JPH04180690A - Mounting board of power device - Google Patents
Mounting board of power deviceInfo
- Publication number
- JPH04180690A JPH04180690A JP31054990A JP31054990A JPH04180690A JP H04180690 A JPH04180690 A JP H04180690A JP 31054990 A JP31054990 A JP 31054990A JP 31054990 A JP31054990 A JP 31054990A JP H04180690 A JPH04180690 A JP H04180690A
- Authority
- JP
- Japan
- Prior art keywords
- thermal conductivity
- insulating layer
- power device
- electrical insulating
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、放熱のために金属基板を具備したパワーデバ
イス実装板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a power device mounting board provided with a metal substrate for heat radiation.
インバーターなど高発熱のパワーデバイス（パワー回路
部品）を実装する場合、その発熱を放熱する必要がある
ために、銅板やアルニミニウ板など熱伝導性の優れた金
属基板を用いて実装板を作成することがおこなわれてい
る。パワーデバイスの発熱は金属基板に伝熱され、金属
基板から放散されるのである。When mounting a power device (power circuit component) that generates a lot of heat, such as an inverter, it is necessary to dissipate the heat, so the mounting board is created using a metal substrate with excellent thermal conductivity, such as a copper plate or an aluminum plate. is being carried out. Heat generated by the power device is transferred to the metal substrate and radiated from the metal substrate.
第２図はこのような実装板Ａの一例を示すものであり、
パワーデバイス４は金属基板ｌに積層した電気絶縁層ｌ
Ｏの表面上に実装するようにしである。そしてこのもの
にあって、パワーデバイス４の他に他の回路部品５、例
えば熱の作用を受けると誤作動する熱に弱いＩＣなどを
実装する場合、パワーデバイスＡからの熱が金属基板１
を伝って回路部品５に作用することを防ぐ必要がある。FIG. 2 shows an example of such a mounting board A.
The power device 4 has an electrical insulating layer laminated on a metal substrate l.
It is intended to be mounted on the surface of O. In this case, when other circuit components 5 are mounted in addition to the power device 4, such as a heat-sensitive IC that malfunctions when exposed to heat, the heat from the power device A is transferred to the metal substrate 1.
It is necessary to prevent this from acting on the circuit components 5 through the transmission.
そこでこの場合には、パワーデバイス４を実装する箇所
以外の箇所において、ガラスエポキシ積層板など樹脂積
層板を基板として形成されるプリント配線板１１を接着
剤１２で電気絶縁層１０の表面に積層し、このプリント
配線板１１の上にこの回路部品５を搭載することによっ
て、パワーデバイス４からの発熱が回路部品５に伝わる
ことをプリント配線板１１で遮断するようにしている。Therefore, in this case, a printed wiring board 11 formed using a resin laminate such as a glass epoxy laminate as a substrate is laminated on the surface of the electrical insulating layer 10 with an adhesive 12 at a location other than the location where the power device 4 is mounted. By mounting this circuit component 5 on this printed wiring board 11, the printed wiring board 11 blocks the heat generated from the power device 4 from being transmitted to the circuit component 5.
しかしこのものでは、上記のようにプリント配線板１１
を用いる必要があるために、部品コストが高くなると共
にプリント配線板１１の加工コストも必要であり、製品
コストが高くなるという問題があった。However, in this case, as described above, the printed wiring board 11
Since it is necessary to use the same, there is a problem that the cost of parts increases and the cost of processing the printed wiring board 11 is also required, resulting in an increase in product cost.
本発明は上記の点に鑑みて為されたものであり、コスト
安価に製造することができるパワーデバイス実装板を提
供することを目的とするものである。The present invention has been made in view of the above points, and an object of the present invention is to provide a power device mounting board that can be manufactured at low cost.
本発明に係るパワーデバイス実装板は、金属基板１の表
面の一部に熱伝導性の高い電気絶縁層２を積層すると共
に他の一部に熱伝導性の低い電気絶縁層３を積層し、熱
伝導性の高い電気絶縁層２の表面に高発熱のパワーデバ
イス４を、熱伝導性の低い電気絶縁層３の表面に他の回
路部品５をそれぞれ実装して成ることを特徴とするもの
である〔作用〕
本発明にあっては、金属基板１の表面の一部に熱伝導性
の高い電気絶縁層２を積層すると共に他の一部に熱伝導
性の低い電気絶縁層３を積層し、熱伝導性の高い電気絶
縁層２の表面に高発熱のパワーデバイス４を、熱伝導性
の低い電気絶縁層３の表面に他の回路部品５をそれぞれ
実装するようにしているために、パワーデバイス４から
の発熱は熱伝導性の高い電気絶縁層２から金属基板１に
良好に伝えて放熱することかできると共に、金属基板ｌ
の熱か回路部品５に伝わることは熱伝導性の低い電気絶
縁層３て防ぐことかてきる。The power device mounting board according to the present invention has an electrical insulating layer 2 with high thermal conductivity laminated on a part of the surface of a metal substrate 1, and an electrical insulating layer 3 with low thermal conductivity on the other part, It is characterized in that a high heat generation power device 4 is mounted on the surface of an electrical insulating layer 2 with high thermal conductivity, and other circuit components 5 are mounted on the surface of an electrical insulating layer 3 with low thermal conductivity. [Function] In the present invention, an electrical insulating layer 2 with high thermal conductivity is laminated on a part of the surface of the metal substrate 1, and an electrical insulating layer 3 with low thermal conductivity is laminated on the other part. Since the power device 4 which generates high heat is mounted on the surface of the electrical insulating layer 2 with high thermal conductivity, and the other circuit components 5 are mounted on the surface of the electrical insulating layer 3 with low thermal conductivity, the power The heat generated from the device 4 can be efficiently transferred from the highly thermally conductive electrical insulating layer 2 to the metal substrate 1 and dissipated from the metal substrate 1.
The electrical insulating layer 3, which has low thermal conductivity, can prevent the heat from being transmitted to the circuit components 5.
以下、本発明を実施例によって詳述する。 Hereinafter, the present invention will be explained in detail with reference to Examples.
第１図は本発明の一実施例を示すものであり、銅板やア
ルミニウム板など熱伝導性に優れた金属板で作成される
金属基板１の表面には、パワーデバイス４を実装する箇
所において熱伝導性の高い電気絶縁層２が、その他の箇
所に熱伝導性の低い電気絶縁層３が、それぞれ積層しで
ある。これら電気絶縁層２，３はエポキシ樹脂などの樹
脂の層として形成してあり、熱伝導性の高い電気絶縁層
２はアルミナ等の熱伝導性の良好で且つ電気絶縁性を有
するフィラーを樹脂に８０〜９０重量％程度配合するこ
とによって形成することができ、また熱伝導性の低い電
気絶縁層３は樹脂にフィラーを配合しないかあるいは配
合量を少量に止めることによって形成することができる
。FIG. 1 shows an embodiment of the present invention, in which the surface of a metal substrate 1 made of a metal plate with excellent thermal conductivity such as a copper plate or an aluminum plate is heated at a location where a power device 4 is mounted. An electrically insulating layer 2 with high conductivity is laminated, and an electrically insulating layer 3 with low thermal conductivity is laminated at other locations. These electrical insulating layers 2 and 3 are formed as layers of resin such as epoxy resin, and the electrical insulating layer 2 with high thermal conductivity is made of resin with a filler such as alumina that has good thermal conductivity and electrical insulation properties. It can be formed by blending about 80 to 90% by weight, and the electrical insulating layer 3 with low thermal conductivity can be formed by not blending filler with the resin or by keeping the blending amount to a small amount.
上記のようにして作成される実装板Ａにあって、インバ
ータやサイリスタ、パワートランジスタ、コントローラ
基板などパワーデバイス（パワー回路部品）４は熱伝導
性の高い電気絶縁層２の表面に搭載して実装をおこなう
ものであり、またその他の回路部品５、例えばＩＣのよ
うに熱に弱い回路部品５は熱伝導性の低い電気絶縁層３
の表面に搭載して実装をおこなうものである。このとき
、各電気絶縁層２．３の表面に金属箔のエツチング加工
等で回路１３を形成しておいて、この回路にパワーデバ
イス４や回路部品５を接続するようにして実装をおこな
うことができる。In the mounting board A created as described above, power devices (power circuit components) 4 such as inverters, thyristors, power transistors, and controller boards are mounted and mounted on the surface of the electrical insulation layer 2 with high thermal conductivity. Other circuit components 5, such as circuit components 5 that are sensitive to heat, such as ICs, are coated with an electrical insulating layer 3 having low thermal conductivity.
The device is mounted on the surface of the device. At this time, it is possible to form a circuit 13 on the surface of each electrically insulating layer 2.3 by etching metal foil, etc., and to connect the power device 4 and circuit components 5 to this circuit for mounting. can.
しかして上記の実装板Ａにあって、パワーデバイス４か
らの発熱は熱伝導性の高い電気絶縁層２を介して良好に
金属基板！に伝わり、金属基板１から良好に放熱される
。また回路部品５は熱伝導性の低い電気絶縁層３の表面
に実装されているために、パワーデバイス４から金属基
板ｌに伝わった熱が回路部品５に伝わることをこの電気
絶縁層３で遮断され、パワーデバイス４の熱が回路部品
５に作用することを防ぐことができる。However, in the above-mentioned mounting board A, the heat generated from the power device 4 is transmitted through the highly thermally conductive electrical insulating layer 2 to the metal substrate! The heat is transmitted to the metal substrate 1, and the heat is well radiated from the metal substrate 1. Furthermore, since the circuit component 5 is mounted on the surface of the electrical insulating layer 3 with low thermal conductivity, the electrical insulating layer 3 blocks the heat transmitted from the power device 4 to the metal substrate l from being transmitted to the circuit component 5. This prevents the heat of the power device 4 from acting on the circuit components 5.
上述のように本発明にあっては、金属基板の表面の一部
に熱伝導性の高い電気絶縁層を積層すると共に他の一部
に熱伝導性の低い電気絶縁層を積層し、熱伝導性の高い
電気絶縁層の表面に高発熱のパワーデバイスを、熱伝導
性の低い電気絶縁層の表面に他の回路部品をそれぞれ実
装するようにしているために、パワーデバイスからの熱
は熱伝導性の高い電気絶縁層から金属基板に良好に伝え
て放熱することができると共に、パワーデバイスから金
属基板に伝えられた熱が回路部品に伝熱されることを熱
伝導性の低い電気絶縁層で防ぐことができ、回路部品に
パワーデバイスの熱が作用することを防止することがで
きるものである。As described above, in the present invention, an electrical insulating layer with high thermal conductivity is laminated on a part of the surface of the metal substrate, and an electrical insulating layer with low thermal conductivity is laminated on the other part, so that heat conduction is achieved. Because power devices that generate high heat are mounted on the surface of an electrical insulating layer with high thermal conductivity, and other circuit components are mounted on the surface of an electrical insulating layer with low thermal conductivity, heat from the power devices is dissipated by thermal conduction. The electrical insulating layer, which has a high thermal conductivity, can effectively transfer heat to the metal substrate and dissipate it, and the electrical insulating layer, which has a low thermal conductivity, prevents the heat transferred from the power device to the metal substrate from being transferred to the circuit components. It is possible to prevent the heat of the power device from acting on the circuit components.
第１図は本発明の一実施例の断面図、第２図は従来例の
断面図である。
１は金属基板、２は熱伝導性の高い電気絶縁層、３は熱
伝導性の低い電気絶縁層、４はパワーデバイス、５は回
路部品である。FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 1 is a metal substrate, 2 is an electrical insulating layer with high thermal conductivity, 3 is an electrical insulating layer with low thermal conductivity, 4 is a power device, and 5 is a circuit component.
Claims (1)
層を積層すると共に他の一部に熱伝導性の低い電気絶縁
層を積層し、熱伝導性の高い電気絶縁層の表面に高発熱
のパワーデバイスを、熱伝導性の低い電気絶縁層の表面
に他の回路部品をそれぞれ実装して成ることを特徴とす
るパワーデバイス実装板。(1) An electrical insulating layer with high thermal conductivity is laminated on a part of the surface of the metal substrate, and an electrical insulating layer with low thermal conductivity is laminated on the other part, and the surface of the electrical insulating layer with high thermal conductivity is laminated on the other part. A power device mounting board comprising a power device that generates high heat and other circuit components mounted on the surface of an electrical insulating layer with low thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2310549A JP2793356B2 (en) | 1990-11-15 | 1990-11-15 | Power device mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2310549A JP2793356B2 (en) | 1990-11-15 | 1990-11-15 | Power device mounting board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04180690A true JPH04180690A (en) | 1992-06-26 |
| JP2793356B2 JP2793356B2 (en) | 1998-09-03 |
Family
ID=18006576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2310549A Expired - Lifetime JP2793356B2 (en) | 1990-11-15 | 1990-11-15 | Power device mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2793356B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007019316A (en) * | 2005-07-08 | 2007-01-25 | Omron Corp | Component mounting board structure with heat dissipation function and manufacturing method of component mounting board structure with heat dissipation function |
| EP2416630A1 (en) * | 2010-08-05 | 2012-02-08 | Unimicron Technology Corp. | Circuit board and manufacturing method thereof |
| JP2012039070A (en) * | 2010-08-05 | 2012-02-23 | Kinko Denshi Kofun Yugenkoshi | Circuit board and manufacturing method of the same |
| CN102378477A (en) * | 2010-08-19 | 2012-03-14 | 欣兴电子股份有限公司 | Circuit board and manufacturing method thereof |
| CN102548191A (en) * | 2010-12-14 | 2012-07-04 | 欣兴电子股份有限公司 | Circuit board and manufacturing method thereof |
| TWI406602B (en) * | 2010-11-23 | 2013-08-21 | Unimicron Technology Corp | Wiring board and method for fabricating the same |
| US8598463B2 (en) | 2010-08-05 | 2013-12-03 | Unimicron Technology Corp. | Circuit board and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59146981U (en) * | 1983-03-22 | 1984-10-01 | 日本電気株式会社 | small circuit module |
| JPS6071195U (en) * | 1983-10-19 | 1985-05-20 | 赤井電機株式会社 | Heat dissipation device in printed circuit board |
| JPS6365261U (en) * | 1986-10-17 | 1988-04-30 |
-
1990
- 1990-11-15 JP JP2310549A patent/JP2793356B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59146981U (en) * | 1983-03-22 | 1984-10-01 | 日本電気株式会社 | small circuit module |
| JPS6071195U (en) * | 1983-10-19 | 1985-05-20 | 赤井電機株式会社 | Heat dissipation device in printed circuit board |
| JPS6365261U (en) * | 1986-10-17 | 1988-04-30 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007019316A (en) * | 2005-07-08 | 2007-01-25 | Omron Corp | Component mounting board structure with heat dissipation function and manufacturing method of component mounting board structure with heat dissipation function |
| EP2416630A1 (en) * | 2010-08-05 | 2012-02-08 | Unimicron Technology Corp. | Circuit board and manufacturing method thereof |
| JP2012039070A (en) * | 2010-08-05 | 2012-02-23 | Kinko Denshi Kofun Yugenkoshi | Circuit board and manufacturing method of the same |
| US8598463B2 (en) | 2010-08-05 | 2013-12-03 | Unimicron Technology Corp. | Circuit board and manufacturing method thereof |
| US20140069574A1 (en) * | 2010-08-05 | 2014-03-13 | Unimicron Technology Corp. | Manufacturing method of circuit board |
| CN102378477A (en) * | 2010-08-19 | 2012-03-14 | 欣兴电子股份有限公司 | Circuit board and manufacturing method thereof |
| TWI406602B (en) * | 2010-11-23 | 2013-08-21 | Unimicron Technology Corp | Wiring board and method for fabricating the same |
| CN102548191A (en) * | 2010-12-14 | 2012-07-04 | 欣兴电子股份有限公司 | Circuit board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2793356B2 (en) | 1998-09-03 |
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