JPH04240607A - Semiconductor laser device - Google Patents

Abstract

PURPOSE:To improve temp. characteristics and packaging property by simplifying a structure, allowing miniaturization and facilitating assembly. CONSTITUTION:A semiconductor laser 1 is mounted to a flat part of a base 4 via a heat sink 2 and a chip carrier 3. A spherical end optical fiber 9 protected by a ferrule 7 at the front end is fixed by YAG welding via a slide ring 6 to the tubular part 4a at the front end of the base 4. The ferrule 7 and a metallic case 11 are connected and sealed by solder 8. The need for using a condenser lens is eliminated in this way and the correspondingly compact coupling system is obtd. The base 4 and the tubular part 4a at the front end of the base are integrated in this way and since the spherical end optical fiber 9 is fixed thereto, the coupling optical system is stably supported and the fluctuations in the output occurring in the creep phenomena by temp. cycles are decreased.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates primarily to a semiconductor laser device equipped with an optical fiber for light output, and in particular to a semiconductor laser device that can be miniaturized, has excellent temperature characteristics, is easy to assemble, and is easy to mount. This invention relates to a laser device.

0002

2. Description of the Related Art Conventional semiconductor laser devices are roughly divided into two types. One type is a semiconductor laser device as shown in FIG.
In order to efficiently supply the light output to the optical fiber, it is necessary to have a metal base 14 having a condensing lens 15 and a structure for holding the condensing lens. Another method is to fix the tip fiber 9 with solder 8 after making adjustments to efficiently couple the optical output of the semiconductor laser 1 to the optical fiber 9, as shown in FIG.

0003

[Problems to be Solved by the Invention] Among the conventional semiconductor laser devices described above, the type that is adjusted and fixed by a slide ring 6 using a condensing lens has a long coupling system, and also has problems in that the condensing lens 15 itself and The disadvantage is that the metal base 14 that holds the condensing lens occupies a large proportion of the semiconductor laser device, which limits miniaturization.

The type in which the tip fiber 9 is fixed with solder 8 has the disadvantage that the coupling system fluctuates due to the solder creep phenomenon. That is, there has been no semiconductor laser device that satisfies both the requirements of a stable coupling system and a compact size.

[0005]

[Means for Solving the Problems] A semiconductor laser device of the present invention includes a semiconductor laser, a chip carrier, a metal base, an optical fiber for light output, and a metal case having an introduction hole in a side wall through which the optical fiber passes. , a semiconductor laser device in which the semiconductor laser is mounted on a flat part of the metal base via the chip carrier, the metal base is fixed inside the metal case, and the optical fiber is inserted through the introduction hole, The optical fiber is a bulbous optical fiber whose tip end is protected by a metal tube, and the metal base has a tubular portion having a through hole, and the metal tube portion of the optical fiber and the metal are connected through a slide ring. The optical fiber and the semiconductor laser are optically coupled by fixing the tubular portion of the base by YAG welding.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a side view showing the structure of an embodiment of a semiconductor laser device according to the present invention. In the figure, a semiconductor laser 1 is mounted on a flat portion of a base 4 via a heat sink 2 and a chip carrier 3. A tipped optical fiber 9 whose tip is protected by a ferrule 7 is fixed to the tip (tubular portion) 4a of the base 4 by YAG welding via a slide ring 6. The ferrule 7 and the metal case 11 are connected and sealed with solder 8. In the case of this structure, the coupling system that does not use a condensing lens is compact, and can be made about 3 mm thinner than a conventional semiconductor laser device. In addition, the base 4 on which the chip carrier 3 is mounted and the base tip to which the tip optical fiber is fixed are integrated, and the tip optical fiber is fixed by YAG welding to the base tip 4a via a slide ring. As a result, the coupling optical system is stably supported, and almost no Pf fluctuation is observed during a temperature cycle of 1° C./min, where a creep phenomenon is significantly observed, and ΔPf is stable within 0.5 dB.

FIG. 2 is a side structural view of a second embodiment of the present invention. This figure is characterized in that the semiconductor laser device shown in Example 1 uses a tip optical fiber 9 having a structure in which a ferrule is divided into two parts. The rest is the same as the previous embodiment.

Since the semiconductor laser device of this embodiment has a short optical system, the length of the core wire between the two divided ferrules 7a and 7b can be set to approximately 5 mm.
1 strain on the bonding system can be minimized, and the Pf fluctuation at a temperature difference of 45°C is now ±0.5
While it was within dB, it was within ±0.3 dB.

[0009]

[Effects of the Invention] As explained above, the semiconductor laser device of the present invention can be downsized compared to the conventional structure, has excellent temperature characteristics, is easy to assemble, and is easy to mount. The effect of being superior can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a side structural view showing a first embodiment of a semiconductor laser device of the present invention.

FIG. 2 is a side structural view showing a second embodiment of the present invention.

FIG. 3 is a side structural view of a conventional semiconductor laser device.

FIG. 4 is a side structural view of a conventional example.

[Explanation of symbols]

1 Semiconductor laser 2 Heat sink 3 Chip carrier 4 Base 6 Slide ring 7 Ferrule 8 Solder 9 Tip optical fiber 11 Metal case 14 Base with lens

Claims (1)

[Claims] 1. Consisting of a semiconductor laser, a chip carrier, a metal base, an optical fiber for light output, and a metal case having an introduction hole in a side wall through which the optical fiber passes, the semiconductor laser is connected to the semiconductor laser via the chip carrier. A semiconductor laser device is mounted on a flat part of a metal base, the metal base is fixed inside the metal case, and the optical fiber is inserted through the introduction hole, wherein the optical fiber has a tip protected by a metal tube. The metal base has a tubular portion having a through hole, and the metal tube portion of the optical fiber and the tubular portion of the metal base are fixed by YAG welding via a slide ring. . A semiconductor laser device, characterized in that the optical fiber and the semiconductor laser are optically coupled.