front end part of the cap part 31 is previously subjected to a resin coating 32 of 'Teflon(R)', etc., to prevent the wetting with the solder 5. The solder 5 is heated and melted by a high-frequency heating machine and infiltrates into the inside wall between the cap part 31 and the holder 4 and wets this wall, but this solder is repeled by the part of the resin coating 32. Since the neighborhood of the cap glass 33 is not heated by the solder 5, the cap glass 33 is kept free from the crack, etc., and the airtightness of the optical semiconductor element 3 is maintained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an optical semiconductor device, and more particularly to an optical semiconductor device in which an optical fiber and an optical semiconductor element sealed in a package with an entrance window are configured coaxially.

[Conventional technology]

As shown in FIG. 3, a conventional optical semiconductor device having a coaxial optical semiconductor module structure includes an optical fiber 1, an optical lens 2, an optical semiconductor element 3, and a holder 4 for fixing each of the above-mentioned members. It was composed of.

The optical fiber 1 and the optical lens 2 are fixed in advance to the holder 4 with resin acid or solder, and then the optical semiconductor element 3 is fixed.
It was common practice to use solder 5 to fix the holder at the optimum position.

A specific method for fixing the semiconductor element 3 to the holder 4 with solder 5 was as follows.

A ring-shaped solder 5 is sandwiched between the holder 4 and the optical semiconductor element 3, and the solder 5 is melted using a high-frequency heater or the like to fill the gap between the holder 4 and the optical semiconductor element 3. Ta.

[Problem to be solved by the invention]

The above-mentioned conventional coaxial optical semiconductor module uses solder to fix the optical semiconductor element to the holder, but during this measurement process, the solder flows to the tip of the cap of the optical semiconductor element, causing the crow on the cap to The glass is heated by melted solder, causing thermal distortion between the cap metal and the glass, and the rapid heating of the glass causes distortion due to the difference in expansion between the inside and outside of the glass, which causes cracks in the glass and separation from the cap metal. However, there is a drawback that the airtightness of the cap is broken, leading to deterioration of the optical semiconductor element.

[Means to solve the problem]

The optical semiconductor device of the present invention is a coaxial optical semiconductor device in which an optical semiconductor element including a package having a cap glass window for optical input/output on the head, an optical lens, and an optical fiber are connected by a holder that holds the package by soldering. In the optical semiconductor device configured as a module, the optical semiconductor element includes a solder wetting prevention means for preventing adhesion of molten solder during the soldering process to the package, which is located near the cap glass window at the front. It has the following.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a longitudinal sectional view showing one embodiment of the present invention.

In FIG. 1, the optical semiconductor device of the present invention is composed of an optical fiber 1, an optical lens 2, an optical semiconductor element 3, a holder 4, and solder 5, as in the conventional device.

The optical semiconductor element 3 includes a cap portion 31, a resin coating portion 32, and a cap glass 33.

An optical fiber 1, an optical lens 2, and an optical semiconductor element 3 are fixed and integrated by a holder 4.

The optical fiber 1 and the optical lens 2 are fixed with resin,
Optical semiconductor element 3 is fixed with solder 5.

The holder 4 is plated with nickel and gold so that the half FB 5 can be well wetted. Further, the cap portion 31 of the optical semiconductor element 3 is similarly plated with nickel and gold.

A resin coating 32 such as Teflon is applied to the front end portion of the cap portion 31 in advance to prevent the solder 5 from getting wet.

The solder 5 is heated and melted by a high-frequency heater, and infiltrates and wets the inner walls of the cap portion 3 and the holder 4, but is repelled by the resin coating 32.

Therefore, since the vicinity of the cap glass 33 is not heated by the solder 5, cracks or the like do not occur in the cap glass 33, and the optical semiconductor element 3 can be kept airtight.

FIG. 2 is a longitudinal sectional view showing a second embodiment of the invention.

The basic structure is the same as the first embodiment shown in FIG. 1, and the difference is that in this embodiment, only the rear part of the cap part 31 is plated with nickel and gold, and the front end part is plated with nickel only. The reason is that gold plating 34 is not applied.

Therefore, the solder 5 only wets the gold plating 34 of the cap 31 and the inner wall of the holder 4, and the area near the cap glass 33 at the front end of the cap part 31 is less likely to get wet, so the high temperature solder is repelled and the cap glass Never heat.

〔Effect of the invention〕

As explained above, the present invention can maintain the airtightness of the optical semiconductor element by treating the front end portion of the cap of the optical semiconductor element of the coaxial optical semiconductor module so that it does not get wet with melted solder during the holder fixing process. There is an effect.

Therefore, there is an effect that a highly reliable and inexpensive optical semiconductor element can be provided.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention, FIG. 2 is a longitudinal sectional view showing a second embodiment of the invention, and FIG. 3 is a longitudinal sectional view showing an example of a conventional optical semiconductor device. It is. 1... Optical fiber, 2... Optical lens, 3...
Optical semiconductor element, 4... holder, 5... solder, 3]・
...Cap part, 32...Resin coating, 33.
...Cap glass, 34...Gold plated.

Claims (1)

[Scope of Claims] 1. An optical semiconductor element having a package having a cap glass window for optical input/output on the head, an optical lens, and an optical fiber are connected to a coaxial optical semiconductor by a holder that holds the package by soldering. In the optical semiconductor device configured as a module, the optical semiconductor element has the package in which a solder wetting prevention means for preventing adhesion of molten solder during the soldering process is provided near the cap glass window at the front part. An optical semiconductor device characterized by: 2. The optical semiconductor device according to claim 1, wherein the solder wetting prevention means is a resin coating. 3. The optical semiconductor device according to claim 1, wherein the solder wetting prevention means is a metal plating having low affinity for the molten solder. 4. The optical semiconductor device according to claim 4, wherein the metal is nickel.