JPH04192554A - Method and apparatus for assembly of electronic component - Google Patents

Abstract

PURPOSE:To prevent a dislocation from being caused between individual layers by providing the following: a means to perform an alignment operation; a means by which a connecting terminal on a printed wiring board and a lead for an electronic component are coated with a flux; and a means used to heat and bond the connecting terminal on the printed wiring board and the lead for the electronic component. CONSTITUTION:An alignment head unit 16 and a position readout unit 17 are attached collectively to an ascending and descending slide 31; they are constituted so as to be raised and lowered by using a pulse motor 32. A sliding table 41 can be moved in the X-direction by using an air cylinder; it is driven when a specimen fixation jig 44 is moved to a dispenser unit part at a flux coating operation and an adhesive coating operation. A pattern, for alignment use, which has been processed simultaneously with a connecting terminal is read out optically and aligned. When a plurality of pieces are stacked, each part between the pieces is fixed surely by using an adhesive. Thereby, a dislocation is eliminated completely at processes after an alignment treatment, and the pieces can be stacked and connected well.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an assembly method and an assembly apparatus for electronic components.
．． In particular, TAB with semiconductor chips mounted on film tape.
The present invention relates to a method and apparatus for assembling a laminated TAB package in which a plurality of packages are laminated and connected in the thickness direction via a frame formed by a printed wiring board having patterns on both the front and back sides.

[Prior art] There is a strong demand for higher density, smaller size, lighter weight, and thinner electronic equipment, and DIL and S using conventional plastic packages are becoming more popular.
Demand for TAB packages formed using the TAB method instead of OJ is increasing.

In addition, in terms of component mounting, the conventional method of arranging multiple components two-dimensionally on a single printed wiring board has become more and more popular as high-density mounting is required. Implementation is no longer sufficient.

Therefore, for example, JP-A-58-182257, JP-A-62-172749, and JP-A-1-30936
As shown in the above publication, three-dimensional mounting components in which a plurality of TAB packages and QFPs are stacked and connected in the thickness direction, which are characterized by their particularly thin thickness, have been proposed.

[Problems to be Solved by the Invention] In the assembly of such three-dimensionally mounted components, important issues are the accuracy of pattern alignment between each layer when stacking layers in multiple stages and the prevention of misalignment after one alignment. .

In the conventional assembly method, positioning was performed using a jig equipped with positioning holes provided at the ends of electronic components and positioning pins that matched the holes, as shown in Figure 2. . That is, using a positioning jig 21 in which a guide pin 20 is embedded, a guide hole of an electronic component 23 provided with a guide hole 22 is inserted into the guide pin, aligned, and stacked in multiple stages. It is.

However, according to this method, the positional misalignment between the guide hole of the electronic component and the interlayer connection pattern is directly reflected in the misalignment between the layers, and as the connection pattern pitch narrows, the adjacent pattern between the eyebrows There was a drawback that short-circuit failure occurred between the two.

In addition, after multi-stage alignment, adjacent patterns between the eyebrows are soldered to each other, but at this time, if the pins of the alignment jig are inserted into the alignment holes of the electronic component and heated, the electronic component and the jig may be heated. Due to the difference in coefficient of thermal expansion, there is a problem that large thermal stress is generated in electronic components, so in the conventional method, after positioning and stacking, the connecting terminals of the electronic components are held between the top and bottom surfaces, and the pins are removed. Soldering is done by passing it through a reflow oven. However, according to this method, the scissor attachment has the disadvantage that the position between the eyebrows may shift during the subsequent flux application and solder reflow processes, and short circuit defects may occur between adjacent patterns.

Therefore, an object of the present invention is to solve such conventional problems, and the first object is to realize highly accurate positioning of electronic components having narrow pitch terminals, and to achieve high precision alignment of electronic components having narrow pitch terminals. A second method for assembling electronic components that does not cause misalignment between layers in stacked connections.
The purpose of each is to provide an assembly device for the same.

[Means for Solving the Problems] In order to achieve the above object, the present invention optically reads the connection terminal or the alignment pattern formed by the process simultaneously with the connection terminal, and uses this information to determine the position between the eyebrows. This is for matching. Also, at the same time as aligning each layer, temporarily fix the area between the eyebrows with solder or adhesive.

It is designed to be laminated in multiple stages. Further, when forming a laminated TAB using the above-mentioned means, first, a frame is temporarily fixed to form a framed TAB, and then a plurality of framed TABs are stacked to form a laminated TAB. Furthermore, when forming the laminated TAB using the above-mentioned means, the frame and the TAB are alternately aligned and temporarily fixed, and a plurality of layers are laminated to form the laminated TAB. Furthermore, when forming a laminated TAB using the alignment bonding of the above means, the TABs with frames are sequentially laminated and solder reflow bonded to form the laminated TAB.

A specific example of the configuration of the means for achieving the above object is shown below.
means for supplying and arranging printed wiring boards and electronic components; means for suctioning and fixing printed wiring boards and electronic components on a sample mount; means for suctioning and holding printed wiring boards, electronic components, and component mounting boards on suction heads; means for transporting printed wiring boards, electronic components, and component-mounted boards to predetermined positions after suction and holding; means for rough positioning of printed wiring boards, electronic components, and component-mounted boards; means for optically reading the positional information with respect to the positioning terminal of the component; means for converting the optically read positional information into an electrical signal and displaying it on a TV monitor as a screen; A means for aligning based on the position information, a means for applying flux to the connection terminals of the printed wiring board and the electronic component leads, and a means for heating and bonding the connection terminals of the printed wiring board and the electronic component leads. and (2) a method for assembling electronic components in which multiple layers of component-mounted boards are stacked and connected in the thickness direction, a means for supplying and arranging component-mounted boards, and a means for supplying and arranging component-mounted boards; A means for suctioning and fixing a component mounting board to a sample mounting table, a means for suctioning and holding a component-mounted board to a suction head, a means for transporting one-component-mounted board to a predetermined position after suction-holding, a means for roughly aligning one-component-mounted board, and one component. means for optically reading the positional information of the positioning terminal of the mounting board; and means for converting the optically read positional information into an electrical signal and displaying it as a screen on a TV monitor;
Assembly of an electronic component comprising means for positioning based on the optically read position information, means for adhesively fixing the component mounting board and the component mounting board, and means for curing the adhesive. This is achieved by the method.

The second object is as follows: (3) In an electronic component assembly apparatus that aligns and joins electronic component leads to connection terminals of a printed wiring board,
A supply and placement mechanism that supplies and arranges printed wiring boards and electronic components, a sample mount that suctions and fixes printed wiring boards and electronic components, a suction head that suctions and holds printed wiring boards, electronic components, and component mounting boards, and printed wiring. A transport mechanism that transports a board or a board on which one electronic component is mounted by suction to a predetermined position, a coarse positioning mechanism that roughly aligns the printed wiring board, electronic components, and the board on which the component is mounted, and a terminal for positioning the printed wiring board. and a position reading mechanism that optically reads positional information between the terminal and the positioning terminal of the electronic component, and a position reading mechanism that converts the optically read positional information into an electrical signal.
An image display mechanism that displays a screen on a V monitor, an alignment mechanism that performs alignment based on the optically read position information, and a flux that applies flux to connection terminals and electronic component leads of printed wiring boards. An electronic component assembly device comprising a coating mechanism and a heating bonding mechanism for thermally bonding connection terminals of a printed wiring board and electronic component leads; A supply arrangement mechanism that supplies and places one component-mounted board in an electronic component assembly device that is stacked and connected in the horizontal direction, a sample mounting table that suction-fixes the component-mounted board, a suction head that suction-holds the component-mounted board, and a component-mounted board. A transport mechanism that transports the component to a predetermined position after holding it by suction, a rough alignment mechanism that roughly aligns the component mounting board, a position reading mechanism that optically reads the position information of the alignment terminal of the component mounting board, and an optical an image display mechanism that converts the positional information read into an electrical signal and displays it as a screen on a TV monitor; a positioning mechanism that performs positioning based on the optically read positional information; and a component mounting mechanism. This is achieved by an electronic component assembly apparatus comprising an adhesive applying mechanism for adhesively fixing the substrate and the component mounting substrate, and an adhesive curing mechanism for curing the adhesive.

[Function] According to the above means, when assembling electronic components having a narrow pitch pattern of connection terminals by stacking them in multiple stages,
It becomes possible to realize the assembly process with high efficiency and high yield. The specific effects of the present invention will be made clear in the Examples section described in detail below.

[Example] Hereinafter, an example of the present invention will be specifically described based on the drawings.

Example 1゜ First, an example of the device configuration will be described.

FIG. 1 shows an external perspective view of an electronic component assembly apparatus according to the present invention.

In the figure, the top of the pedestal 1 includes an XY robot section 2,
Sample positioning unit 3, sample placement unit 4, dispenser unit 5, pulse heat heating unit 6, U
A V-light irradiation unit 7, a frame pre-alignment 8, a TAB pre-alignment 9, a sample placement stage 10, and a stereoscopic microscope jll are installed. In addition, a TV monitor 12 is installed on the pedestal uneven part.
However, an operation panel 13, 14 is installed on the front of the gantry, and a motor controller 15 is installed on the side of the gantry.

The sample positioning unit 3 includes a positioning head unit 16 and a position reading unit 17, and is installed on the X-axis of the XY robot section 2. The sample placement table 10 has four trays 10a, 10b, 10c, and 10 for storing TAB packages and connector frames.
d is installed.

FIG. 3 is a perspective view showing enlarged details of the alignment head unit 16 and position reading unit 17 shown in FIG. 1. The alignment head unit 16 and the position reading unit 17 are integrally attached to an elevating slide 31 and can be moved up and down by a pulse motor 32.

The elevating slide 31 is guided by a slide guide bar 33 in the X direction (horizontal direction in FIG. 1) of the XY robot unit, and can be moved in the X direction by a ball screw 34.

The positioning head unit 16 is a lifting cylinder 161
, a pulse motor 162 for head rotation, a rotation angle sensor 163, a slide 164° spring 165 for pressing.
It consists of a head up/down adjustment knob 166 and a suction head 167. The suction head 167 can be moved up and down by a lifting cylinder 161, and a pulse motor 162 for rotating the head.
And rotation angle sensor 163 allows for minute angle rotation. The head up/down adjustment knob 166 is used to manually finely adjust the suction head up and down.

Pressing is done by slide 164 and spring 165.

The load when pressing the suction head against the sample is kept constant.

One pair of position reading units 17 are arranged on each side of the one positioning head unit 16.

It is composed of a TV camera 171, an optical system box 172, a light guide 173, an X-direction slide 174, an X-direction fine movement slide 175, and an X-direction adjustment knob 176. Also, a position reading hole 17 is provided at the end of the optical system box 172.
7 is provided.

The position reading unit 17 is operated by an X-direction slide 174 driven by an air cylinder.

It can be moved left and right, and can also be manually finely moved in the X direction (back and forth in the figure) using the X direction fine movement knob 176. Although not shown in the figure, a mechanism that allows manual fine movement in the X direction is also provided. The light guide 173 is for illuminating the top surface of the sample with illumination light from an external light source. irradiated. The pattern image from the sample surface is taken into the optical system box 172 through the position reading hole 177, the optical axis length etc. are adjusted by the optical system in the box, and the image is formed on the imaging surface of the TV camera.

FIG. 4 is a perspective view showing the lower surface of the suction head 167 in FIG. 3. TAB suction pedestal 2o1. A TAB suction hole 202 for vacuum suctioning the TAB package in the center, a connector frame suction pedestal 203 on the outer periphery, and a connector frame suction hole 204 in the center of two sides of the suction pedestal 203.
is provided.

FIG. 5 shows the position reading unit 17 of FIG. 1 in detail, and is a diagram showing the optical system in the optical system box 172 and the optical path of the read pattern image. Inside the optical system box 172 are prisms 220, 221, 222, 22.
3. There are lenses 224.degree. 225 and a half mirror 226, and above these there is an imaging section 227 of a TV camera. The image A from the sample located above the optical system box 172 passes through the prism 220, the lens 224, the prism 221, the half mirror 226, and the prism 221 again to reach the imaging unit 227. Further, the image B from below includes the prism 222, the lens 225, the prism 223, the prism 22
1 and reaches the imaging unit 227.

FIG. 6 is an enlarged perspective view showing the sample mounting unit 1 of FIG. 1 in detail. Slide table 41 is pedestal 1
The slide table 41 is fixed to its upper surface, and the XY child table 2 is attached to the upper surface of this slide table 41. A jig fixing stand 43 is attached to the upper surface of the XY child table 2, and a sample fixing jig 44 is attached to the upper surface of this sample fixing table 43 in a structure that allows easy attachment and detachment. Nine vacuum valves 45 are attached to one side of the jig fixing table 43 and eighteen vacuum valves 45 are attached to both sides, and a barb elbow 46 is attached to each vacuum valve 45. Further, a barb joint 47 for vacuum suction is attached to the side of the jig fixing table 43, and is connected to a barb elbow 46 by a tube 48.

FIG. 7 is an enlarged perspective view showing the sample fixing jig 44 of FIG. 6 in detail.

In the same figure, a TAB suction pedestal 441 and a TAB suction hole 442 are provided in the center of the top surface, and a connector frame suction portion 443 and a connector frame suction hole 444 are provided on the outside of the TAB suction pedestal 441, and these sides A heat insulating plate 445 is arranged in the section. In FIGS. 6 and 7 above, the TAB suction hole 442. The connector frame suction hole 444 is
They are each independently connected to each vacuum valve 45, and by independently driving the vacuum valves, each T
It has a mechanism that allows vacuum suction and release of AB and connector frame to be performed independently. In FIG. 6, the slide table 41 can be moved in the X direction by an air cylinder, and is driven when moving the sample fixing jig 44 to the dispenser unit 5 during flux application and adhesive application. X
The Y child table 2 is driven by a pulse motor and performs fine movement during positioning.

FIG. 8 is an enlarged perspective view showing details of the dispenser unit 5 of FIG. 1. Two dispenser units 5 are installed, one for adhesive application and one for flux application.
Since they are structurally the same, I will explain using the adhesive type. However, the numbers for each part are the same, and after the number, "II a17" is added for flux, and "b n" is added for adhesive.Dispenser head 51
A syringe 52 is attached to the syringe 5.
2 by a motor and screw (not shown) in the dispenser head 51.

It is pushed out by the needle 53. Dispenser head 51
is fixed by a fixing band 54 to a Z slide 55 which is moved up and down by an air cylinder. The height of the dispenser head 51 can be finely adjusted using a micrometer head 56, a height adjustment cam 57, and an adjustment knob 58. These dispenser units 5 including two slides 55 are attached to the pedestal 1 by means of holding fittings 59.
fixed on the top.

FIG. 9 is an enlarged perspective view showing details of the pulse heat heating unit 6 of FIG. 1. In the figure, heating tip 6
01 is fixed to chip fixing blocks 602 and 603. The fixed block 602.6o3 is the guide rod 6
04.605 and are attached to electrodes 608.609 via springs 606 and 607. Electrode 608,6
09 is fixed to an arm 610.611, and this arm 610.611 is fixed to a Z slide table 613 via an insulating plate 612, and this two slide table 6
13 is fixed to a Y slide table 614, and the Y slide table 614 is fixed to the frame 1. One end of the power supply lines 615, 616 is connected to a heating device power supply (not shown), and the other end is fixed to the arm 610, 611.

Arm 610.611 and tip fixing block 602.6
03 are connected by electric wires (not shown), and are configured so that pulse currents supplied from power supply lines 615 and 616 are supplied to the heating chip 601. Guide rods 604 and 60 are attached to the tip fixing blocks 602 and 603.
5 is fixed, and the guide rods 604 and 605 are
They are inserted into holes made in electrodes 608, 609 and can slide in the holes, and springs 606 and 607 always push down the chip fixing blocks 602 and 603 with a constant load. The Z and Y slides are driven by air cylinders.

FIG. 10 is an enlarged perspective view showing details of the UV light irradiation unit 7 of FIG. 1. In this figure.

UV irradiation light guide 71.72 is air cylinder 7
3, the light guide mounting which moves in an arc as shown by the dotted arrow line is fixed to the plate 74.

The UV light from light guides 71.72 is directed to arrows B and B'
Proceed in the direction shown and irradiate the upper side of the sample.

The sample fixing jig 44 and the jig fixing base 43 are clearly shown to clarify their positional relationship with the UV light irradiation unit.

Next, a description will be given of the laminated TAB to be assembled into the present device and the members constituting the laminated TAB.

Figure 11 is an external view of the TAB package, Figure 12 is the first
FIG. 1 is a cross-sectional view taken along line AA' in FIG. FIG. 13 is an external view of the connector frame, and FIG. 14 is a sectional view taken along line 8-A' in FIG. 13.

FIG. 15 is an external view of the laminated TAB, and FIG. 16 is a sectional view taken along the line AA' in FIG. 15.

In FIGS. 11 and 12, the TAB package 11
0, an LSI chip 113 is inner-bonded to a copper (Cu) pattern 112 formed on a film tape 111, and a sealing resin 114 is coated.

The outer lead 115 is a terminal for inputting and outputting signals from the outside to the TAB package, and is connected to an external circuit.

In addition, in FIGS. 13 and 14, the connector frame 12
0 uses a glass epoxy printed wiring board, hollows out the chip placement area 121 to form a frame shape, forms bonding terminals 122 and 123 on the front and back sides of the remaining base material, and connects the bonding terminals 122 and 123 with through holes 124. They are connected for continuity.

The laminated TAB 130 shown in FIG. 15 and FIG.
The connecting terminal 12 between the outer lead 115 of the TAB package 110 and the connector frame 120 shown in FIGS. 1 and 14
2 and 123 are joined together, and these are stacked and connected in a plurality of stages in the vertical direction.

Next, the assembly procedure of the stacked TAB package will be explained.

FIG. 17, FIG. 18, and FIG. 19 are assembly flow diagrams showing an example of the assembly procedure of a stacked TAB package. First, in FIGS. 17 and 19, the TAB package is supplied in the form of a continuous film that has been subjected to LSI chip bonding, sealing resin coating, aging treatment, etc. 1 individual TAB from this continuous tape
The package is cut out and separated into one TAB package. On the other hand, multiple connector frames are also patterned on one large board, and since they are supplied on that large board, they are cut and separated into one connector frame by die-cutting, similar to the TAB pattern. . The TAB package and the connector frame thus processed into individual pieces are aligned with the connection patterns of the outer leads of the TAB package and the connector frame, and are temporarily connected with solder to form a set of TAB with a frame.

Next, in FIGS. 18 and 19, the framed TAB
A plurality of TABs are aligned and temporarily fixed at the connection terminal portion between each glabella, and in this state, the glabella connection is performed by a solder reflow method to form a laminated TAB.

Other typical assembly procedures are shown in FIGS. 20 to 22. In FIG. 20, the formation of a framed TAB and the formation of a laminated TAB are performed in parallel.

In FIG. 21, the TAB package and the connector frame are stacked and connected by sequentially aligning and soldering them alternately. Further, FIG. 22 shows a method in which TAB packages and connector frames are alternately aligned, temporarily fixed, stacked, and finally connected all at once by solder reflow.

Above, the assembly procedure of the laminated TAB was mainly explained using an electronic component assembly apparatus as Example 1, but in the following Example 2, the assembly apparatus of the present invention explained with reference to FIGS. 1 to 22 was used. The stacked TAB assembly method will be explained along with its operation.

Embodiment 2 First, as a first operation, a TAB package and a connector frame are aligned and connected to form a TAB with a frame. The TAB package and the connector frame are cut into external shapes using a mold, and are placed and stored in dedicated trays each having a matrix-like storage area of 9 columns and 6 rows as shown in FIG. In this embodiment, the external shapes of the TAB package and the connector frame were cut out and the storage in the tray was performed using separate devices, but it is also possible to incorporate these devices into the present device. Further, it is also possible to carry out the conveyance to the alignment position for the next step immediately after cutting out the outline without using a tray. In this state, the sample positioning unit 3 is moved to the first position of the connector frame tray (the upper leftmost position in the figure), and the suction head 167 vacuum suctions the connector frame. The suction surface of the suction head 167 is a TAB for suctioning a TAB package as shown in FIG.
There are a suction hole 202 and a connector frame suction hole 204 for suctioning the connector frame, and these have a structure that allows suction and vacuum release independently. Operate vacuum suction.

Next, move the sample positioning unit 3 to the pre-alignment 8
Move it to the position and perform pre-alignment of the connector frame at this position. After that, the suction head 167 is sucked again, the suction head 167 is lifted, and then the sample positioning unit 3 is placed on the sample fixing jig 44 on the sample mounting unit 4.
Move to the first position on the top (the first position in the figure), lower the suction head, and place the connector frame.

The sample is placed in the sample fixing jig 44 through the TAB suction hole 442 and the connector frame suction hole 4, as shown in FIGS. 6 and 7.
44 are arranged in nine sets, each of which is structured to be capable of suctioning independently. The first connector frame is now set on the sample fixing jig 44. Thereafter, similar operations are repeated one after another to set nine connector frames on the sample fixing jig 44. In this case, the suction head 167 is always located at the electrical origin of this equipment, and the sample fixing jig 44 moves one sample at a time toward the right front in FIG. 6 to place nine connector frames. . Next, the sample mounting unit 4 is moved to the dispenser unit 5 section by driving the slide table 41. Here, the dispenser head 51a shown in FIG. 8 is lowered onto the connector frame terminal, and a prescribed amount of flux is applied onto the terminal.

By linking the movement of the sample fixing jig 44 in the X and Y directions, the vertical movement of the dispenser head 51a, and the flux discharge operation, a prescribed amount of flux can be applied onto the terminals of the nine connector frames. After this, the sample mounting unit 4 is returned to the original digit alignment position.

Next, the sample positioning unit 3 is
Move to the number position, hold the TAB package by suction, and
Pre-alignment is performed using the B pre-alignment 9, and the sample is moved onto the sample fixing jig 44.

Here, the surface pattern of the connector frame set on the sample fixing jig 44 and the TAB suctioned by the suction head 167 are shown.
The pattern on the back of the package is read by the optical mechanism shown in FIGS. 3 and 5, and both patterns are projected onto the TV monitor 11. The optical system reads patterns at two diagonal points on the TAB package and the connector frame. The optical system also controls the suction head 167 when the suction head 167 is lowered.
It is retracted from the bottom surface, and has a structure that allows it to be moved to the center position so that the patterns of the TAB package and connector frame can be read during alignment.

The pattern image read here is displayed on the monitor 11, and the amount of positional deviation is detected via the image processing device.The result is fed back to the X and Y robot section 3 to correct the positional deviation, and the connector frame and Complete the TAB pattern alignment.

Thereafter, the optical system is opened to the left and right and moved away from between the connector frame and the TAB pattern, and then the suction head 167 is pushed down to align and install the terminals of the connector frame and the leads of the TAB package.

While keeping the suction head 167 pressed down, move the heating chip 601 for pulse heat shown in FIG.
By passing a specified amount of current through the connector frame, the solder on the connector frame is melted, and a solder connection is made between the connector frame terminal and the lead of the TAB package. Next, the heating chip is moved to the connection section on the opposite side, and heat treatment is performed in the same manner. In this way, nine TAB packages and connector frames are successively connected by solder to form nine TABs with frames. next,
This framed TAB is held by suction with a suction head 167,
Stores the frame tray for TAB. This completes the first stage of forming the framed TAB.

In the formation of this frame-equipped TAB, in this embodiment, the arrangement of connector frames and flux application were processed in units of nine connector frames, but first, the first connector frame was placed on the sample fixing jig 44, and then It is also possible to form the framed TAB one by one by applying flux to the package, then placing the TAB package in an aligned position, and soldering. Furthermore, in this embodiment, flux is applied every time the connector frame and TAB package are aligned, but it is also possible to align the connector frame and TAB package first and then apply flux to the connector frame terminals. It is possible.

Next, in the second operation, the framed TABs formed in the first operation are aligned and stacked in four stages.

The procedure for temporarily fixing with adhesive will be explained.

First, a TAB with a frame is set on the tray arrangement table 10 for a TAB with a frame. The laminated TABs targeted in this example are the first to fourth tiers (the lowest framed TAB to be stacked is the first tier, and the second, third, and fourth tiers are stacked up sequentially). Although the external shapes of the TAB package and the connector frame are the same up to the stage (referred to as a stage), there are four types because the patterns of the connector frame are different. For this reason, four framed TAB trays are arranged in each stage. It has the same shape as the tray for the frame-equipped TAB frame, and is also used in this embodiment.

Next, move the sample alignment unit 3 to the frame TAB storage position No. 1 (upper left in Figure 1), and move the suction head 1
67 is lowered to suction and hold the framed TAB. Next, the suction head 167 is raised and moved to the pre-alignment mechanism to perform pre-alignment, and then moved onto the sample fixing jig 44 and fixing the framed TAB to the sample fixing jig 44 by suction. This operation is repeated nine times to place nine framed TABs on the sample fixing jig 44. Pre-alignment of the first-stage framed TAB and setting to the positioning jig are the same operations as those for the connector frame when forming the framed TAB.

Next, the sample mounting unit 4 is moved to the dispenser unit 5 section by driving the slide table 41. Here, the dispenser head 51b is lowered onto the connector frame terminal, and a prescribed amount of adhesive is applied to the longitudinal position of the connector frame length of the framed TAB. By linking the movement of the sample fixing jig 44 in the X and Y directions, the vertical movement of the dispenser head 51b, and the adhesive discharging operation, a prescribed amount of adhesive can be applied onto the terminals of the nine connector frames. can. After this, the sample mounting unit 4 is returned to the original alignment position.

Next, the frame-equipped TAB tray in the second stage holds the frame-equipped TAB at the first position in the second stage by suction, performs pre-alignment, and transports it onto the sample fixing jig 44. Here, the position reading unit 17 is placed between the first stage framed TAB on the sample fixing jig 44 and the second stage framed TAB held by the suction head 167, and The front surface pattern for positioning of the eye frame TAB and the back surface pattern for positioning of the second frame TAB are read and displayed on the TV monitor 11. At the same time, the image information read by the position reading unit 17.

The positional deviation between the first and second framed TABs is detected via the image processing device, and the result is fed back to the X and Y robots to correct the positional deviation. Thereafter, the position reading unit 17 is retracted to the left and right, the suction head 167 is lowered, and the second-stage framed TAB is placed on the first-stage framed TAB.

While holding down the suction head 167, move the UV light irradiation unit 7 and apply UV light from the light guide.
Place it at a position where the V light irradiates the adhesive application area. Here, by irradiating UV light, the first framed TAB and the second framed TAB are fixed with adhesive. After that, the UV light irradiation unit 7 is retracted to its original position, and the suction head 16 is
7 is released and the suction head 167 is raised.

This completes the adhesive fixation of the first TAB with the first step frame and the TAB with the second step frame. By repeating the above operation 9 times in sequence, the 9 first TABs with frames and the second
Positioning and adhesive fixing of TAB with step frame is completed.

Next, place the TAB with the third frame on top of the TAB with the second frame.
By positioning and adhesively fixing the TAB with the fourth stage frame on top of the TAB with the third stage frame, the positioning and lamination bonding of the nine four-stage laminated TABs is completed.

After this, the laminated TAB on the alignment jig is assembled into a framed TAB.
The tray is transported back to the position where it was placed, and the 10th stacked TAB formation operation is completed.

In the formation of the laminated TAB, in this example, a TAB with a frame is used.
Although a series of treatments such as placement and adhesive application were carried out for nine pieces, it is also possible to process one piece at a time.

Regarding positioning, automatic positioning using image processing has been explained in this embodiment, but the monitor 1
Manual alignment by operating the operation panel 13 while looking at one screen is also fully possible.

Further, in this embodiment, the TAB package has been described as an electronic component, but the present invention is not limited to the TAB package. Similarly, although the connector frame has been described as a printed wiring board, this is not limited to only printed wiring boards.

Further, in the present embodiment, in forming a TAB with a frame, the connector frame and the TAB package lead are connected by soldering by pulse heat heating, but the method is not particularly limited to this method.

Also, when forming a laminated TAB, a TAB with a frame and a TAB with a frame
Although a UV adhesive was used for fixing, the present invention is not limited to UV adhesives, and other adhesives may be used, and methods other than adhesives, such as soldering, may also be used.

[Effects of the Invention] As described above, according to the present invention, alignment is performed by optically reading the alignment pattern processed simultaneously with the connection terminal, so alignment between the eyebrows of the parts to be laminated is very easy. Can be performed well. Also.

In a plurality of laminated layers, since each layer is securely fixed with an adhesive, there is no positional shift in the process after the alignment process, and a good laminated connection can be realized.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing the external appearance of an electronic component assembly device according to an embodiment of the present invention, Fig. 2 is a perspective view illustrating a conventional assembly method, and Fig. 3 is a perspective view of a sample positioning unit. , Figure 4 is a perspective view of the bottom surface of the suction head, Figure 5 is a diagram showing the optical system and optical path inside the optical system box, Figure 6 is a perspective view of the sample mounting unit, and Figure 7 is the sample fixing jig. FIG. 8 is a perspective view of the dispenser unit, FIG. 9 is a perspective view of the pulse heat heating unit, FIG. 10 is a perspective view of the UV light irradiation unit, FIG. 11 is a perspective view of the TAB package, and FIG. The figures are a sectional view taken along line AA' in figure 11, Figure 13 is a perspective view of the connector frame, figure 14 is a sectional view taken along line AA' in figure 13, figure 15 is a perspective view of the laminated TAB, and figure 16 is a perspective view of the connector frame. The figure is number 15
The AA' cross-sectional view in the figure, and Figures 17 to 22 are laminated TAB
FIG. 3 is an assembly flow diagram showing an example of a package assembly procedure. <Explanation of symbols> 1... Frame, 2... xy robot section, 3... Sample positioning unit, 4... Sample placement unit, 5... Dispenser unit, 6... Pulse heat heating unit, 7 ... UV light irradiation unit, 8 - Frame pre-alignment, 9... TAB pre-alignment, 10 - Sample placement table, 10a, 10b, 10c, 10 d-tray, 1
1... Stereo microscope, 12... TV monitor, 13.1
4...Operation panel, 15...Monitor controller,
16...Positioning head unit, 17...Position reading unit, 31...Elevating slide, 32...Pulse motor, 3
3...Slide guide bar, 34...Ball screw. 41...Slide table, 42...XY child table 43...Jig fixing stand, 44...Sample fixing stand, 45...
・Vacuum valve, 46... Herb elbow, 47... Herb joint, 48... Tube, 51... Dispenser head, 52... Syringe, 53... Needle,
54... Fixed band, 55... Z slide, 56.
...Micrometer head, 57...Height adjustment cam,
58... Adjustment knob, 59... Holding metal fitting, 71.7
2...UV illumination light guide, 73...Air cylinder, 74...Light guide mounting plate, 110...TAB package, 111...Film tape, 112...Copper pattern, 113... LSI chip, 114... Sealing resin, 115... Outer lead, 120... Connector frame, 121... Chip placement area, 122, 123... Joining terminal, 124...
・Through hole, 130.. Laminated TAB, 161.. Elevating cylinder, 162. Pulse motor for head rotation, 1
63...Rotation angle sensor, 164...Slide for pressing, 165...Spring, 166. Head vertical adjustment part, I67... Suction head, 171... TV camera, 172. Optical system box, 173 ...Light guide, 174...X direction slide, 175...Y direction fine movement slide, 176...Y direction adjustment knob, 177...
Position reading hole, 201...TAB suction base, 202
...TAB suction hole, 203...suction pedestal. 204...Connector frame suction hole, 220-223...
Prism, 224.225...Lens, 226...
Half mirror 1227...TV camera imaging unit, 44
1...TAB suction pedestal, 442...TAB suction hole, 4
43... Connector frame suction part, 444... Connector frame suction hole, 445... Heat insulation plate, 601... Heating chip, 602.603... Chip fixing block, 604
,605・Guide rod, 606.607・Spring, 608.609・Electrode, 610,611・・
- Arm, 612... Insulating plate, 613... Z slide table, 614... Y slide table. 615.616...Power supply line.

Claims (30)

[Claims] 1. In an electronic component assembly method in which electronic component leads are aligned and bonded to connection terminals of a printed wiring board, a means for supplying and arranging the printed wiring board and electronic components, and a means for suctioning and fixing the printed wiring board and electronic components to a sample mount are provided. means for sucking and holding the printed wiring board, the electronic component, and the component mounting board on a suction head; a means for transporting the printed wiring board, the electronic component, and the component mounting board to a predetermined position after suction and holding; the printed wiring board; means for roughly aligning the electronic components and the component mounting board; means for optically reading positional information between the alignment terminals of the printed wiring board and the alignment terminals of the electronic components; and the optically read positions. A means for converting information into an electrical signal and displaying it as a screen on a TV monitor, a means for aligning based on the optically read position information, and a means for applying flux to connection terminals of printed wiring boards and electronic component leads. 1. A method for assembling an electronic component, comprising: means for coating a printed wiring board; and a means for heating and bonding a connecting terminal of a printed wiring board and an electronic component lead. 2. In an electronic component assembly method in which multiple layers of component-mounted substrates are stacked and connected in the thickness direction, there is provided a means for supplying and arranging the component-mounted substrates, a means for sucking and fixing the component-mounted substrates to a sample mount, and a means for attaching the component-mounted substrates to a suction head. means for adsorbing and holding the
means for transporting the component-mounted board to a predetermined position after holding it by suction, means for roughly aligning the component-mounted board, means for optically reading position information of positioning terminals of the component-mounting board, and means for optically reading position information of positioning terminals of the component-mounted board. means for converting the positional information into an electrical signal and displaying it as a screen on a TV monitor; means for aligning based on the optically read positional information; and bonding the component mounting board and the component mounting board. A method for assembling electronic components, comprising means for fixing and means for curing the adhesive. 3. Claim 1: The printed wiring board comprises a connector frame.
Or the method for assembling electronic components described in 2. 4. Claim 1: The electronic component comprises a TAB package.
Or the method for assembling electronic components described in 2. 5. Claim 1: The component mounting board comprises a TAB with a frame.
Or the method for assembling electronic components described in 2. 6. In an electronic component assembly device that aligns and joins electronic component leads to connection terminals of a printed wiring board, there is a supply and placement mechanism that supplies and arranges the printed wiring board and electronic components, and a sample that sucks and fixes the printed wiring board and electronic components. A mounting base, a suction head that suction-holds printed wiring boards, electronic components, and component-mounted boards; a transport mechanism that transports printed wiring boards, electronic components, and component-mounted boards to predetermined positions after suction-holding them; A coarse positioning mechanism that roughly positions the components and the board on which the components are mounted, a position reading mechanism that optically reads the positional information of the positioning terminals of the printed wiring board and the positioning terminals of the electronic components; an image display mechanism that converts the obtained position information into an electrical signal and displays it as a screen on a TV monitor, an alignment mechanism that performs alignment based on the optically read position information, and a printed wiring board. a flux application mechanism that applies flux to connection terminals and electronic component leads;
An electronic component assembly device comprising a heating bonding mechanism for thermally bonding connection terminals of a printed wiring board and electronic component leads. 7. In an electronic component assembly device that stacks and connects multiple component-mounted substrates in the thickness direction, there is a supply arrangement mechanism that supplies and arranges the component-mounted substrates, a sample mounting table that suction-fixes the component-mounted substrates, and a suction-holding device that holds the component-mounted substrates. a suction head that holds the component-mounted board by suction, a transport mechanism that transports the component-mounted board to a predetermined position after holding it, a rough-alignment mechanism that roughly aligns the component-mounted board, and an optical system that collects positional information of the alignment terminals of the component-mounted board. a position reading mechanism for reading, an image display mechanism for converting the optically read position information into an electrical signal and displaying it as a screen on a TV monitor, and an image display mechanism for positioning based on the optically read position information. An electronic component assembly device comprising: a positioning mechanism for positioning; an adhesive applying mechanism for adhesively fixing a component mounting board to a component mounting board; and an adhesive curing mechanism for curing the adhesive. 8. The printed wiring board supply and placement mechanism cuts and separates at least one printed wiring board from a member including a plurality of printed wiring boards arranged on one board, and supplies the cut and separated printed wiring board to a placement position. 7. The electronic component assembly apparatus according to claim 6, further comprising a mechanism for installing the electronic components. 9. A mechanism in which the electronic component supply arrangement mechanism cuts and separates at least one electronic component from a member including a plurality of electronic components arranged on a single board, and places the cut and separated electronic component at a supply arrangement position. 7. The electronic component assembly apparatus according to claim 6, comprising: 10. 8. The electronic component according to claim 6, further comprising a sample mount having a structure in which a printed wiring board suction and holding section for suctioning and holding the printed wiring board and an electronic component suction and holding section for suctioning and holding the electronic component are integrated. Assembly equipment. 11. 8. The electronic component assembly apparatus according to claim 6, further comprising a sample mount having a structure in which a thermal insulating material is disposed at the connection heating position. 12. 8. The electronic component assembly apparatus according to claim 6, further comprising a sample mount having a structure in which suction fixing of the electronic component and suction fixing of the printed wiring board can be independently controlled. 13. 8. The electronic component assembly apparatus according to claim 6, further comprising a sample mount having a structure capable of suctioning and fixing the connection terminals of the printed wiring board and the lead wires of the electronic component in an aligned state. 14. The apparatus for assembling electronic parts according to claim 6 or 7, further comprising a sample mount having a structure that allows it to be easily attached to and detached from the assembly apparatus main body. 15. 8. Assembly of electronic components according to claim 6, further comprising a suction head having a structure in which a printed wiring board suction and holding section for suctioning and holding the printed wiring board and an electronic component suction and holding section for suctioning and holding the electronic component are integrated. Device. 16. 8. The electronic component assembly apparatus according to claim 6, further comprising a suction head configured to independently control suction and fixation of the printed wiring board and suction and fixation of the electronic component. 17. Claims 6, 7, and 1 further comprising a suction head structured to be easily attached to and detached from the main body of the electronic component assembly apparatus.
5 or 16. The electronic component assembly device according to 5 or 16. 18. The alignment mark formed on the top surface of the printed wiring board installed on the sample mount and the alignment mark formed on the bottom surface of the electronic component suctioned and held by the suction head are simultaneously captured using the same TV camera. 7. The electronic component assembly apparatus according to claim 6, further comprising a position reading mechanism having a reading structure. 19. The alignment mark formed on the top surface of the component mounting board installed on the sample mounting table and the alignment mark formed on the bottom surface of the component mounting board held by the suction head are detected by the same TV camera. 8. The electronic component assembly apparatus according to claim 7, further comprising a position reading mechanism having a structure for simultaneously reading the positions. 20. 20. The electronic component assembly apparatus according to claim 6, further comprising an image display mechanism that simultaneously displays the position information read by the position reading mechanism as a screen on the same TV monitor. 21. Claim 6: The position reading mechanism comprises a reading mechanism for simultaneously reading alignment marks at two locations using two TV cameras, and an image display mechanism for simultaneously displaying the read position information as a screen on the same monitor.
, 7, 18, 19 or 20. 22. The above-mentioned suction head has a mechanism that can drive X, Y, Z, and θ, and the sample mounting table installed on the X and Y stages is moved while looking at the positioning mark displayed on the monitor screen. 8. The electronic component assembly apparatus according to claim 6, further comprising a positioning mechanism. 23. Claims 6 and 7, wherein the two TV cameras as the position reading mechanism are provided with a mechanism capable of moving in the X direction and the Y direction when the suction head is lowered after positioning.
22. The electronic component assembly apparatus according to 18, 19, 20 or 21. 24. It is equipped with a heating bonding mechanism that aligns the bonding terminals of the printed wiring board and the lead wires of the electronic components, presses the electronic component with the suction head, presses the heating head against the bonding part, and reflows the solder. The electronic component assembly apparatus according to claim 6 or 7. 25. 25. The electronic component assembly apparatus according to claim 24, further comprising a pulse heat type heating joining mechanism as said heating joining mechanism. 26. 8. The electronic component assembly apparatus according to claim 6, further comprising an adhesive application mechanism for applying adhesive to at least one position on the upper surface of the printed wiring board and the component mounting board using a dispenser. 27. 8. The electronic component assembly apparatus according to claim 6, further comprising a flux application mechanism that uses a dispenser to apply flux to at least one position on the upper surface of the printed wiring board and the component mounting board. 28. 28. The electronic component assembly apparatus according to claim 6, further comprising a mechanism capable of varying the height of the coating position according to the number of stacked layers of the printed wiring board and the component mounting board. 29. The electronic component assembly apparatus according to claim 6, 7, 15, 16, or 17, further comprising a mechanism that allows the suction head to rotate by 90 degrees or more. 30. 25. The electronic component assembly apparatus according to claim 24, further comprising a mechanism capable of automatically aligning the tip of the heating head.