JPH0418794A - Manufacture of metal board - Google Patents
Manufacture of metal boardInfo
- Publication number
- JPH0418794A JPH0418794A JP12232490A JP12232490A JPH0418794A JP H0418794 A JPH0418794 A JP H0418794A JP 12232490 A JP12232490 A JP 12232490A JP 12232490 A JP12232490 A JP 12232490A JP H0418794 A JPH0418794 A JP H0418794A
- Authority
- JP
- Japan
- Prior art keywords
- protective sheet
- metal base
- foil
- metal
- circuit conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 42
- 239000002184 metal Substances 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 230000001681 protective effect Effects 0.000 claims abstract description 34
- 239000004020 conductor Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 21
- 238000003825 pressing Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 15
- 229910052782 aluminium Inorganic materials 0.000 abstract description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 5
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 abstract description 2
- 230000002950 deficient Effects 0.000 abstract description 2
- 239000004744 fabric Substances 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 238000002048 anodisation reaction Methods 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 abstract 1
- 238000007731 hot pressing Methods 0.000 abstract 1
- 229920000728 polyester Polymers 0.000 abstract 1
- 239000010408 film Substances 0.000 description 17
- 238000005530 etching Methods 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000007743 anodising Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 235000007575 Calluna vulgaris Nutrition 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、金属基板、例えば電源回路等の発熱の大きい
回路に使用きれる金属基板に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a metal substrate, for example, a metal substrate that can be used in a circuit that generates a large amount of heat, such as a power supply circuit.
鐙米の技術
従来、電源回路等に使用される金属基板としては、放熱
性が良好なアルミニウム製ベースを陽極酸化処理して酸
化被膜を形成した」−に、半硬化樹脂膜（ガラス布エポ
キシ含浸プリプレグ）及びＣｕ箔を積層し、加熱・加圧
ローラあるいはホットプレスを用いて加熱圧着する方法
で製造されていた。Traditionally, metal substrates used in power supply circuits, etc., were made by anodizing an aluminum base, which has good heat dissipation properties, to form an oxide film. It was manufactured by laminating layers of prepreg (prepreg) and Cu foil and bonding them under heat and pressure using a heat and pressure roller or a hot press.
酸化被膜は製造工程中でアルミベース表面が傷付くのを
防止するために形成されていた。The oxide film was formed to prevent the surface of the aluminum base from being damaged during the manufacturing process.
しかしながら、酸化被膜はＡ １ ｘ Ｏｎの組成から
なるため、高温（１００°Ｃ以上）の加熱工程を経ると
、アルミヘースとの熱膨張係数の差に起因して、マイク
ロクラックが発生し、耐圧劣化の原因となっていた。そ
のためにマイクロクラックを処理する工程を余分に必要
としていた。一方、絶縁層・接着層として機能する半硬
化樹脂膜は、加熱圧着時に溶融してフローアウトし、Ｃ
ｕ箔面に回り込んで薄膜を形成し、パターン形成時にレ
ジストとして作用してしまい、結果としてエツチング不
良等が発生ずる問題点を有している。However, since the oxide film has a composition of A 1 x On, when it undergoes a heating process at high temperatures (100°C or higher), microcracks occur due to the difference in thermal expansion coefficient with aluminum heather, resulting in pressure deterioration. It was causing this. This required an extra step to treat microcracks. On the other hand, the semi-cured resin film that functions as an insulating layer/adhesive layer melts and flows out during heat and pressure bonding, resulting in C
This has the problem that it wraps around the U-foil surface to form a thin film and acts as a resist during pattern formation, resulting in etching defects and the like.
発明の目的、構成、作用
以上の問題点を解決するため、本発明に係る金属基板の
製造方法は、金属製ベースの一面に半硬化樹脂膜を介し
て回路導体を設ける工程と、金属製ベースの他面に保護
シートを貼着し、前記回路導体−にに保護シートを貼着
する工程と、前記保護シート、半硬化樹脂膜、回路導体
を設けた金属製べ一部を加熱、加圧する工程と、前記回
路導体の不要部分を除去して所定の回路パターンを形成
する工程とからなることを特徴とする。In order to solve the problems above and beyond the purpose, structure, and operation of the invention, the method for manufacturing a metal substrate according to the present invention includes a step of providing a circuit conductor on one surface of a metal base via a semi-cured resin film, A process of pasting a protective sheet on the other side and pasting the protective sheet on the circuit conductor, and heating and pressurizing the metal base provided with the protective sheet, semi-cured resin film, and circuit conductor. and a step of removing unnecessary portions of the circuit conductor to form a predetermined circuit pattern.
以−１の工程において、金属製ベースは保護シトによっ
て保護され、耐圧劣化の原因となる陽極酸化処理は不要
となる。加熱、加圧工程は、例えば、ホットプレスや加
熱・加圧ローラを用いて行なわれ、半硬化樹脂の一部が
フローアウトしても回路導体は保護シートで被覆されて
いるため、回路導体に直接フローアウト樹脂が付着する
ことはなくなる。回路パターン形成は保護シートを剥離
した後にエツチング等の方法で行なわれる。In the following step-1, the metal base is protected by the protective sheet, and anodizing treatment, which causes voltage resistance deterioration, becomes unnecessary. The heating and pressurizing process is performed using, for example, a hot press or a heating/pressure roller, and even if some of the semi-cured resin flows out, the circuit conductor is covered with a protective sheet, so the circuit conductor remains intact. No more direct flow-out resin adhesion. The circuit pattern is formed by etching or the like after the protective sheet is peeled off.
回路導体上に貼着される保護シートとして感光性フィル
トを使用してもよい。この場合はフィルムを剥離するこ
となく感光させてエツチングで回路パターンを形成でき
る。但し、保護シート上にフローアクｌ−樹脂が付着し
ないように工程を管理−４＝る必要がある。基板自体を
最終形状に打ち抜く工程は加熱、加圧工程の直後に行な
うことが好ましい。また、金属製ベースの他面に貼着さ
れた保護シー１へは本金属基板を接地する際に剥離され
る。A photosensitive filter may be used as a protective sheet pasted onto the circuit conductor. In this case, a circuit pattern can be formed by exposing and etching the film without peeling it off. However, it is necessary to control the process so that the flowac l-resin does not adhere to the protective sheet. It is preferable that the step of punching out the substrate itself into the final shape is performed immediately after the heating and pressurizing steps. Further, the protective sheet 1 attached to the other surface of the metal base is peeled off when the metal substrate is grounded.
一方、本発明に係る金属基板は、前記回路導体に代えて
フレキシブル基板を用いて製造することができる。この
場合、適宜接着剤を介してフし・Ｖシブル基板を金属製
ベースの一面に設けることになる。フレキシブル基板は
全面に回路導体を設げた半完成品、あるいは既に所定の
回路パターンが形成されでいる完成品のいずれでも使用
できる。On the other hand, the metal substrate according to the present invention can be manufactured using a flexible substrate instead of the circuit conductor. In this case, the adhesive/V cable board is provided on one surface of the metal base via an appropriate adhesive. The flexible substrate can be either a semi-finished product with circuit conductors provided on its entire surface, or a finished product with a predetermined circuit pattern already formed thereon.
前者のフレキシブル基板を用いる場合、−Ｔ−ンチ〉・
グ等による回路バクーン形成工程は加熱、加圧−Ｉ：程
の後で、打ち抜き工程を経であるいは経ずに行なわれる
。When using the former flexible board, -T-inch>・
The process of forming a circuit bag by, for example, heating and pressing is carried out with or without a punching process after the heating and pressing process.
実施例
以下、本発明に係る金属基板の製造方法の実施例につき
、添付図面を参照して説明する。EXAMPLES Hereinafter, examples of the method for manufacturing a metal substrate according to the present invention will be described with reference to the accompanying drawings.
本実施例において、金属製ベース１としては放熱特性が
良好なアルミニウム板等が使用され、まず、この金属製
ベース１の表面に半硬化樹脂膜（ガラス布エポキシ含浸
プリプレグ等）２を設けると共に、その上に回路導体と
してのＣｕ箔３を設ける。In this embodiment, an aluminum plate or the like with good heat dissipation properties is used as the metal base 1, and first, a semi-cured resin film (glass cloth epoxy-impregnated prepreg, etc.) 2 is provided on the surface of the metal base 1, and A Cu foil 3 is provided thereon as a circuit conductor.
次に、金属製ベース１の表面に保護シート４を貼着し、
かつＣｕ箔３上にも保護シート５を貼着する。保護シー
ト４，５はポリエステルフィルム、塩化ビニルフィルム
、クレープ紙等を用いる。なお、裏面に貼着される保護
シート４は、後にエツチングレジストとしても機能させ
ることを考慮すると、クレープ紙を用いることはあまり
好ましくはない。また、保護シート４を貼着する工程を
最初に行なってもよい。第１図は以−Ｆの工程が終了し
た状態を示す断面図である。Next, a protective sheet 4 is attached to the surface of the metal base 1,
In addition, a protective sheet 5 is also pasted on the Cu foil 3. The protective sheets 4 and 5 are made of polyester film, vinyl chloride film, crepe paper, or the like. Note that it is not very preferable to use crepe paper as the protective sheet 4 attached to the back surface, considering that it will also function as an etching resist later. Alternatively, the step of pasting the protective sheet 4 may be performed first. FIG. 1 is a cross-sectional view showing the state in which the following steps -F have been completed.
以上の如く、半硬化樹脂膜２、Ｃｕ箔３、保護シト４，
５を設けた金属製ベース１をホットプレスあるいは加熱
・加圧ローラを用いて加熱、加圧４−ル。この工程によ
ってＣｕ箔３が半硬化樹脂膜２を介し、て金属製ベース
１上に固着される。半硬化樹脂膜２は加熱によって溶融
しフローアウトするおそれがある。１７かし、Ｃｕ箔３
は保護シート５で被覆されているため、フローアウトし
た樹脂がＣｕ箔３に付着することはない。As described above, the semi-cured resin film 2, the Cu foil 3, the protective sheet 4,
The metal base 1 provided with 5 is heated and pressed using a hot press or a heating/pressing roller. Through this step, the Cu foil 3 is fixed onto the metal base 1 via the semi-cured resin film 2. There is a risk that the semi-cured resin film 2 will melt and flow out due to heating. 17 Kashi, Cu foil 3
Since it is covered with the protective sheet 5, the resin that has flowed out will not adhere to the Cu foil 3.
その後、金属製ベース１を最終形状に打ち抜き、保護シ
ート５を剥離し、Ｃｕ箔３をエツチング処理して回路パ
ターン３′（第２図参照）を形成する。Thereafter, the metal base 1 is punched into a final shape, the protective sheet 5 is peeled off, and the Cu foil 3 is etched to form a circuit pattern 3' (see FIG. 2).
コーツチングは回路パターン３′部分にエツチングレジ
ストを塗布し、エツチング液によって不要部分を除去す
ることにより行なわれる。この場合、ｌシート４はエツ
チングレジストとして機能する。また、金属製ベース１
の打ち抜さ断面にも腐食防止のためにレジストが塗布さ
れる。Coating is performed by applying an etching resist to the circuit pattern 3' and removing unnecessary portions using an etching solution. In this case, the l sheet 4 functions as an etching resist. In addition, metal base 1
A resist is also applied to the punched cross section to prevent corrosion.
以りの工程によって金属基板が製造され、金属製ベース
１は保護シート４によって保護されるため、陽極酸化処
理は不要となり、加熱によるマイクロクラックが発生す
る不具合はなくなる。保護シート４は完成された金属基
板を機器に組み込んで接地する際に剥離される。A metal substrate is manufactured through the above steps, and the metal base 1 is protected by the protective sheet 4, so anodizing is not necessary and the problem of microcracks caused by heating is eliminated. The protective sheet 4 is peeled off when the completed metal board is assembled into a device and grounded.
なお、Ｃｕ箔３七に貼着される保護シート５として感光
性フィルｊ、を使用してもよい。感光性フィル１１を使
用ずれは、該フィル１８に光を照射してエツチングレジ
ストとしても機能させることができる。Note that a photosensitive film j may be used as the protective sheet 5 stuck to the Cu foil 37. If the photosensitive film 11 is not used, the film 18 can be irradiated with light to function as an etching resist.
方、本発明に係る製造方法においては、Ｃｕ箔３に代え
てフレキシブル基板を使用して金属基板を製造すること
も可能である。この場合、フレキシブル基板は金属製ベ
ース１上に適宜接着剤を介して設けられ、フレキシブル
基板上に保護シートが貼着される。金属製ベース１の裏
面にも保護シト４が貼着されることは勿論である。この
状態で加熱、加圧される。On the other hand, in the manufacturing method according to the present invention, it is also possible to manufacture a metal substrate using a flexible substrate instead of the Cu foil 3. In this case, the flexible substrate is provided on the metal base 1 via a suitable adhesive, and a protective sheet is pasted onto the flexible substrate. Of course, the protective sheet 4 is also attached to the back surface of the metal base 1. In this state, it is heated and pressurized.
フレキシブル基板として所定の回路パターンが既に形成
されているものが使用される場合には前記実施例の如く
エツチングによる回路パターンの形成工程は不要であり
、加熱、加圧工程の後、最終形状への打ち抜き加工を行
ない、製品として仕上げられる。If a flexible substrate on which a predetermined circuit pattern has already been formed is used, the process of forming the circuit pattern by etching as in the above embodiment is not necessary, and the process of forming the circuit pattern into the final shape is performed after the heating and pressurizing process. It is punched and finished as a finished product.
フレキシブル基板として全面に回路導体を設けた半完成
品を使用する場合には、加熱、加圧工程の後、最終形状
に打ち抜き、フレキシブル基板上の保護シー；・を剥離
した後、前記実施例と同様にレジストを塗布し、エツチ
ング処理にて回路パターンを形成する。保護シー１〜に
感光性フィルムを使用すれは、剥離することなくエツチ
ング処理できることは言うまでもない。When using a semi-finished product with circuit conductors on the entire surface as a flexible board, after the heating and pressurizing process, punch it into the final shape, peel off the protective sheet on the flexible board, and then Similarly, a resist is applied and a circuit pattern is formed by etching. It goes without saying that if a photosensitive film is used for the protective sheets 1 to 1, it can be etched without peeling.
なお、以１−の実施例において、基板を最終形状に打し
抜く工程はエツチングによる回路パターンの形成後であ
ってもよい。In the embodiment 1- below, the step of punching out the substrate into the final shape may be performed after the circuit pattern is formed by etching.
発明の動床
以上の説明で明らかなように、本発明によれば、金属製
ベースに保護シートを貼着したため、従来の如く金属製
ベース表面に陽極酸化処理を行なうことなく、簡単な方
法で傷付きを防止でき、しかも加熱工程で金属製ベース
表面にマイクロクラックが発生して耐圧特性が劣化する
おそれもなくなる。さらに、本発明によれは、回路導体
上にも保護シートが貼着された状態で加熱、加圧工程が
行なわれるため、フローアラ１〜した樹脂が直接回路導
体に付着することがなく、不良品が発生ずるおそれも解
消できる。Moving bed of the invention As is clear from the above explanation, according to the present invention, since the protective sheet is attached to the metal base, the surface of the metal base can be easily anodized without having to be anodized as in the conventional method. Scratches can be prevented, and there is no risk of microcracks occurring on the surface of the metal base during the heating process and deteriorating the pressure resistance characteristics. Furthermore, according to the present invention, since the heating and pressurizing process is performed with the protective sheet affixed on the circuit conductor, the resin that has flowed through the process does not directly adhere to the circuit conductor, and defective products can be produced. This also eliminates the risk of misalignment.
図面は本発明に係る金属基板の製造方法の一実施例を説
明するためのもので、第１図は加熱、加圧工程時の基板
の断面図、第２図は回路パターン形成後の基板の断面図
である。
１・・・金属製ベース、２・・・半硬化樹脂膜、３・・
・Ｃｕ箔（回路導体）、４，５・・・保護シート。
特許出願人 株式会社村田製作所The drawings are for explaining one embodiment of the method for manufacturing a metal substrate according to the present invention, and FIG. 1 is a cross-sectional view of the substrate during the heating and pressurizing process, and FIG. 2 is a cross-sectional view of the substrate after forming a circuit pattern. FIG. 1... Metal base, 2... Semi-hardened resin film, 3...
・Cu foil (circuit conductor), 4, 5...protective sheet. Patent applicant Murata Manufacturing Co., Ltd.
Claims (1)
体を設ける工程と、 金属製ベースの他面に保護シートを貼着し、前記回路導
体上に保護シートを貼着する工程と、前記保護シート、
半硬化樹脂膜、回路導体を設けた金属製ベースを加熱、
加圧する工程と、前記回路導体の不要部分を除去して所
定の回路パターンを形成する工程と、 からなることを特徴とする金属基板の製造方法。1. a step of providing a circuit conductor on one side of the metal base via a semi-cured resin film; a step of pasting a protective sheet on the other side of the metal base; and a step of pasting the protective sheet on the circuit conductor; sheet,
Heating the metal base with semi-cured resin film and circuit conductor,
A method for manufacturing a metal substrate, comprising the steps of applying pressure, and removing unnecessary portions of the circuit conductor to form a predetermined circuit pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12232490A JPH0418794A (en) | 1990-05-11 | 1990-05-11 | Manufacture of metal board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12232490A JPH0418794A (en) | 1990-05-11 | 1990-05-11 | Manufacture of metal board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0418794A true JPH0418794A (en) | 1992-01-22 |
Family
ID=14833151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12232490A Pending JPH0418794A (en) | 1990-05-11 | 1990-05-11 | Manufacture of metal board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0418794A (en) |
-
1990
- 1990-05-11 JP JP12232490A patent/JPH0418794A/en active Pending
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