JPH04190362A - Resist for forming light shading film, method for producing said resist, and light shading film formed of said resist - Google Patents

Abstract

PURPOSE:To produce a highly insulating light-shading film having superior light-shading rate by making a solvent contain organic type pigment consisting of specific mixed-color organic pigment, specific light shading material, and photosensitive resin. CONSTITUTION:Solvent contains organic type pigment consisting of pseudo- blackened mixed-color organic pigment made up by mixing at least two kinds of organic pigment selected from black-colored organic pigment and/or red, blue, green, purple, yellow, cyanine, and magenta; at least one kind of light shading material selected from carbon black, chrome oxide, iron oxide, titanium black, and aniline black; and photosensitive resin. The photosensitive resin should preferably be of an ultraviolet-ray hardening type. The solvent contains also light starting agent and dispersion agent, and the weight ratio of these constituents is adjusted. This allows formation of a highly insulating light- shading film having superior lightshading rate.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resist for forming a light-shielding film, a method for manufacturing the resist for forming a light-shielding film, and a light-shielding film formed using the resist for forming a light-shielding film.

[Prior Art] In recent years, light shielding films have been used in color filters, liquid crystal display materials, etc.1.
It is indispensable for display elements such as electronic display materials and color displays, and these display elements are used in audio equipment, car instrument panels, clocks, calculators, video decks, FAUKS 9 communication devices, game consoles, measuring equipment, etc. It is widely used in various fields.

For example, in color filters, red (R), green (G
), a light shielding film is used as a black matrix formed between each pixel of blue (B), etc. This black matrix serves to prevent contrast and color purity from deteriorating due to light leakage between pixels.

Conventionally, when each pixel (colored layer) of a color filter, etc. is formed by printing method 9 dispersion method or dyeing method, a photoresist agent containing a light blocking material such as carbon black is often used as a light blocking film. There is.

However, since the photoresist agent containing carbon black is electrically conductive, there is a problem in that it is impossible to share the liquid crystal driving electrode and the color filter forming electrode.

In other words, if a black matrix is formed first on the ITOTL electrode patterned to form a color filter, conduction will occur with the adjacent electrode, making it impossible to form a color filter using micelle electrolysis or FL deposition. On the other hand, if a black matrix is formed after forming a color filter, when the ITO electrode for forming the color filter is used to drive the liquid crystal, it will be electrically connected to the adjacent electrode, causing the inconvenience that the liquid crystal will not operate. or arise. Like this.

When a carbon-based photoresist agent is used, there is a problem in that a color filter can only be formed by micellar electrolysis or electrodeposition, which are highly conductive.

Therefore, it is desired to develop a resist for forming an insulating light-shielding film, and red (R) is an insulating photoresist agent.
), green (G), blue (B), and other organic pigment-based resist agents have been developed.

[9.1JI or the problem to be solved] However,
-h The conventional organic pigment-based light-shielding film forming resin l~ mentioned above does not contain a light-shielding material, so photo link graphing υ
When a light-shielding film is formed using , the light-shielding rate is not sufficient,
Therefore, in order to obtain a sufficient light-shielding rate, the film thickness must be increased, and the surface smoothness of the color filter cannot be obtained. Further, there is a problem in that it is difficult to form a thick black matrix in a uniform shape (rectangular).

Unoccurred IJI was developed in view of the above-mentioned problems, and includes a resist for forming a light-shielding film that can form a highly insulating light-shielding film with a high light-shielding rate, and the production of the resist for forming the light-shielding film. The present invention aims to provide a method and a light-shielding film formed using the resist for forming a light-shielding film.

[Means for Solving the Problem] In order to achieve the above [1], the resist for forming a light-shielding film of the present invention contains a black organic pigment and/or a pigment selected from red, blue, green, purple, yellow, cyanine, and magenta. An organic pigment consisting of a mixed color organic pigment made by mixing at least two or more organic pigments to create a pseudo-black color, carbon fluff, chromium liquefied,
A light-shielding material of at least one type or more selected from iron oxide, titanium black, and aniline brauch, and a photosensitive resin.

Preferably, the photosensitive resin is of an ultraviolet curing type, a photoinitiator and a dispersant are contained in the solvent, and the weight ratio of each component is adjusted.

Further, the method for producing a resist for forming a light-shielding film of the present invention uses a black organic pigment and/or red, blue, and green.

An organic pigment consisting of a mixed-color organic pigment obtained by mixing at least two organic pigments selected from purple, yellow, cyanine, and magenta to give a pseudo-black color, and carbon black, chromium oxide, iron oxide, and titanium black.

At least one light shielding material selected from aniline fluff, a photosensitive resin, and a photoinitiator are dispersed in a solvent using a dispersant and filtered.

Furthermore, the light-shielding film of the present invention is a light-shielding film formed by the photolithography method using the resist for forming a light-shielding film of the present invention, and has a sheet resistance of 109Ω/or more and a light-shielding rate of 99.9% or more. This is the configuration.

The present invention will be explained in detail below.

The resist for forming a light-shielding film of the present invention contains an organic pigment consisting of one or both of a black organic pigment and a pseudo-black mixed color organic pigment, and a light-shielding material in a solvent.

Here, examples of the black organic pigment include beryrenzlac (RASF K OO84).

KOO86), cyanine black, etc. One type of black organic pigment may be used alone, or two or more types may be used in combination. It is necessary for the black organic pigment to be insulating.

The pseudo-black organic pigment is red (R).

-I: A mixture of at least two or more organic pigments selected from (B), green (G), purple (■), yellow (Y), cyanine, magenta, etc., resulting in a pseudo-black color by color mixing.

Generally, when you mix two colors that are complementary to each other, you get black. It is preferable that the organic pigments of each color used for mixing these colors are insulating.

Here, examples of red pigments include perylene pigments, anthraquinone pigments, cyanthraquinone pigments, azo pigments, and diazo pigments. Examples include quinacridone pigments and anthracene pigments. Specific examples include perylene pigment, quinacridone, naphthol AS, shicomine pigment, anthraquinone (Sudanl, II, m, R), dianthraquinonylleuth, bisazo, benzobilane, and the like.

Examples of blue pigments include metal phthalocyanine pigments, intanthrone pigments, and indophenol pigments. Specifically, copper phthalocyanine, chlorocopper phthalocyanine, chloroaluminum phthalocyanine, and titanyl phthalocyanine.

Examples include phthalocyanine metal complexes such as vanadate phthalocyanine, manesium phthalocyanine, zinc phthalocyanine, iron phthalocyanine, and cobalt phthalocyanine, and indophenol true.

Examples of the green pigment include halogenated phthalocyanine pigments. Specific examples include polychlorocopper phthalocyanine and polychlorobromophthalocyanine.

Examples of purple pigments include dioxazine violet and F7.
- Examples include Stviolet B, Methyl Violet Lake, Intantrene Brilliant High Oleut, etc.

Examples of yellow pigments include tetrachloroisointrinon pigments, Hansairo pigments, benzidine yellow pigments,
Examples include azo pigments. In terms of X-body, Hansa Yellow (IOG, 5G, 3G.

G, OR, A, RN, R), benzidine (G.

OR), chromophthal yellow, permanent yellow (
Examples include FGL, HIOG, HR), and anthragenerow.

Examples of cyanine pigments include metal-free phthalocyanine and merocyanine.

Examples of magenta pigments include dimethylquinacridone and thioindigo.

The light-shielding material refers to particles that impart light-shielding properties to the resist when dispersed in the resist. Specifically, examples of the light shielding material include carbon black, chromium oxide, iron oxide, titanium black, titanium carbon, and aniline black. One type of light shielding material may be used alone, or two or more types may be used in combination.

As the photosensitive resin, an insulating transparent photosensitive resin is preferable.

The insulating transparent photosensitive resin includes all transparent photosensitive resins that have an insulating property, and includes, for example, ultraviolet curable photosensitive resins. The resist may be either a positive type or a negative type, and may be an EB resist, an X-ray resist, etc., and is most preferably a negative type.

Note that the photosensitive resin (solid content) is usually dissolved in a solvent and used as a liquid resist agent. For example, ultraviolet curing η
Examples of the resist agent No. 1 include Aronix (manufactured by Toagosei Co., Ltd.), which is an acrylic resist, and Toshi Photonice (manufactured by Toshi Co., Ltd.), which is a Boliimi 1-based resist.

The solvent is used to disperse organic pigments, light shielding materials, etc., and to dissolve the photosensitive resin.

The solvent may vary depending on the photosensitive resin used, so it cannot be generalized, for example, methyl cellosol acetate or ether cello sol acetate.

Alkyl cellosolve acetates such as propyl cellosolve acetate and phthyl cellosolve acetate; diethylene glycol alkyl ether acetates such as cyclohexanone, diethylene glycol methyl needle acetate, and diethylene glycol ethyl ether acetate;
Propylene glycol alkyl ether acetate such as propylene glycol methyl ether acetate, propylene glycal ethyl ether acetate, NMP
(N-methylpyrrolidone) and the like.

These solvents may be used singly or in combination.

The resist for forming a light-shielding film of the present invention contains optional components such as a dispersant and a photoinitiator as appropriate.

Dispersants include nonionic surfactants (e.g. polyoxyethylene alkyl ethers, esters), ionic surfactants (e.g. sodium alkylbenzenesulfonate, polyfatty acid salts, fatty acid salts alkyl phosphates, tetraalkylammonium salts). ), organic pigment derivatives, polyesters, etc. One type of dispersant may be used alone, or two or more types may be used in combination.

Examples of photoinitiators include triazine-based photoinitiators (for example, triheromethyl-5-t-lyazine derivatives, etc.), acetophenone-based photoinitiators (for example, Irukacure 907.
CG r 369 : Chiha-Geigy 71), benzine-based, benzophenone-based, thioxanthone-based photoinitiators, and the like.

Next, we will discuss the desired mixing ratio of each component of the resist for forming a light-shielding film of unreleased [J) in which the reporter component is present.
Do J.

The ratio of the organic pigment and the light-shielding material to the total U- of the black organic pigment and/or the black-simulating color mixture I/IfJ material is as follows:
It is preferably 20 to 55 g C4jij%, particularly preferably 25 to 40 9% by weight. The mixing ratio of organic pigment and light shielding material is 20g! In the case of non-concentration, the light-shielding rate of the light-shielding film formed by photolithography decreases, so a thick film is required, which is undesirable because it interferes with the production of color filters. When the ff1ffi of pigments and light shielding materials exceeds 55%,
This is undesirable because the content of the cured resist material, which serves as a binder, is reduced, making it impossible to form a light-shielding film pattern as a fluff matrix, and mechanical strength such as adhesion to an insulating substrate such as glass is reduced.

Next, the mixing ratio of the organic pigment to the total amount of the organic pigment, light shielding material, and photosensitive resin is preferably 15 to 40%.
% by weight, particularly preferably 20 to 30% by weight.

Further, the mixing ratio of the light shielding material to the total amount of the organic pigment, the light shielding material, and the photosensitive resin is preferably 5 to 15% by weight.
The content is particularly preferably 5 to 10% by weight.

If the weight of the light-shielding material is less than 5%, the light-shielding rate of the light-shielding film formed by photolithography will decrease, requiring a thicker film, which is undesirable because it will interfere with the production of color filters. . 15% of the weight of the light shielding material
If it exceeds this value, the light-shielding film becomes conductive (the sheet resistance becomes less than 10907), making it impossible to manufacture a color filter, which is not preferable.

When only a red organic pigment and a blue organic pigment are used as organic pigments, the mixing ratio of the red organic pigment and the blue organic pigment to the total h1 of the organic pigment, light shielding material, and photosensitive resin is 75 to 20 parts, respectively. It is preferable that the weight of each of them is 10 to 150 to 15 weight.

Red organic pigment and blue 41 organic pigment, each weighing 75 times as much as 1
If it is less than %, the light shielding rate of the light shielding film formed by photolithography will be low and a large crotch thickness will be required.
This will interfere with the production of color filters.

Furthermore, if the content exceeds 20% by weight and 9%, the content of the cured resist in the binder, including the addition of a light-shielding material, will decrease, making it impossible to form a light-shielding film pattern as a fluff matrix, and the substrate (insulating Mechanical strength such as adhesion to the substrate (glass plate) decreases.

Moreover, the weight ratio of the red organic pigment and the blue organic pigment is II
-f is preferably 1:o, 5 to 1:2, particularly preferably 1:o, 8 to 1:1.5. Red pigments and n-color pigments have a complementary color relationship with each other, so in order to block visible light in a well-balanced manner when mixed to create a pseudo-black color, it is necessary to make the weights of the red pigment and blue pigment close to equal. preferable.

When using only a black organic pigment as an organic pigment,
The mixing ratio of the black organic pigment to the total amount of the organic pigment, light shielding material and photosensitive resin is preferably 15 to 40% by weight. When the black organic pigment is less than 15% by weight,
The light-shielding rate of the light-shielding film formed by photolithography decreases, and a large film thickness is required, resulting in problems in the production of color filters.

If it exceeds 40% by weight, the content of the cured resist in the binder including the addition of the light shielding material decreases, making it impossible to form a light shielding film pattern as a fluff matrix.
In addition, mechanical strength such as adhesion to the substrate (insulating substrate glass plate) decreases.

When using a black organic pigment, a red organic pigment, and a blue organic pigment as the organic pigment, the mixing ratio of each organic pigment is 5 to 20% by weight of the black organic pigment and 5 to 1% by weight of the red organic pigment.
It is preferable to use 0% by weight and 5 to 10% by weight of the blue organic pigment.

In addition, the weight ratio of the red organic pigment and the 1-color 41 pigment is:
- As mentioned above, l: 0.5 to 1.2 is preferable, and l: 1.8 to 1.5 is particularly problematic.

If each of the black organic pigment, red organic pigment, and old-color organic pigment is less than 5% by weight, the light-shielding rate of the light-shielding film formed by photolithography decreases, and a large film thickness is required, and as a result, the color filter This will disrupt production.

Furthermore, if the content exceeds 20% by weight, 10% by weight, or 10% by weight, the content of the cured resist in the binder decreases, including the addition of the light-shielding material, making it impossible to form a light-shielding film pattern as a fluff matrix. and the board (
Mechanical strength such as adhesion to insulating substrates (glass plates) decreases.

The proportion of the photoinitiator is preferably 0.5 to 10% based on the weight of the photosensitive resin (solid content).

If it is less than 0.5%, since a light shielding material is added, photopolymerization or photocrosslinking (curing) cannot be initiated, and the resist does not behave as a negative type resist.

On the other hand, if it exceeds 10%, the polymerization degree or crosslinking degree (curing degree) of the resist will decrease, and the mechanical strength as a binder for pigment-based and light-shielding materials will decrease.

The proportion of dispersant is based on the total amount of organic pigment and light shielding material.
It is preferable to set it to 1% or more.

If it is less than 1%, the dispersion of the pigment and light-shielding material cannot be maintained stably, causing aggregation, and as a result, the mechanical strength such as the adhesive strength of the light-shielding film obtained by photolithography to the substrate is adversely affected. cause

The proportion of the solvent depends on the solid content concentration of organic pigments, light shielding materials, photosensitive resins, photoinitiators, dispersants, etc. contained in the resist.
% to 50%.

If the solid content concentration is less than 5%, the viscosity of the resist is too low, and it is difficult to form a light-shielding film with a thickness sufficient to achieve a light-shielding rate of 999% or more when coating the substrate. Become.

On the other hand, if the solid content concentration exceeds 50%, resist coating rl
If the pre-baking process is carried out for a long period of time, the adhesion strength of the light shielding film to the substrate will deteriorate mechanically due to residual solvent. Furthermore, the smoothness of the light-shielding film is not adversely affected by the viscosity of the resist being too high.

Next, a description will be given of the method of manufacturing the resist for forming a light-shielding film according to the present invention.

In the method of the present invention, first, a light shielding material is mixed with an organic pigment in an appropriate amount to form a mixture.

Next, the mixture, photosensitive resin (solid content) or resist agent (solid content solvent), dispersant, and photoinitiator are added to the solvent and mixed using a mixer. , to disperse organic pigments and light-shielding materials.

Here, it is preferable to perform the mixing using a mixer that does not generate heat from the viewpoint of preventing agglomeration of the resist. Examples of such a mixer include a Santo mill, a ball mill, and a three-roll mill.

- A resist for forming a light-shielding film is prepared by filtering the dispersion under pressure through a filter.

In addition, it is preferable to use a filter in which the average particle size of the organic pigment and the light shielding material is 0.3 gm or less. In addition, the average particle size of organic pigments and light-shielding materials was reduced to 0.
．． Centrifugation may be used to reduce the amount to 3 gm or less.

Next, the light shielding film of the present invention will be explained. The light shielding film is 1.
, is formed by photolithography using the above-mentioned light-shielding film forming non-n resist of the present invention.

FIG. 1 is a flowchart showing an example of a process for manufacturing a light shielding film using a photolithography method.

(2) First, the above-described resist for forming a light-shielding film of the present invention is applied to a substrate such as glass on which ITO electrodes are formed.

Glass substrates include sortalime (SL) glass, low expansion glass (LE), non-alkali glass (NA),
A material such as quartz glass is used. Examples of the coating method include a coach ink method using a spin coater or roll coater, and spray coating using a compressor. The rotational speed of the spin coater or roll coater is appropriately selected depending on the viscosity of the resist, the desired film thickness, etc., and is, for example, 200 to 3000 rpm.

(2) After coating the resist for forming a light shielding film, prebaking is performed. Preventing is performed for the purpose of dry m% of the resist.

Prebaking is carried out by heating in an oven, small plate, or the like. The heating temperature and heating time in prebaking are appropriately selected depending on the solvent used, and is carried out, for example, at a temperature of 80 DEG C. to 150 DEG C. for 5 to 60 minutes.

■After prebaking, add %I of polyvinyl alcohol aqueous solution (for example, CP manufactured by Fuji Hunt Electro Technology Co., Ltd.)
The coating IIj of polyvinyl alcohol used in Hi is performed to form a protective film and prevent inhibition of curing of the resist by oxygen in the air. The method of application etc. is the same as in Section L.

■After applying polyvinyl alcohol, pre-bake. The purpose, method, temperature for 2 hours, etc. of the pre-beta are the same as in (2) above.

(After prebaking, exposure is performed. The exposure is performed by an exposure machine, and by exposing through a photomask having a desired pattern, only the portions of the resist corresponding to the pattern are exposed. Exposure equipment, exposure conditions, etc. are appropriately selected and are not particularly limited.

The exposure amount is 1, for example 5-200 mJ/cm2
The range is selected.

Further, the light source is determined depending on the photosensitivity characteristics of the resist for the light-shielding film used, and for example, a high-pressure mercury lamp of 2 gw is used.

■After exposure, development is performed. Development is performed to remove exposed portions (in the case of positive resist) or non-exposed portions (in the case of negative resist) of the resist, and a desired pattern is formed by this development.

The developer varies depending on the components of the resist agent used.
It is appropriately selected from those capable of dissolving and removing the resist. When using a commercially available resist agent, developers suitable for each resist are commercially available, and these commercially available products may be used, or an alkaline aqueous solution is often used.

As the developer, for example, 0.05 to 0.2N 3? A mixed aqueous solution of sodium chloride acid (N a 2 CO 3 ) and an ionic surfactant, a developer (CD) manufactured by Fuji Hunt Electro Technology Co., Ltd., a photonice developer (D
V505) etc.

The concentration of the developer and the development time are appropriately selected depending on the resist and developer used.

(7) After development, shower with pure water or use pure water and/or
Alternatively, rinsing is performed by immersion in isopropyl alcohol (IPA) AV. In this case, ultrasound may also be used. Note that rinsing is performed with the purpose of removing the developer.

(8) Post-baking is performed after rinsing. Post-baking is performed in order to improve the adhesion between the patterned light-shielding film resist and the substrate. This post-bake, like the pre-bake, is performed by heating with an oven, hot plate, etc.

The heating temperature and heating time in post-baking are appropriately selected, for example, at a temperature of 200 to 300°C for 5 to 60 minutes.

A patterned light-shielding film is manufactured through each process using the photolithography method described above.

Here, the pattern of the light-shielding film can be obtained by patterning, for example, a black matrix shape for color filters or a black matrix shape for liquid crystal projection.

Note that the manufacturing process of the light-shielding film by the photolithography method described above is merely an example, and the present invention is not limited thereto in any way.

For example, it is possible to omit a part of the process such as coating with a Wk-retaining film, or to add a known process such as post-exposure pre-bake (PEB) as appropriate.

[Example] Hereinafter, the present invention will be described in detail based on Examples.

Example 1 As a red organic pigment, cyantraquinonyllet (A2
B, manufactured by Chiha Geigy) 10g and blue I! jj: Copper phthalocyanine (Heliogenbu JL, -L
7072D, manufactured by BASF) log, 10 g of carbon flux as a light shielding material, acrylic resistant UV yj, 91 g of cured η Lucist (Aronix manufactured by Toagosei Co., Ltd.) (solid content 77%), as a photoinitiator] Helichloromethyl-5- t
- After mixing 3 g of a riazine derivative, 1.5 g of a dispersant, and 309 g of ethyl cellosol acetate as a solvent, the mixture was dispersed in three directions using a Santomill. Next, the dispersion liquid was applied under pressure (5 kg
G/cm') to produce 435 g of ultraviolet curing resist for forming a light-shielding film (+average particle size 0.2 μm)? :It was adjusted.

An ITO patterned substrate (NA45, 300 mmj' from HOYA Co., Ltd.) with a sheet resistance of 20 Ω/hole as an ITO film.
/I, kQ radiation 90pm, gap 20gm, m&15
The cyst was spin-coded at a rotation speed of 500 rpm to form a uniform coating film (11). After the spin code, pre-bake at 135°C for 15 minutes, and then
A polyvinyl alcohol aqueous solution (manufactured by Fuji Hunt Electro Technology Co., Ltd.: CP) was applied in the same manner, and prebaking was performed again at 85° C. for 15 minutes. This substrate then has a mask with a black matrix design,
It was set in an exposure machine having a 2Kw high pressure mercury lamp as a light source. Then, exposure was performed with a proximity gap of 50 μm and an energy of 10 mJ/cm 2 without alignment. Next, the film is developed by immersing it in an alkaline developer (a 5-fold dilution of CD manufactured by Fuji Hunt Electro Technology Co., Ltd.). After development, after rinsing with pure water, at 200°C.
A black light-shielding film (flux matrix) was formed by post-baking for 60 minutes.

Next, add the ferrocene derivative micelle agent FPE to the pure water.
G (manufactured by Doka Kagaku Co., Ltd.), LiBr (manufactured by Wako Tsumugi Co., Ltd.) and cyanide l-laquinonyl leut (A2B.

(manufactured by Chiha Geigy) and 2mM each.

After making a solution of 0.1 M and 10 g/liter and dispersing it for 30 minutes using an ultrasonic homogenizer (micelle solution), the ITO pattern with black matrix was prepared (the plate was immersed in the micelle solution, and the R rows of the stripes were filled with holes). Connect a densityostat. Perform constant potential electrolysis at 05 V to obtain a thin film of color filter R. After washing with pure water, prebaking in an oven (180°C).G is Heliogen Clean L9361 (BASF) 15g/f1.B was used to form a film under the same conditions as R, except that the concentration of 7080 (BASF) was changed to 9g/f1.B.
The color filter thin film in B is 11.

The black matrix of the color filter thus obtained had a film thickness of 1.5 gm, a light shielding rate of 99.9% or more, which was extremely high, and a sheet resistance of 10'Ω/hole. RG
Filter B stays within the range of 0°6 to 1.04 gm, and becomes a color filter with extremely few irregularities.
It has been possible to manufacture color filters without forming thin films on electrodes other than the electrodes. Further, the resistance value of the color filter was 10'Ω/portion, indicating that it was a conductive color filter.

Example 2 Beryrenzlac (manufactured by BASF) was used as a black organic pigment.
The same operation as in Example 1 was performed except that an ultraviolet curable resist for forming a black light-shielding film was prepared using 25 g of KOO84), 5 g of carbon fluff as the M light material, and 310 g of propylene glycol methyl ether acetate as the solvent. .

As a result, the physical properties of the black matrix are as follows:
It was possible to manufacture a black matrix for liquid crystal projection with a light shielding rate of 99.9% or more and a sheet resistance of 1012 Ω/hole.

Example 3 5 g of quinacridone as a red organic pigment, 5 g of chlorocopper phthalocyanine as a blue organic pigment, and 99910 g of shea kelp as a black organic pigment. Using carbo black log as a light shielding material, cyclohexanone long and 215 g of ethyl cellosolve acetate as solvents, ball mill 4
The same operation as in Example 1 was carried out except that the ultraviolet curable resist for forming a black light-shielding film was adjusted over time.

As a result, the physical properties of the black matrix are as follows:
gm, light shielding -1<99.9% or more, and a sheet resistance of 109 Ω/mouth, making it possible to manufacture a color filter without forming a thin film on electrodes other than the current-carrying electrodes.

Example 4 315 g of naphthol A as a red organic pigment, 15 g of zinc phthalocyanine as a blue 41 pigment, log of chromium chloride as a light shielding material, and acrylic acid resist (manufactured by Toagosei Co., Ltd., Aronix, solid content 7) as an ultraviolet curing resist.
5%) 60g plus Irgacure 90 as photoinitiator
7 (manufactured by Ciba Geigy), 2 g of a dispersant, and 400 g of methyl cellosolve acetate as a solvent to prepare an ultraviolet curable resist for forming a black light-shielding film.

As a result, the physical properties of the black matrix are as follows:
It has become possible to manufacture a color filter with a light shielding rate of 99.9% or more, a single surface resistance of 10'Ω/mouth, and no thin film formed on electrodes other than current-carrying electrodes.

Tomoe Seij 20g of perylene black as a black organic pigment, 10g of titanium black as a light shielding material, CG136 as a photoinitiator
The same operation as in Example 1 was performed except that 3 g of 9 (manufactured by Chiha Geigy) and 310 g of diethylene glycol methyl ether acetate were used as the solvent to prepare an ultraviolet curable resist for forming a black light-shielding film.

As a result, the physical properties of the black matrix were as follows: ) 1!2 thickness 1.6 gm, light shielding rate 99.9%, single surface resistance 109 Ω/
Therefore, it has become possible to manufacture color filters without forming thin films on electrodes other than the current-carrying electrodes.

Example 6 10 g of dioxazine violet as a purple organic pigment (
(manufactured by Chiha-Geigy), 15 g of tetrachloroisointrinon (manufactured by Chiha-Geigy) as a yellow organic pigment, 10 g of carbon fluff as a light-shielding material, and acrylic acid-based Resis l- (manufactured by Toagosei, Aroninx, solid) as an ultraviolet curing resist. 75%) and 225 g of diethylene glycol ethyl ether acetate as a solvent were dispersed for 3 hours using a -E main roll to prepare an ultraviolet curable resist for forming a black light-shielding film. Except that the rotation speed of the spin cord to the fTo substrate was set to 80 Orpm.
The rotation operation as in Example 1 was performed.

As a result, the physical properties of the black matrix are as follows:
0 lm, j! Light rate 99.9% or more”1, sheet resistance 109Ω/
As a result, color filters could be manufactured without forming thin films on electrodes other than the current-carrying electrodes.

Example 7 10 g of dimethyl quinacridone (manufactured by Ciba Geigy) as a macenta pigment, metal-free phthalocyanine TOG as a cyanine pigment, titanium black IOg as a g-light material, and acrylic acid resist (manufactured by Toagosei Co., Ltd.: AROEX) as an ultraviolet curing resist. The same operation as in Example 1 was carried out except that 1 g of 8' (solid content 75%) and 310 g of propyl cellosolfacedate were used as the solvent.

As a result, the physical properties of the black matrix are H! 2 Thickness 1.7gm! Light rate 99.9% or more” - single-sided resistance 109Ω
As a result, it has become possible to manufacture color filters without forming thin films on electrodes other than the current-carrying electrodes.

Example 8 15 g of anthraquinone was used as a red organic pigment, log of magnesium phthalocyanine was used as a blue organic pigment, log of polychlorocopper phthalocyanine was used as a green organic pigment, and perylene black (BASF; 008) was used as a black organic pigment.
6) 10 g and an acrylic acid resist (manufactured by Toagosei Co., Ltd.: Aroex. Solid content 75) as an ultraviolet curing resist.
%) 73 g, trichloromethyl-5-) as photoinitiator
- Operation 1'1 was carried out in the same manner as in Example 1, except that 1.7 g of riazine derivative, 3.0 g of dispersant, and 300 g of butyl cellosolve acetate were used as a solvent to prepare an ultraviolet curable resist for forming a black light-shielding film. .

As a result, the physical properties of the black matrix are as follows:
.mu.m, light shielding rate of 99.9% or more. 2. Sheet resistance of 10 .OMEGA./mouth. 1. Color filter could be manufactured without forming a thin film on the electrodes other than the energized electrodes.

Example 9 Benzopyran Log as a red organic pigment, 5 g of indophenol blue as a blue 41 pigment, 5 g of polychlorofuromphthalocyanine as a green 41 pigment, perylene black log as a black organic pigment, and iron-resistant iron (iron black) as a light shielding material. 5g, acrylic leprosy resist (Toagosei Co., Ltd.; Aronix, solid content 7) as an ultraviolet curing resist.
7%) and 572 g of propylene glycol ethyl ether as a solvent to prepare an ultraviolet curing resist for forming a black light-shielding film. The spinning operation was carried out as in Example 1 except that the rotation speed of the spin cord to the ITO substrate was 200 rpm.

As a result, the physical properties of the black matrix were as follows: film thickness 18m, light shielding -j! :99.9% or more, sheet resistance 1010Ω/
Therefore, it has become possible to manufacture color filters without forming thin films on electrodes other than the current-carrying electrodes.

Example 10 10 g of Shicomin as a red organic pigment, 10 g of chloroaluminum talocyanine as a blue organic pigment 1, and 440 g of photosensitive polyimide (Toshi Photonice UR3100, solid content 17%, manufactured by Toshi Co., Ltd.) as an ultraviolet curable resist.
An ultraviolet curing resist for forming a black light-shielding film was prepared using 580 g of NMP as a solvent. After coating the ITO substrate with ID and A light (100 mJ/cm2), rinse with pure water to wash off the PVA protective film and develop. For development, long-sonic development was performed for 50 seconds using a Photonice developer (DV-505, manufactured by Toshisha Co., Ltd.), ultra-RF wave rinsing was performed for 15 seconds with isopropyl alcohol, immersion was performed for 158', and the film was dried by nitrogen blowing. Finally, Bost bake at 300℃, 60℃.
A light-shielding film (fluff matrix) was obtained.

The procedure was exactly the same as in Example 1 except for the following operations.

As a result, the physical properties of the Furasok matrix are as follows:
km, a light shielding rate of 99.9% or more, and a sheet resistance of 1012 Ω/hole, making it possible to manufacture a color filter without forming a thin film on one pole other than the electrodes.

Comparative Example 1 15 g of cyantraquinonyllet as a red organic pigment,
15 g of copper phthalocyanine as i'+ color right machine face 4,
Using 91 g of acrylic acid resist (manufactured by Toagosei Co., Ltd.: Aronix, solid content 77%) as an ultraviolet curable resist, and 295 g of ethyl cellosol acetate as a solvent,
The same procedure as in Example 1 was performed except that the ultraviolet curing resist for forming a black light-shielding film was adjusted (the light-shielding material was not mixed).

As a result, the Brauch matrix has a film thickness of 2, Ogm,
The light shielding rate was 95.0%, the II2 thickness was increased, the light shielding property was decreased, and the unevenness of the color filter was increased. According to the method, it is possible to form a highly insulating light-shielding film having a high light-shielding rate.

Further, according to method V' for producing a resist for forming a light-shielding film of undeveloped νj, a resist for forming a light-shielding film of undeveloped 11 having excellent characteristics can be manufactured.

Further, the light-shielding film of the present invention has a sheet resistance of 10''Ω/hole or more and a light-shielding rate of 99.9% or more, and thus has excellent properties as a light-shielding film and is highly useful.

[Brief explanation of the drawing]

1st [Manufacture of light-shielding film by A+ photolinkage method] Flow [7I] showing a specific example of two culms.

Claims (13)

[Claims] (1) An organic pigment consisting of a black organic pigment and/or a mixed color organic pigment made by mixing at least two or more organic pigments selected from red, blue, green, purple, yellow, cyanine, and magenta to create a pseudo-black color, and carbon; 1. A resist for forming a light-shielding film, comprising at least one light-shielding material selected from black, chromium oxide, iron oxide, titanium black, and aniline black, and a photosensitive resin in a solvent. (2) The resist for forming a light-shielding film according to claim 1, wherein the photosensitive resin is of an ultraviolet curing type. (3) The resist for forming a light-shielding film according to claim 1, wherein the solvent contains a photoinitiator and a dispersant. (4) The resist for forming a light-shielding film according to claim 1, wherein the proportion of the organic pigment and light-shielding material to the total amount of the organic pigment, light-shielding material, and photosensitive resin is 20 to 55% by weight. (5) The resist for forming a light-shielding film according to claim 1, wherein the proportion of the organic pigment to the total amount of the organic pigment, light-shielding material, and photosensitive resin is 15 to 40% by weight. (6) Claim 5 in which the organic pigment consists only of a black organic pigment.
The resist for forming a light-shielding film described above. (7) The resist for forming a light-shielding film according to claim 5, wherein the organic pigment consists of only a red organic pigment and a blue organic pigment. (8) The resist for forming a light-shielding film according to claim 5, wherein the organic pigment comprises a black organic pigment, a red organic pigment, and a blue organic pigment. (9) A mixed color organic pigment obtained by mixing a red organic pigment and a blue organic pigment to give a pseudo-black color is used as the organic pigment, and the weight ratio of the red organic pigment and the blue organic pigment is 1:0.5 to 1:
2. The resist for forming a light-shielding film according to claim 1. (10) black organic pigment and/or red, blue, green, purple,
A mixed color organic pigment made by mixing at least two or more organic pigments selected from yellow, cyanine, and magenta to create a pseudo-black color;
Dispersing at least one light shielding material selected from carbon black, chromium oxide, iron oxide, titanium black, and aniline black, a photosensitive resin, and a photoinitiator in a solvent using a dispersant, and filtering. A method for producing a resist for forming a light-shielding film, characterized by: (11) A light shielding film formed by a photolithography method using the resist for forming a light shielding film according to claim 1, which has a sheet resistance of 10^9 Ω/hole or more and a light shielding rate of 99.9%.
A light-shielding film characterized by the above. (12) A black matrix for a color filter, characterized in that the light shielding film according to claim 11 is patterned into the shape of a black matrix for a color filter. (13) A black matrix for liquid crystal projection, characterized in that the light shielding film according to claim 11 is patterned into the shape of a black matrix for liquid crystal projection.