JPH0419194A - Manufacturing method of card edge type memory card - Google Patents
Manufacturing method of card edge type memory cardInfo
- Publication number
- JPH0419194A JPH0419194A JP2124755A JP12475590A JPH0419194A JP H0419194 A JPH0419194 A JP H0419194A JP 2124755 A JP2124755 A JP 2124755A JP 12475590 A JP12475590 A JP 12475590A JP H0419194 A JPH0419194 A JP H0419194A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- bonded
- manufacturing
- memory card
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 17
- 230000001681 protective effect Effects 0.000 claims abstract description 13
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 abstract description 5
- 238000000465 moulding Methods 0.000 abstract description 4
- 239000006071 cream Substances 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract 1
- 238000011109 contamination Methods 0.000 abstract 1
- 238000007689 inspection Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は、カードエツジ型メモリーカードの製造方法に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a card edge type memory card.
［従来の技術］
従来、カードエツジ型メモリーカードを製造する場合、
その端子は、何の保護手段もとられていなかった。[Conventional technology] Conventionally, when manufacturing a card edge type memory card,
The terminal had no protection whatsoever.
［発明が解決しようとする課題］
しかし、従来の製造方法では、端子の保護手段がとられ
ていないため、製造途中で、端子にキズ、汚れが付着し
、端子外観不良、端子接触不良が多発するという問題点
を有していた。[Problems to be solved by the invention] However, in the conventional manufacturing method, no protection measures are taken for the terminals, so the terminals get scratched and dirty during the manufacturing process, resulting in poor terminal appearance and poor terminal contact. There was a problem with this.
そこで本考案は、従来のこのような問題点を解決するた
め、メモリーカードの接続端子に保護テープを貼り、製
造することにより、製造途中で付着するキズ、汚れを防
止することを目的とする。In order to solve these conventional problems, the present invention aims to prevent scratches and dirt from forming during the manufacturing process by attaching protective tape to the connection terminals of memory cards.
［課題を解決するための手段］
本発明のカードエツジ型メモリーカードの製造方法は、
前記メモリーカードの接続端子に保護テープを貼り、製
造したことを特徴とする。[Means for Solving the Problems] The method for manufacturing a card edge type memory card of the present invention includes:
The memory card is manufactured by pasting a protective tape on the connection terminals of the memory card.
［実施例］ 以下に本発明を実施例に基づき詳述する。[Example] The present invention will be explained in detail below based on examples.
第１図は、本発明によるメモリーカード製造のフローチ
ャートであり、基板に工Ｃをペアチップ状態で搭載する
ＣＯＢ実装方式を用いた場合の実雄側である。FIG. 1 is a flowchart of manufacturing a memory card according to the present invention, and shows the actual side when using a COB mounting method in which chips are mounted on a board in the form of paired chips.
各工程について簡単に説明を加える。Add a brief explanation for each process.
■ 接続端子保護フィルム貼付
第２図に示すように、基板１の接続端子２に保護テープ
５を貼り付ける。(3) Attaching a protective film to the connecting terminals As shown in FIG. 2, attach the protective tape 5 to the connecting terminals 2 of the board 1.
■ ダイアタッチ
基板１に工ａを接着固定する。（第４図）■ ボンディ
ング工程
基板パターンと工Ｃチップのパッドとの接続を行う。（
第４図）
■ モールド
ＩＣチップの封止工程。（第４図）
■ 半田塗布
素子半田付ランドパターンにクリーム半田を塗布する。■ Glue and fix workpiece a to the die attach substrate 1. (Fig. 4) ■ Bonding process The substrate pattern and the pads of the C chip are connected. (
Figure 4) ■ Sealing process for molded IC chips. (Fig. 4) ■ Apply cream solder to the solder land pattern of the solder application element.
（第４図）
■ 素子搭載
半田塗布済みのランドパターンに素子部品を載せる。（
第４図）
■検査
外観検査、電気特性検査を行う。(Fig. 4) ■ Mounting the element Place the element component on the solder-applied land pattern. (
(Figure 4) ■Inspection Perform appearance inspection and electrical property inspection.
■ 回路ブロック組込
第６図に示すように、■〜■にて組立てた回路ブロック
４を、カード形状にするため５のプラスチックフレーム
に、組込み接着する。(2) Assembling the circuit block As shown in FIG. 6, the circuit block 4 assembled in steps (1) to (4) is assembled and glued into the plastic frame 5 to form a card shape.
■ 保護テープ剥離
第５図に示すように、■の工程で貼り付けた保護テープ
５をはがす。■ Peel off the protective tape As shown in Figure 5, peel off the protective tape 5 pasted in step (■).
［相］ 最終検査
最終外観検査、電特検査
本実施例の場合、ボンディング工程で、基板を自動送り
するさいに端子に付けるキズ、モールド工程での端子へ
のモールド剤の付着、半田塗布工程でのクリーム半田の
端子への付着１回路ブロック組込工程で、回路ブロック
を接着するさいの接着剤の端子への付着２等の各工程で
付く端子のキズ、汚れを保護テープ貼り付けにより防止
することができる。[Phase] Final inspectionFinal appearance inspection, electric properties inspectionIn this example, there were no scratches on the terminals during the bonding process when the board was automatically fed, molding agent adhering to the terminals during the molding process, and scratches during the solder application process. Adhesion of cream solder to the terminals (1) Adhesion of adhesive to the terminals when bonding the circuit block during the circuit block assembly process (2) Preventing scratches and stains on the terminals during each process by pasting protective tape. be able to.
特に、本実施例のＯＯＢ実装の場合、前述の通り、端子
へのキズ、汚れが付着する工程が多いため、テープで端
子を保護することは、非常に有効な方法となる。In particular, in the case of the OOB mounting of this embodiment, as described above, there are many steps in which the terminals get scratched or dirty, so protecting the terminals with tape is a very effective method.
Ｌ発明の効果］
本発明は、カードエツジ型メモリーカードの接続端子に
保護フィルムを貼り、製造するという簡幣な方法により
、接続端子に付着するキズ、汚れを防止し、端子外観不
良、端子接触不良等の発生を防止する効果がある。[Effects of the Invention] The present invention uses a simple manufacturing method of attaching a protective film to the connection terminals of a card edge type memory card, thereby preventing scratches and dirt from adhering to the connection terminals, and preventing poor terminal appearance and poor terminal contact. This has the effect of preventing the occurrence of such problems.
第１図は、本発明による製造工程のフローチャート図。
第２図は、保護テープ貼り付は時の斜視図。第６図は、
回路ブロック組込時の斜視図。第４図は、第６図回路ブ
ロックのＡ−Ａ断面図。第５図は、保護テープ剥離時の
斜視図。
１・・・−・・・・基 板
２−・・・−接続端子
５・・・・−・・・・保護テープ
４−・・・・・・・・回路ブロック
５−・・・・・−・グラスチックフレーム第１叉
第２図
第４園FIG. 1 is a flowchart of the manufacturing process according to the present invention. Figure 2 is a perspective view when the protective tape is applied. Figure 6 shows
A perspective view when the circuit block is assembled. FIG. 4 is a sectional view taken along line AA of the circuit block shown in FIG. FIG. 5 is a perspective view when the protective tape is peeled off. 1...--Board 2--Connection terminal 5--Protective tape 4--Circuit block 5-- -・Glasstic frame 1st or 2nd figure 4th garden
Claims (1)
において、前記メモリーカードの接続端子に保護テープ
を貼り、製造したことを特徴とするカードエッジ型メモ
リーカードの製造方法。A method for manufacturing a card edge type memory card, which comprises manufacturing a card edge type memory card equipped with a memory IC by pasting a protective tape on the connection terminal of the memory card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2124755A JPH0419194A (en) | 1990-05-15 | 1990-05-15 | Manufacturing method of card edge type memory card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2124755A JPH0419194A (en) | 1990-05-15 | 1990-05-15 | Manufacturing method of card edge type memory card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0419194A true JPH0419194A (en) | 1992-01-23 |
Family
ID=14893317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2124755A Pending JPH0419194A (en) | 1990-05-15 | 1990-05-15 | Manufacturing method of card edge type memory card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0419194A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014185330A1 (en) * | 2013-05-15 | 2014-11-20 | 日本写真印刷株式会社 | Transparent conductor |
| JP2014241128A (en) * | 2013-05-15 | 2014-12-25 | 日本写真印刷株式会社 | Touch sensor and touch sensor module |
-
1990
- 1990-05-15 JP JP2124755A patent/JPH0419194A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014185330A1 (en) * | 2013-05-15 | 2014-11-20 | 日本写真印刷株式会社 | Transparent conductor |
| JP2014241128A (en) * | 2013-05-15 | 2014-12-25 | 日本写真印刷株式会社 | Touch sensor and touch sensor module |
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