JPH04192538A - False bonding prevention device for ultrasonic wire bonder - Google Patents

False bonding prevention device for ultrasonic wire bonder

Info

Publication number
JPH04192538A
JPH04192538A JP2325060A JP32506090A JPH04192538A JP H04192538 A JPH04192538 A JP H04192538A JP 2325060 A JP2325060 A JP 2325060A JP 32506090 A JP32506090 A JP 32506090A JP H04192538 A JPH04192538 A JP H04192538A
Authority
JP
Japan
Prior art keywords
bonding
tool
detection device
wire
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2325060A
Other languages
Japanese (ja)
Inventor
Masao Kosugi
小杉　政夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP2325060A priority Critical patent/JPH04192538A/en
Publication of JPH04192538A publication Critical patent/JPH04192538A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To eliminate defective quality induced by false bonding by installing a detection device which detects if a bonding wire exists at a proper position in the lower part of a tool and a controller which instructs the bonding action to be continued or halted based on a signal detected through this detection device. CONSTITUTION:A detection device lowers a tool 4 again to a lead 3 side after second bonding and carries out ultrasonic oscillation and defects if a bonding wire 5 is located at a proper position under the tool 4 based on its feedback waveform level. A controller 2 instructs the continuity or the stoppage of bonding action based a signal detected through this detection device 1. Therefore, every time when second bonding action is carried out, it detects the presence of bonding wire 5. It is capable of forcing the bonding action to be continued or halted, responding to the presence of the bonding wire 5 detected. Therefore, this construction makes it possible to prevent false bonding action and hence eliminate defective quality.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は超音波ワイヤボンダにおける空打ちを防止する
装置に適用して有効な技術に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a technique that is effective when applied to a device for preventing blank firing in an ultrasonic wire bonder.

〔従来の技術〕[Conventional technology]

従来の超音波ワイヤボンダとしては、たとえば応用技術
出版、１９８５年１１月３日発行、「最近の半導体アセ
ンブリ技術とその高信頼化・全自動化Ｊ　Ｐ１５７〜Ｐ
１６６に記載されたものがある。Conventional ultrasonic wire bonders are used, for example, in "Recent Semiconductor Assembly Technology and its High Reliability and Full Automation JP," published by Applied Technology Publishing, November 3, 1985, JP 157-P.
There is one described in 166.

すなわち、この超音波ワイヤボンダは、ツールと、この
ツールを加圧する加圧部と、超音波発振器と、この超音
波発振器からの超音波の振幅を拡大させてツールに伝達
するホーンと、ボンディングワイヤをクランプするクラ
ンパとを備え、超音波振動を接続するボンディングワイ
ヤに伝え、このボンディングワイヤとツールとの間に摩
擦熱を発生させることによりボンディングを行うもので
ある。In other words, this ultrasonic wire bonder includes a tool, a pressure unit that pressurizes the tool, an ultrasonic oscillator, a horn that expands the amplitude of the ultrasonic wave from the ultrasonic oscillator and transmits it to the tool, and a bonding wire. The tool is equipped with a clamper for clamping, transmits ultrasonic vibrations to the bonding wire to be connected, and performs bonding by generating frictional heat between the bonding wire and the tool.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかし、前記した従来の超音波ワイヤボンダの構造では
、ボンディング動作中にツール内にボンディングワイヤ
かとの位置にあるかを検出する装置が設けられていない
構造であるので、空打ち防止に対して配慮されておらず
、空打ちによりＳｉ露出などの品質不良をきたすという
問題かあった。However, in the structure of the conventional ultrasonic wire bonder described above, there is no device installed in the tool to detect whether the bonding wire is in the same position as the bonding wire during the bonding operation. However, there was a problem in that blank firing caused quality defects such as Si exposure.

本発明は、前記問題点に着目してなされたもので、その
目的は、ボンディング動作中に空打ちを未然に防止し、
空打ちによる品質不良をなくすことのできる超音波ワイ
ヤボンダのボンディング空打ち防止装置を提供すること
にある。The present invention has been made in view of the above-mentioned problems, and its purpose is to prevent dry bonding during bonding operations,
It is an object of the present invention to provide a bonding blank firing prevention device for an ultrasonic wire bonder that can eliminate quality defects due to blank firing.

〔課題を解決するための手段〕[Means to solve the problem]

本願において開示される発明のうち、代表的なものの概
要を簡単に説明すれば、下記のとおりである。A brief overview of typical inventions disclosed in this application is as follows.

すなわち、本発明の超音波ワイヤボンダのボンディング
空打ち防止装置は、２ｎｄボンディング後、リード側に
再度ツールを下降させ、ツールの下側の適正位置にボン
ディングワイヤかあるか否かを検出する検出装置と、こ
の検出装置からの検出信号に基づき、ボンディング動作
の続行、あるいは停止を指令する制御装置とを備えた構
造としたものである。That is, the bonding blank firing prevention device for an ultrasonic wire bonder of the present invention includes a detection device that lowers the tool to the lead side again after the second bonding and detects whether or not the bonding wire is at the proper position below the tool. , and a control device that instructs to continue or stop the bonding operation based on the detection signal from the detection device.

〔作用〕[Effect]

本発明の超音波ワイヤボンダのボンディング空打ち防止
装置によれば、２ｎｄボンディング後、リード側に再度
ツールを下降させ、・ツールの下側の適正位置にボンデ
ィングワイヤかあるか否かを検出する検出装置と、この
検出装置からの検出信号に基づき、ボンディング動作の
続行、あるいは停止を指令する制御装置とを備えた構造
としたので、２ｎｄボンディングを行うごとにボンディ
ングワイヤの有無を検出し、この検出したボンディング
ワイヤの有無に応してボンディング動作を続行させ、あ
るいは停止させることかできる。According to the bonding blank firing prevention device of the ultrasonic wire bonder of the present invention, after the second bonding, the tool is lowered to the lead side again, and the detection device detects whether or not the bonding wire is at the proper position below the tool. The structure includes a control device that commands the continuation or stop of the bonding operation based on the detection signal from this detection device, so that the presence or absence of the bonding wire is detected every time a second bonding is performed, and the presence or absence of the bonding wire is detected every time the second bonding is performed. The bonding operation can be continued or stopped depending on the presence or absence of the bonding wire.

したがって、ボンディング動作中に空打ちを未然に防止
し、空打ちによる品質不良をなくすことかできる。Therefore, it is possible to prevent blank bonding during the bonding operation and eliminate quality defects caused by blank bonding.

本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述および添付図面から明らかになるであろう
。The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

〔実施例Ｉ〕[Example I]

第１図は本発明の実施例１である超音波ワイヤボンダの
ポンディング空打ち防止装置を示す構成図である。Embodiment 1 FIG. 1 is a configuration diagram showing a device for preventing blank bonding of an ultrasonic wire bonder according to a first embodiment of the present invention.

本実施例１における超音波ワイヤボンダのボンディング
空打ち防止装置は検出装置ｌと制御装置２とを備えてな
る。The device for preventing blank bonding of an ultrasonic wire bonder according to the first embodiment includes a detection device 1 and a control device 2.

前記検出装置１は、２ｎｄボンディング後、リード３側
に再度ツール４を下降させて超音波発振を行い、その帰
還波形レベルに基づき、ツール４の下側の適正位置にボ
ンディングワイヤ５があるか否かを検出できるようにし
たものである。After the second bonding, the detection device 1 lowers the tool 4 toward the lead 3 side again to oscillate an ultrasonic wave, and based on the feedback waveform level, determines whether the bonding wire 5 is at an appropriate position below the tool 4. This makes it possible to detect whether

前記超音波発振の帰還波形レベルは、振動子６の外周面
に巻回されるコイル７、あるいは高周波発振器８の電流
レベルに対応しているので、前記電流レベルを検出し、
この検出した電流レベルに基づき、ボンディングワイヤ
５の有無を検出てきるようになっている。Since the feedback waveform level of the ultrasonic oscillation corresponds to the current level of the coil 7 wound around the outer peripheral surface of the vibrator 6 or the high frequency oscillator 8, detecting the current level,
Based on this detected current level, the presence or absence of the bonding wire 5 can be detected.

前記制御装置２は、前記検出装置ｌからのボンディング
ワイヤ有無の検出信号に基づき、高周波発振器８および
各種アクチュエータ９に動作の続行あるいは停止を指令
する制御機能を有している。The control device 2 has a control function of instructing the high frequency oscillator 8 and various actuators 9 to continue or stop their operations based on the detection signal of the presence or absence of a bonding wire from the detection device 1.

なお、１０はクランパで、その開閉および上下動により
ボンディングワイヤ５のカットおよびフィード動作を行
うものであり、１１はホーンである。In addition, 10 is a clamper which cuts and feeds the bonding wire 5 by opening/closing and moving up and down, and 11 is a horn.

次に、本実施例１の作用を説明する。Next, the operation of the first embodiment will be explained.

第２図ｆａ）〜げ）はボンディングの工程を示す工程図
である。FIG. 2 fa) to ge) are process diagrams showing the bonding process.

ボンディング動作は第２図（ａｌ〜（ｆｌに示す工程Ｆ
１−Ｆ６にしたかって行う。The bonding operation is performed in steps F shown in FIG.
Do this by setting it to 1-F6.

工程Ｆｌでは、１ｓｔ側でのボンディングを終了し１．
２ｎｄ側でのボンディングにおいて、加圧状態の下で超
音波発振を行い、ボンディングワイヤ５をツール４との
間に生ずる摩擦熱によりり一ト３に接合する。In step Fl, bonding on the 1st side is completed and 1.
In bonding on the second side, ultrasonic oscillation is performed under pressure, and the bonding wire 5 is bonded to the tool 3 by frictional heat generated between the bonding wire 5 and the tool 4.

工程Ｆ２ては、クランパ１０かボンディングワイヤ５を
クランプし、クランプ状態のクランパＩＯを上方へ移動
させてボンディングワイヤ５をカットする。In step F2, the clamper 10 or the bonding wire 5 is clamped, and the clamper IO in the clamped state is moved upward to cut the bonding wire 5.

工程Ｆ３では、ボンディングワイヤ５のカット後、ツー
ル４を上昇させる。In step F3, after cutting the bonding wire 5, the tool 4 is raised.

工程Ｆ４では、クランパ１０を下降させてボンディング
ワイヤ５のフィートを行う。In step F4, the clamper 10 is lowered to remove the bonding wire 5.

工程Ｆ５では、リード２近辺にツール４を移動させ、加
圧状態の下て超音波発振を行い、このときの帰還波形の
レベル、つまりコイルアないし高周波発振器８の電流レ
ベルをチエツクする。In step F5, the tool 4 is moved near the lead 2 and ultrasonic oscillation is performed under pressurized conditions, and the level of the feedback waveform at this time, that is, the current level of the coiler or high frequency oscillator 8 is checked.

すなわち、検出装置ｌはボンディングワイヤ５の存在を
検出し、この検出信号に基づき、制御装置２は高周波発
振器８および各種アクチュエータ９に動作の続行を指令
する。That is, the detection device 1 detects the presence of the bonding wire 5, and based on this detection signal, the control device 2 instructs the high frequency oscillator 8 and various actuators 9 to continue their operations.

工程Ｆ６では、前記動作続行の指令に基つき、対応した
アクチュエータ９を動作させて１ｓｔボンディング位置
にツール４を移動させる。In step F6, based on the instruction to continue the operation, the corresponding actuator 9 is operated to move the tool 4 to the first bonding position.

そして、１ｓｔボンディング位置において、前記工程Ｆ
ｌ−Ｆ３と同様のプロセスを経て１ｓｔボンディングを
行う。Then, at the 1st bonding position, the process F
1st bonding is performed through the same process as l-F3.

前記工程Ｆ４において、ボンディングワイヤ５か無くな
ってボンディングワイヤ５をフィードできない場合、工
程Ｆ５では、検出装置ｌはコイル７ないし高周波発振器
８の電流レベルからボンディングワイヤ５の非存在を検
出し、この検出信号に基づき、制御装置２は高周波発振
器８および各種アクチュエータ９に動作の停止を指令す
る。この指令によりボンディング動作か停止する。In the step F4, if the bonding wire 5 is missing and the bonding wire 5 cannot be fed, in the step F5, the detection device 1 detects the absence of the bonding wire 5 from the current level of the coil 7 or the high frequency oscillator 8, and outputs this detection signal. Based on this, the control device 2 instructs the high frequency oscillator 8 and various actuators 9 to stop their operations. This command stops the bonding operation.

このように、２ｎｄボンディングを行うごとに、ボンデ
ィングワイヤ５の有無を検出し、この検出したボンディ
ングワイヤ５の有無に応じてボンディング動作を続行さ
せ、あるいは停止させることかできる。In this way, each time the second bonding is performed, the presence or absence of the bonding wire 5 is detected, and the bonding operation can be continued or stopped depending on the detected presence or absence of the bonding wire 5.

したがって、ボンディング動作中に空打ちを未然に防止
し、空打ちによる品質不良をなくすことかできる。Therefore, it is possible to prevent blank bonding during the bonding operation and eliminate quality defects caused by blank bonding.

〔実施例２〕 第３図は本発明の実施例２である超音波ワイヤボンダの
ボンディング空打ち防止装置の要部を示す構成図である
。[Embodiment 2] FIG. 3 is a configuration diagram showing a main part of a bonding blank firing prevention device for an ultrasonic wire bonder according to Embodiment 2 of the present invention.

本実施例２における超音波ワイヤボンダのボンディング
空打ち防止装置は、前記実施例Ｉとほぼ同様であるか、
検出装置として反射型の光センサ１２をツール４の下側
に斜め下向きに指向させて設け、ボンディングワイヤ５
のフィード後、内蔵の光源で光を照射したときの反射光
の有無を検出し、この検出した反射光の有無からツール
４下端部におけるボンディングワイヤ５の有無を検出て
きるようにした点で特徴を存する。The bonding blank firing prevention device of the ultrasonic wire bonder in Example 2 is substantially the same as that in Example I, or
A reflective optical sensor 12 as a detection device is provided below the tool 4 and directed diagonally downward.
After feeding, the presence or absence of reflected light is detected when the built-in light source is irradiated with light, and the presence or absence of the bonding wire 5 at the lower end of the tool 4 is detected from the presence or absence of the detected reflected light. exists.

本実施例２の作用効果は、前記実施例１の作用効果に加
えて、２ｎｄボンディング後、ツール４を下降させて超
音波発振させる必要がないので、検出によるロスタイム
をなくすことができる。In addition to the effects of the first embodiment, the second embodiment has the advantages that, in addition to the advantages of the first embodiment, there is no need to lower the tool 4 to oscillate the ultrasonic waves after the second bonding, so that the loss time due to detection can be eliminated.

以上、本発明者によってなされた発明を実施例に基づき
具体的に説明したか、本発明は前記実施例に限定される
ものでなく、その要旨を逸脱しない範囲で種々変形可能
であることはいうまでもない。Although the invention made by the present inventor has been specifically explained based on Examples, it is to be noted that the present invention is not limited to the above-mentioned Examples, and can be modified in various ways without departing from the gist thereof. Not even.

たとえば、前記実施例２では、光センサとして反射型の
もので説明したか、これに限らず、光源と受光素子とを
互いに対向させてなる透過型の光センサを検出装置とし
て設けることかできる。For example, in the second embodiment, the optical sensor is of a reflective type, but the present invention is not limited to this. A transmissive optical sensor having a light source and a light receiving element facing each other may be provided as the detection device.

〔発明の効果〕〔Effect of the invention〕

本願において開示される発明のうち、代表的なものによ
って得られる効果を簡単に説明すれば、以下のとおりで
ある。Among the inventions disclosed in this application, the effects obtained by typical inventions are briefly described below.

（１）、２ｎｄボンディング後、リード側に再度ツール
を下降させ、ツールの下側の適正位置にボンディングワ
イヤがあるか否かを検出する検出装置と、この検出装置
からの検出信号に基づき、ポンディング動作の続行、あ
るいは停止を指令する制御装置とを備えた構造としたの
で、２ｎｄボンディングを行うごとにボンディングワイ
ヤの有無を検出し、この検出したボンディングワイヤの
有無に応じてボンディング動作を続行させ、あるいは停
止させることができる。(1) After the 2nd bonding, the tool is lowered to the lead side again, and a detection device is installed to detect whether or not the bonding wire is at the proper position below the tool, and a detection signal from this detection device is used to detect the bonding wire. Since the structure is equipped with a control device that commands the continuation or stop of the bonding operation, the presence or absence of the bonding wire is detected every time the second bonding is performed, and the bonding operation is continued depending on the detected presence or absence of the bonding wire. , or can be stopped.

（２１，したかって、ボンディング動作中に空打ちを未
然に防止し、空打ちによる品質不良をなくすことかでき
る。(21. Therefore, it is possible to prevent blank bonding during the bonding operation and eliminate quality defects caused by blank bonding.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の実施例１である超音波ワイヤボンダの
ボンディング空打ち防止装置を示す構成図、 第２図（ａｌ〜げ）はボンディングの工程を示す工程図
、 第３図は本発明の実施例２である超音波ワイヤボンダの
ボンディング空打ち防止装置の要部を示す構成図である
。 ｌ・・・検出装置、２・・・制御装置、３・・・リード
、４・・・ツール、５・・・ボンディングワイヤ、６・
・・振動子、７・・・コイル、８・・・高周波発振器、
９・・・アクチュエータ、ｌＯ・・・クランパ、１１・
・・ホーン、１２・・・光センサ。 代理人　弁理士　　筒　井　大　和 第１図 ５：ボンディングワイヤ （Ｃ） （ｅ）Fig. 1 is a configuration diagram showing a bonding dry-strike prevention device for an ultrasonic wire bonder according to Embodiment 1 of the present invention, Fig. 2 (al to ge) is a process diagram showing the bonding process, and Fig. 3 is a diagram showing the bonding process of the ultrasonic wire bonder according to the first embodiment of the present invention. FIG. 2 is a configuration diagram showing the main parts of a bonding blank firing prevention device for an ultrasonic wire bonder according to a second embodiment. l...detection device, 2...control device, 3...lead, 4...tool, 5...bonding wire, 6...
... Vibrator, 7... Coil, 8... High frequency oscillator,
9...actuator, lO... clamper, 11.
... Horn, 12... Light sensor. Agent Patent Attorney Daiwa Tsutsui Figure 1 5: Bonding wire (C) (e)

Claims (1)

【特許請求の範囲】 １、２ｎｄボンディング後、リード側に再度ツールを下
降させ、ツールの下側の適正位置にボンディングワイヤ
があるか否かを検出する検出装置と、この検出装置から
の検出信号に基づき、ボンディング動作の続行、あるい
は停止を指令する制御装置とを備えたことを特徴とする
超音波ワイヤボンダのボンディング空打ち防止装置。 ２、前記検出装置は、２ｎｄボンディング後、リード側
に再度ツールを下降させ、超音波発振を行い、その帰還
波形レベルに基づき、ボンディングワイヤの有無を検出
することを特徴とする請求項１記載の超音波ワイヤボン
ダのボンディング空打ち防止装置。 ３、前記検出装置は、２ｎｄボンディング後、リード側
に再度ツールを下降させ、ツールの下側の適正位置にボ
ンディングワイヤがあるか否かを光学的に検出する光セ
ンサであることを特徴とする請求項１記載の超音波ワイ
ヤボンダのボンディング空打ち防止装置。[Claims] A detection device for lowering the tool toward the lead side again after the first and second bonding and detecting whether or not the bonding wire is at an appropriate position under the tool, and a detection signal from this detection device. 1. A bonding blank firing prevention device for an ultrasonic wire bonder, comprising: a control device for instructing continuation or stop of bonding operation based on the above. 2. The detection device lowers the tool toward the lead side again after the second bonding, oscillates ultrasonic waves, and detects the presence or absence of the bonding wire based on the feedback waveform level. Bonding blank prevention device for ultrasonic wire bonder. 3. The detection device is an optical sensor that lowers the tool toward the lead side again after the second bonding and optically detects whether or not the bonding wire is at a proper position below the tool. The device for preventing blank bonding of an ultrasonic wire bonder according to claim 1.
JP2325060A 1990-11-27 1990-11-27 False bonding prevention device for ultrasonic wire bonder Pending JPH04192538A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2325060A JPH04192538A (en) 1990-11-27 1990-11-27 False bonding prevention device for ultrasonic wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2325060A JPH04192538A (en) 1990-11-27 1990-11-27 False bonding prevention device for ultrasonic wire bonder

Publications (1)

Publication Number Publication Date
JPH04192538A true JPH04192538A (en) 1992-07-10

Family

ID=18172708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2325060A Pending JPH04192538A (en) 1990-11-27 1990-11-27 False bonding prevention device for ultrasonic wire bonder

Country Status (1)

Country Link
JP (1) JPH04192538A (en)

Similar Documents

Publication Publication Date Title
JPS644338B2 (en)
US3784079A (en) Ultrasonic bond control apparatus
EP0540189B1 (en) Control system
JP4382281B2 (en) Method and contact part for forming an electrical connection
KR20130045808A (en) Automatic wire tail adjustment system for wire bonders
JPH04192538A (en) False bonding prevention device for ultrasonic wire bonder
JPH03245544A (en) Wire bonding
WO1996024798A1 (en) Safety ensuring apparatus
JP3724875B2 (en) A wire bonding method, a semiconductor mounting method using the wire bonding method, a wire bonding apparatus, and a semiconductor mounting apparatus including the wire bonding apparatus.
JPH1079399A (en) Wire bonding method and apparatus
JP2001105159A (en) Ultrasonic welder
JP4166450B2 (en) Laser cutting processing control method and apparatus
JP3528643B2 (en) Wire bonding equipment
JPH0774201A (en) Equipment for monitoring the supply and consumption of wires
JPH09162248A (en) Bonding tool and bonding equipment
KR20050073753A (en) Apparatus for wire bonding of semiconductor manufacturing process
JPS609664B2 (en) sonic wire bonder
JPS6256658B2 (en)
JP4264883B2 (en) Hybrid welding equipment
GB2270868A (en) Wire bonding control system.
KR20210033909A (en) Wire bonding device and wire bonding method
JPS6380547A (en) Wire bonding apparatus
JPS6335098B2 (en)
JPS6158977B2 (en)
SU1042926A2 (en) Pressure welding apparatus