JPH0419035A - Wafer adhering device - Google Patents

Abstract

PURPOSE:To prevent attachment of adhesive to a transport means or a wafer by providing an adhesive applying device below a transport path. CONSTITUTION:A chuck 49 is located right under a transport path 20, and between them an adhesive applying device 24 is provided, which is to apply an adhesive to a wafer W held by the chuck 49. A spin chucking means 39 is raised, and the wafer W is attracted and held by the chuck 49 and sunk, and then a wax dripping dispenser 51 is rotated and located right over the center of the wafer W. After adhesive is dripped onto the center of the wafer W, the dispenser 51 is rotated for avoidance from over the wafer W. The chuck 49 is rotated for spread of the adhesive from the center of the wafer W toward its periphery to attain thin and uniform coating of the adhesive. Then the spin chucking means 39 is raised, and the wafer W is returned to the transport path 20.

Description

DETAILED DESCRIPTION OF THE INVENTION 1. Field of Industrial Application: The present invention relates to a wafer bonding device for bonding a wafer to a single plate, which is performed as a pre-process of a wafer/surface polishing process, etc. .

When manufacturing wafers with high flatness or ultra-thin wafers using this conventional wafer technique, the wafers are processed by pasting them onto a laminate board made of ceramics or the like using an adhesive such as wax.

BACKGROUND ART Conventionally, as an example of a wafer bonding device for bonding a wafer to a bonding plate, the device described in Japanese Unexamined Patent Publication No. 633/6451 is known.

This wafer bonding device consists of a transport means that faces each other at a distance and is reciprocally movable so as to place the wafer on its upper surface and transport it to the next process, and a transport means located on the transport means that raises and lowers the wafer and raises and lowers the wafer. a spin chuck means for carrying the wafer into the adhesive coating device and rotating it; and a reversing chuck means for taking out the wafer coated with the adhesive from the conveying means, transferring it to the outside of the conveying means, and reversing it; The wafer is received from the reversing chuck means, and the wafer is held in a predetermined position so as to be adhered to the pasting plate. The wafer is transported into an adhesive coating device, and in this adhesive coating device, adhesive is dripped onto the center of the wafer surface from a wax nozzle, and the wafer is rotated to apply a thin and uniform adhesive onto the surface of the wafer λ. After coating the wafer, the wafer placed on the conveying means is taken out by the reversing chuck means,
It is designed to be inverted and glued to the mounting board.

“Problem to be Solved by the Invention-1” However, in the wafer bonding device with the above configuration,
Located above the adhesive applicator or conveyance means,
If adhesive drips from the wax nozzle, the adhesive may fall onto the conveyance means or the wafer, or the adhesive remaining on the splash prevention cover installed to prevent splashes may be removed from the conveyor. There is a risk that it may fall onto the means or wafers and contaminate them. In this way, if the transport means or wafers become dirty, it becomes difficult to obtain high flatness on the processed wafers, the yield rate decreases for a while, and furthermore, it may cause the bonding equipment to malfunction.

Also, Noricon wafers need to be polished in batches of 100 to 200 wafers, which are classified by type, type, resistance, and oxygen concentration. Tatsu 1. - If the thickness of the wafer is uneven or uneven, when polishing the wafer attached to the attachment plate, the attachment plate may be tilted to the polishing plate, or the wafer may be unpolished or uneven. There was a problem that it was impossible to obtain a high degree of flatness.

``Object of the Invention'' This invention was made in view of the above circumstances, and it is an object of the present invention to prevent adhesive from adhering to a transport means or a wafer, and to
It is an object of the present invention to provide a wafer bonding device that can continuously and accurately bond wafers to a bonding plate with uniform thickness without lot mixing.

[-Means for Solving the Problems] In order to achieve the above object, the wafer bonding apparatus according to claim 1 of the present invention comprises a pair of wafer bonding devices which are arranged facing each other at a predetermined interval and on which a wafer is placed. A holding plate is movable both reciprocatingly and vertically, and conveys the wafers placed on the holding plate sequentially to the process. a spin chuck means for holding and lowering the wafer, and carrying the wafer into an adhesive coating device provided below the conveyance path and rotating the wafer;
Receive the wafer coated with adhesive from the transport path,
A reversing cha that is transferred to the outside of the conveyance path and reversed.

A sticking plate to which a wafer sent from the reversing chuck means is stuck is placed on the upper surface thereof, and an indexing means for determining the sticking position of the sticking plate.

Further, the wafer contacting device according to claim 2 is a wafer contacting device according to claim 1.
0 Measure the thickness of the wafer using the 7f equipment.
L = The measurement part that stores the measurement data of the lever and the thickness are 1
A stock part where the sub-wafers are temporarily placed and the J-ha temporarily placed in this stock part are transported in order of thickness based on measurement data to the starting end of the transport path of the wafer bonding apparatus according to claim 1. A means of supply was established.

7. Effects In the wafer bonding device of the present invention, since the adhesive coating device is provided below the conveyance path, the adhesive may drip or fall in the adhesive coating device. Even if residual adhesive is dropped from a splash prevention cover or the like, this adhesive will not adhere to the transport path or wafer.

In addition, the thickness of the wafer is measured by the measurement unit, this measurement data is stored, the wafer whose thickness has been measured is temporarily placed in the stonk unit, and the temporarily placed wafer is transferred to the supply unit to increase the thickness based on the measurement data. Since the wafers are conveyed and supplied to the conveying path in the order of thickness, the thickness of the multiple wafers bonded to one bonding plate is almost uniform, and when polishing the wafers bonded to the bonding plate, The attachment plate will not be tilted with respect to the polishing machine, and the wafer will not be unpolished.Moreover, the measurement section can record data such as the lot number of the wafer attached to each attachment plate. If it is stored together with the measurement data, lot management is easy and there is no risk of contamination.

"Embodiment" Hereinafter, an embodiment of the waeno bonding apparatus of the present invention will be described with reference to FIGS. 1 to 5.

The figure shows the overall structure of Waeno's bonding apparatus, and the reference numeral 1 in the figure indicates a large-scale rotor. This large-scale loader 1 is configured to sequentially transport a cassette 2 in which a large number of wafers W are stacked vertically at regular intervals in a circular manner. A measuring section 3 is provided in front of the large-scale rotor 1, which measures the thickness of the wafer W and stores this measurement data and data such as the wafer lot number. A robot 4 is provided between the cassette 2 sent by the large-scale loader 1 and the robot 4 that takes out wafers W one by one from the cassette 2 sent by the large-scale loader 1 and sequentially transports them to the measuring section 3.

In front of the measurement section 3, a medium-sized stock section 5 is provided in which measured wafers W are temporarily stored. This medium-sized stock 5 is a stocker 7. which is formed by arranging a plurality of cassettes 6 annularly at predetermined intervals in the circumferential direction.
7 are arranged symmetrically with respect to the measurement section 3 as a boundary, and in the center of each stocker 7.7 there is a robot 8 that transports and temporarily stores the wafer W measured by the measurement section 3 in the cassette 6. .8 is provided.

Further, in front of the medium-sized stock 5, there is a transport path 2, which will be described later, for transporting wafers W temporarily placed therein in order of thickness.
A supply means 10 for supplying the starting end of 0 is also provided.

That is, a robot 12 is provided in front of the center of the stocker 7 7.7 for taking out wafers W from the trays and trays in order of thickness and transporting them to the indexing table 11 in order of thickness. A robot 13 is provided in front of the indexing table 11 to transport Uno-W from the indexing table 11 to a transport path in order of thickness. Furthermore, cassettes 14, 14 for non-standard products are provided on both sides of the robot 12, and the cassettes 14, 14 carry wafers W whose thickness is out of the standard by the robot 12. Strikes and attacks are becoming commonplace. Further, on the side of the index table 11, there is an emergency rotor 15, an opening, and a photo 16.
is provided, and wafers W are supplied from this emergency rotor 15 to the indexing table 11 via a robot 16. The wafers W supplied from this emergency rotor 15 are supplied as needed, such as surplus wafers from another lot or wafers for adhesion testing, and are not always supplied.

In addition, two transport paths 20 and 20 are provided in front of the supply means 10 having the above configuration, and the center position of the wafer W transported by the above-mentioned roofs 71 and 13 is sequentially arranged along each transport path 20. a positioning section 21 that positions the wafer W; a cleaning section 22 that sprays pure water onto the wafer W transferred from the positioning section 21 to clean the surface of the wafer W; a drying section 23 that dries the cleaned wafer W; It was done,
- An adhesive coating device 24 that applies adhesive to the surface of the wafer W; a heater unit 25 that heats the wafer coated with adhesive and melts the adhesive on the surface of the wafer W;
Before gluing the wafer to the affixing plate B, attach the orientation flat of Waeno W (
Various stages are provided, such as an OF alignment section 26 for aligning the outer periphery of the wafer (or a linear cutout).

A conveying means 30 shown in FIGS. 2 to 4 is provided between these stages.

That is, above the base 3), a rectangular plate-shaped lifting table 32 or a slide pack 33 is supported so as to be able to move up and down, and at the center of the lower surface of this lifting table 32,
The tip of a piston rod 34a of an air cylinder 34 attached to the base 31 is connected. This elevating table 32 is configured to move up and down at a predetermined pitch by operating an air cylinder 34.

On the upper surface of the lifting table 32, a pair of holding plates 35, 35 are arranged facing each other at a predetermined interval in the vertical direction in FIG. 2 (horizontal direction in FIG. 4), and on which a sea urchin / is supported by slide knobs 36 and 36 so as to be able to reciprocate from side to side in FIGS.
The cylinder 37 is attached with its axis oriented in the left-right direction.

The tip of the piston mouth/nod 37a of this air/cylinder 37 is connected to a bracket/nod 38 installed between the right end parts of the pair of holding plates 35, 35, and the air/linder 37 is operated. Accordingly, the pair of retaining plates 35.
35, it reciprocates at a predetermined pitch in the left and right directions.

On the upper surfaces of the pair of holding plates 35, 35, there are step portions 35a, 35b, 35c or 2 whose centers are in the same arcuate shape when viewed from above, and whose curvature radius increases toward the top.
These stepped portions 35a, 35b, 3
A ueno W of a suitable diameter is placed and held on either of the 5c.

In the conveying means 30 having the above configuration, the air cylinders 34 and 37 are operated alternately to repeat the vertical and reciprocating movements indicated by the arrows in FIG.
are transported to the front stage in sequence.

Further, below the conveyance path 20 in front of the drying section 23,
Spin chuck means 39 that holds the wafer on the transport path 20, lowers it, carries the wafer into the adhesive coating device 24 provided below the transport path 20, and rotates it.
Or is provided.

That is, as shown in FIG. 5, a slide base 41 is vertically fixed to a base 40 provided vertically below the conveyance path 2O. It is set freely.

The lower surface of this slider 42 is connected via a bracket 45 to the tip of a piston rod 44a of an air cylinder 44 whose base end is rotatably connected to a base 43. Further, a spin chuck means 39 is provided on the side surface of the slide back 42 via a bracket 46. This spin chuck means 39 includes a bracket 46
A spin motor 48 whose lower end is fixed to the upper surface, a disk-shaped chuck portion 49 which is attached to the rotating shaft 48a of the spin motor 48 and holds the wafer W on the upper surface by vacuuming, and the bracket 46. It is mainly composed of a wax/suction source 50 fixed to the lower surface, and the wax/suction source 50 and the chuck section 49 are communicated by a suction pipe 50a passing through the spin motor 48.

The chuck portion 49 is located directly below the conveyance path 20, and between the chuck portion 49 and the conveyance path 20 there is a chamfer,
The adhesive application device 24 described above is provided for applying an adhesive to the wafer W held by the sliding portion 49.

That is, the wafer W held by the chamfer part 49
A wax dripping dispenser 51 that drips adhesive onto the center of the frame 52a is attached to the tip of a long rotating member 53 that is rotatably supported in a horizontal plane by a frame 52a. The base end is rotatably connected to the tip of a piston rod 54a of an air cylinder 54, which is rotatably connected to the frame 52b.

The wax dripping dispenser 51 is rotated via the rotating member 53 to avoid the wafer W by operating the air cylinder 54 when the spin chuck means 39 is raised and lowered, that is, when the wafer W is raised and lowered. Furthermore, the chuck portion 49 of the spin chuck means 39
A splash prevention cover 56 is placed around the -F frame 52a.
It is fixedly provided. This splash prevention cover 56
is a cylindrical body 56a whose upper edge is disposed with a very small gap from the outer periphery of the wafer W held in the chamfer part 49; An annular cover body 56b that is gradually inclined downward as it goes radially outward and whose inner opening surrounds the outer periphery of the Ueno W;
The cover main body 56b is provided with a recovery port 56c provided on the outer circumference of the cover body 56b to recover adhesive accumulated on the cover body 56b. Further, an exhaust tact 57 having a triangular cylindrical cross section is provided on the outside of the earthen wall of the cover body 56b, and an exhaust tact 57 is provided along the local direction on the outside of the earthen wall of the cover body 56b. Exhaust port 58 communicating with exhaust duct 57
A plurality of them are formed at predetermined intervals along the circumferential direction.

In the adhesive coating device 24 having the above structure, a spin chuck means 39 is provided inside the adhesive coating device 24.

An appropriate amount of adhesive is dripped from the wax lower dispenser 51 onto the center of the surface of the wafer/%W carried in by the chuck section 49, and by rotating the chuck section 49, the adhesive dropped at the center is uniformly distributed toward the outer periphery. By spreading the adhesive thinly and uniformly on the surface of the wafer/%W. Incidentally, the excess adhesive splashed from the outer periphery of the wafer W is absorbed into the splash prevention cover 56 and collected from the collection port 56c.

Further, as shown in FIG. 1, at the rear stage of the OF matching section 26, a wafer W coated with adhesive is received from the transport path 20 via a transport arm 60 and transferred to the outside of the transport path 20. A reversing chuck means 61 for reversing is provided. This reversing mechanism 61 is provided so as to be movable in the vertical direction in FIG. In FIG. 1, there is an arm 63 that rotates 180'' in a direction rising from the plane of the paper with the base end as a fulcrum, and an arm 63 provided at the tip of the arm 63 to move the wafer W received from the transfer arm 60 by vacuuming. In the reversing chuck means 61 having the configuration shown in FIG.
The wafer W is turned over and pasted onto the pasting plate B.

Further, a pasting plate B to which the wafer W sent from the reverse chuck means 61 is pasted is placed downstream of the reversing chuck means 61, and the pasting position of the bracket pasting plate B is determined. The indexing means 67 is provided with C dimensions. The indexing means 67 includes a disk-shaped table 68 that is rotatably supported around an axis and on which the attachment plate B is placed with its center aligned, and a stepping device that rotates the table 68 and determines the amount of rotation. a motor (not shown);
It mainly includes a stamping part 69 for pressing the center of the attached wafer W and stabilizing the attachment surface of the wafer W. In the indexing means 67 configured as described above, the table 68 is rotated by a stepping motor to determine the position of the pasting plate B placed on the upper surface, and the reversing chuck means 61 is placed at a predetermined position on the pasting plate B. The wafer W is received from and bonded to the wafer W.

Next, the operation of the wafer fLfF apparatus t having the configuration No. 11 will be described.

First, the wafers W are taken out one by one from the cassette 2 of the large-scale rotor 1 by the ROBONO) 4 and transported to the measuring section 3, where the thickness of the wafer W is measured. The wafer W is transported by the rohonoto 8, 8 and temporarily placed in a cassette 6 of a medium-sized storage 7.

Next, the wafers W are taken out in the order of thickness from the cassette 6 to the cassette 12, and are transferred to and placed on the indexing chiffle 11. Incidentally, wafers whose thickness does not meet the standard are transferred from the slot 12!2 to the cassette 14.+4, where they are stored.

Next, the wafer W is transported from the indexing table 11 to the positioning section 21.21 by the rotor 13, and then the wafer W is sequentially transferred to the cleaning section 22.22 and the drying section 23.23.
, by alternately operating the air linters 34 and 37 of the conveying means 30 (holding plate 35, 35) in the adhesive application device 24, 24, and repeating the vertical and reciprocating movements shown by the arrows in FIG. transport.

After the waeno W is transported above the adhesive coating device 24, the spin chuck means 39 is raised by the air cylinder 44, and the wafer/%W is suctioned and held by the chuck section 49. At this time, the wax dropping dispenser 51 is avoided from above the spin chuck means 39.

Next, the wafer W is lowered by lowering the spin chuck means 39, and the wax dripping dispenser 51 is further rotated by the air cylinder 54 via the rotating member 53 and lowered, so that the wafer W is placed directly above the center of the 1-wafer W. position.

Next, from the wax dripping dispenser 51...
After dropping a predetermined amount of adhesive onto the center of the wafer W, the wax dropping dispenser 51 is rotated to avoid it from above the wafer W.

Thereafter, the chuck part 49 is rotated by the spin motor 48 to rotate the wafer W, thereby spreading the adhesive from the center of the wafer W toward the outer periphery and applying the adhesive thinly and uniformly to the surface of the wafer W. do. At this time,
Adhesive droplets scattered from the outer periphery of Ueno\W are absorbed into the splash prevention cover 56 and collected from the collection port 56e.

Next, the spin chunk means 39 is raised to return the adhesive-coated wafer W to the transport path 20, and the next wafer W is sucked and held by the chuck section 49, and the above operation is repeated to sequentially remove the wafer W. Adhesive is applied to the surface of the W and the W is returned to the transport path 20 again.

Then, the wafer W coated with the adhesive is placed in the heater section 25.
to melt the adhesive, and then ○F joining part 2
After aligning the orientation flat of the wafer W by 6, the wafer W is transported to the reversing chuck means 61 by the transport arm 60.

Furthermore, the wafer W conveyed to the reversing chuck means 61 is suction-held by the holding part 64 and rotated 1800 times by the rotary actuator 62 via the arm 63, thereby reversing the wafer W and moving it to the indexing means 67.
It is pasted on the pasting board B which is placed on the table 68 with its center aligned. The attachment position of the wafer W on the attachment plate B is determined by rotating the table 68 with a stepping motor, and the wafer W is adhered to a predetermined position on the attachment plate B. Further, the attached wafer W is pressed at its center by the stuff pin 1 part 69 in order to stabilize the attached surface.

According to the wafer bonding apparatus having the above configuration, in addition to being able to fully automatically bond the wafer W to the bonding plate B with high efficiency and high precision, the following effects are achieved.

■ Since the adhesive applicator 24 is provided below the conveyance path 20, liquid may drip on the wax drip dispenser 51 and the adhesive may fall, or adhesive remaining on the splash prevention cover 56 may fall. Even if the adhesive does not adhere to the transport path 20 or the wafer W, problems caused by adhesive adhesion can be prevented.

■When the wafer W is rotated by the spin chuck 9 means 39, the wax dripping dispenser 51 is avoided, so there is no moving part at all directly above the spin chuck means 39, which allows the coating work to be performed more completely in a lean air atmosphere. In addition, liquid dripping from the wax dripping dispenser 51 does not affect the wafer W during coating.

■The gap between the upper edge of the cylindrical body 56a constituting the splash prevention cover 56 and the outer peripheral edge of the wafer W is kept very small (0,5
mx or less), and an exhaust tact 57 is provided on the outer periphery of the splash prevention cover 56, which communicates with the inside of the splash prevention cover 56 through an exhaust port 58. It is possible to prevent the surroundings from being crowded, and also to quickly exhaust droplets to the outside of the device, so that the atmosphere of the adhesive application device 24 can be kept clean at all times.

■ Even if particles (fine dust) are brought in from the spin motor 48 of the spin chuck means 47,
This verticle is connected to the exhaust tact 5 from the splash prevention cover 56.
7, so I wonder if this particle will adhere to the surface of the wafer W. The thickness of the wafer W is measured by the measurement unit 3, this measurement data is stored, and the wafer whose thickness has been measured is temporarily removed. The temporarily placed wafers W are temporarily placed on the medium-sized sudock 5 and are conveyed to the conveyance path in order of thickness based on the measurement data via the C-bot 12, the indexing table, the rotor, and the wafer 13. The thicknesses of the plurality of wafers W attached to the one attachment plate B are almost uniform. Therefore, when polishing the wafer W attached to the attachment plate B, wafers with high flatness can be manufactured without tilting the attachment plate B with respect to the polishing plate or causing unpolished portions of the wafer W. I can do it.

■In addition, data such as the lot number of the wafer W pasted on each pasting plate B is stored in the measurement unit 3 together with the measurement data of the thickness of the wafer W, making lot management easy and preventing contamination. There is no fear.

"Effects of the Invention" As explained above, according to the wafer bonding device of the present invention, in addition to being able to affix a wafer to a wafer to a wafer fully automatically, efficiently and with high precision, it also has the following advantages: It has the following effects.

■Since the adhesive applicator is installed below the conveyance path, there is no risk of liquid dripping or falling of the adhesive in the adhesive applicator, or adhesive remaining on the splash prevention cover, etc. Even if the adhesive does not adhere to the transport path or the wafer W, problems caused by adhesive adhesion can be prevented.

■The thickness of the wafer is measured by the measurement unit, this measurement data is stored, the wafer whose thickness has been measured is temporarily placed on the storage area, and the temporarily placed wafer is transferred to the supply means based on the measurement data. Since the wafers are conveyed to the conveyance path in order of thickness, the lots of a plurality of wafers to be attached to one attachment plate are identified and the thicknesses are almost uniform. Therefore, when polishing a wafer attached to the attachment plate, wafers with high flatness can be manufactured without tilting the attachment plate with respect to the polishing plate or leaving the wafer unpolished.

[Brief explanation of drawings]

1 to 5 show an embodiment of the wafer bonding device of the present invention, in which FIG. 1 is a schematic plan view showing the overall configuration of the device, FIG. 2 is a plan view of the conveying means, and FIG. 3 is a front view of the same, FIG. 4 is a side view of the same, and FIG. 5 is a schematic configuration diagram showing an adhesive application device and a spin chuck means. Wafer B...Application plate, 3...Measurement unit, -Medium scale stock (stock unit), supply means, 20 -Transport path, adhesive coating device, 35 -Holding plate, spin chuck means, reversing chuck means, 67 ...-Identification means. 24 ・ 39 ・・

Claims (2)

[Claims] (1) A pair of holding plates, which are arranged facing each other at a predetermined interval and on which the wafer is placed, are movable back and forth and up and down, and the wafers placed on the holding plates are sequentially processed. A transport means is provided at a position below the transport path so as to be able to move up and down, holding the wafer on the transport path and lowering the wafer, and carrying the wafer into an adhesive coating device provided below the transport path. a spin chuck means for rotating the wafer, a reversing chuck means for receiving the wafer coated with adhesive from the transport path, transferring it to the outside of the transport path and reversing it; 1. A wafer bonding apparatus, comprising: a wafer bonding device on which a wafer bonding plate is placed; and indexing means for determining the bonding position of the wafer bonding plate. (2) A measurement unit that measures the thickness of the wafer and stores this measurement data, a stock unit that temporarily stores the wafer whose thickness has been measured, and stores the wafer temporarily placed in this stock unit as the measurement data. 2. The wafer bonding apparatus according to claim 1, further comprising a supply means for conveying the wafers in order of thickness based on the thickness and supplying the wafers to the starting end of the conveyance path.