JPH041950A - Recording medium and its manufacturing method, information processing method, information processing device - Google Patents
Recording medium and its manufacturing method, information processing method, information processing deviceInfo
- Publication number
- JPH041950A JPH041950A JP2199251A JP19925190A JPH041950A JP H041950 A JPH041950 A JP H041950A JP 2199251 A JP2199251 A JP 2199251A JP 19925190 A JP19925190 A JP 19925190A JP H041950 A JPH041950 A JP H041950A
- Authority
- JP
- Japan
- Prior art keywords
- recording medium
- information processing
- recording
- electrode
- recording layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Optical Record Carriers And Manufacture Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、記録媒体、電極基板、およびこれらの製造方
法、およびかかる記録媒体を用いてプローブ電極によっ
て記録、再生を行う記録装置、再生装置、記録再生装置
を含む情報処理装置、および記録方法、記録再生方法、
記録再生消去方法を含む情報処理方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a recording medium, an electrode substrate, a manufacturing method thereof, and a recording device and a reproducing device that perform recording and reproduction using a probe electrode using such a recording medium. , an information processing device including a recording and reproducing device, a recording method, a recording and reproducing method,
The present invention relates to an information processing method including a recording/reproducing/erasing method.
[従来の技術]
近年、メモリ材料の用途は、コンピュータおよびその関
連機器、ビデオディスク、ディジタルオーディオディス
ク等のエレクトロニクス産業の中核をなすものであり、
その材料開発も極めて活発に進んでいる。メモリ材料に
要求される性能は用途により異なるが、−船釣には、
■高密度で記録容量が大きい、
■記録再生の応答速度が早い、
■消費電力が少ない、
■生産性が高(、価格が安い、
などが上げられる。[Prior Art] In recent years, the use of memory materials has become the core of the electronics industry, such as computers and related equipment, video disks, digital audio disks, etc.
The development of these materials is also progressing very actively. The performance required of memory materials varies depending on the application, but for boat fishing, the following are: - High density and large storage capacity, - Fast response speed for recording and playback, - Low power consumption, - High productivity (, Prices are low, etc.
従来までは磁性体や半導体を素材とした半導体メモリや
磁気メモリが主であったが、近年レーザー技術の進展に
ともない、有機色素、フォトポリマーなとの有機薄膜を
用いた光メモリによる安価で高密度な記録媒体が登場し
てきた。Until now, semiconductor memory and magnetic memory were mainly made of magnetic materials and semiconductors, but with the recent advances in laser technology, inexpensive and high-density optical memory using organic thin films such as organic dyes and photopolymers has been developed. recording media have appeared.
一方、最近、導体の表面原子の電子構造を直接観察でき
る走査型トンネル顕微鏡(以後、STMと略す)が開発
され[G、B1nn1g etal、Phys、Re
v、Lett、49.57(1982)] 、単結晶、
非晶質を問わず実空間像の高い分解能の測定ができるよ
うになり、しかも試料に電流による損傷を与えずに低電
力で観測できる利点も有し、さらに大気中でも動作し、
種々の材料に対して用いることができるため広範囲な応
用が期待されている。On the other hand, recently, a scanning tunneling microscope (hereinafter abbreviated as STM) that can directly observe the electronic structure of surface atoms of conductors has been developed [G, B1nn1g etal, Phys, Re
v, Lett, 49.57 (1982)], single crystal,
It is now possible to measure real space images with high resolution regardless of the amorphous material, and it also has the advantage of being able to observe with low power without damaging the sample due to current, and can also operate in the atmosphere.
Since it can be used for various materials, it is expected to have a wide range of applications.
STMは金属の探針(プローブ電極)と導電性物質間に
電圧を加えて1nm程度の距離まで近づけると、トンネ
ル電流が流れることを利用してl、′Xる。この電流は
両者の距離変化に非常に敏感である。トンネル電流を一
定に保つように探針な走査することにより実空間の全電
子雲に関する種々の情報をも読み取ることができる。こ
の際、面内方向の分解能はO,1nm程度である。STM uses the fact that when a voltage is applied between a metal probe (probe electrode) and a conductive substance to bring them close to a distance of about 1 nm, a tunnel current flows. This current is very sensitive to changes in distance between the two. By scanning the probe while keeping the tunnel current constant, it is possible to read various information about the entire electron cloud in real space. At this time, the resolution in the in-plane direction is approximately 0.1 nm.
したがって、STMの原理を応用すれば、十分に原子オ
ーダー(サブ・ナノメートル)での高密度記録再生を行
なうことが可能である。例えば、特開昭61−8053
6号に開示されてl/Xる記録再生装置では、電子ビー
ム等によって媒体表面に吸着した原子粒子を取り除き、
書き込みを行ない、STMによりこのデータを再生して
いる。Therefore, by applying the principle of STM, it is possible to sufficiently perform high-density recording and reproduction on the atomic order (sub-nanometer). For example, JP-A-61-8053
In the recording/reproducing device disclosed in No. 6, atomic particles adsorbed on the surface of the medium are removed by an electron beam or the like.
Writing is performed and this data is reproduced by STM.
記録層として電圧電流のスイッチング特性に対してメモ
リ効果を持つ材料、例えばπ電子系有機化合物やカルコ
ゲン化合物類の薄膜層を用いて、記録・再生をSTMで
行なう方法が提案されてシAる[特開昭63−161’
552号公報、特開昭63−161553号公報]。A method has been proposed in which STM recording and reproducing is performed using a thin film layer of a material that has a memory effect on voltage and current switching characteristics, such as a π-electron organic compound or a chalcogen compound, as the recording layer. JP-A-63-161'
No. 552, JP-A-63-161553].
号公報法心こよれば、記録のビットサイズを10nmと
ずれLf、1012b i t/ cm2もの大容量記
録再生が可能である。According to the publication No. Hoshin, it is possible to record and reproduce a large capacity with a recording bit size of 10 nm Lf, 1012 bits/cm2.
[発明が解決しようとする課題]
第7図にS’TMを応用した情報処理装置の構成例を示
す。以下図面に従って説明する。[Problems to be Solved by the Invention] FIG. 7 shows a configuration example of an information processing device to which S'TM is applied. This will be explained below according to the drawings.
101は基板、102は金属の電極層、103は記録層
である。201はXYステージ、202はプローブ電極
、203はプローブ電極の支持体、2C)4はプローブ
電極をZ方向に駆動するZ軸すニアアクチュエータ、2
05,206はXYステージをそれぞれX、Y方向に駆
動するリニアアクチュエータ、207はパルス電圧回路
である。101 is a substrate, 102 is a metal electrode layer, and 103 is a recording layer. 201 is an XY stage, 202 is a probe electrode, 203 is a support for the probe electrode, 2C) 4 is a Z-axis near actuator that drives the probe electrode in the Z direction, 2
05 and 206 are linear actuators that drive the XY stage in the X and Y directions, respectively, and 207 is a pulse voltage circuit.
301はプローブ電極202から記録層103を介して
電極層102へ流れるトンネル電流を検出する増幅器で
ある。302はトンネル電流の変化をプローブ電極20
2と記録層103の間隙距離に比例する値に変換するた
めの対数圧縮器、303は記録層103の表面凹凸成分
を抽出するための低域通過フィルタである。304は基
準電圧VIIEFと低域通過フィルタ303の出力との
誤差を検出する誤差増幅器、305はZ軸すニアアクチ
ュエータ204を駆動するドライバーである。306は
XYステージ201の位置制御を行う駆動回路である6
307はデータ成分を分離する高域通過フィルタである
。301 is an amplifier that detects a tunnel current flowing from the probe electrode 202 to the electrode layer 102 via the recording layer 103. 302 is a probe electrode 20 that detects changes in tunnel current.
2 and a logarithmic compressor for converting into a value proportional to the gap distance between the recording layer 103, and 303 a low-pass filter for extracting the surface unevenness component of the recording layer 103. 304 is an error amplifier that detects an error between the reference voltage VIIEF and the output of the low-pass filter 303; 305 is a driver that drives the Z-axis near actuator 204; 306 is a drive circuit that controls the position of the XY stage 201 6
307 is a high-pass filter that separates data components.
第8図に従来例の記録媒体の断面とプローブ電極202
の先端を示す。FIG. 8 shows a cross section of a conventional recording medium and a probe electrode 202.
Shows the tip of.
401は記録層103に記録されたデータビット、40
2は基板101上に電極層102を形成したときにでき
た結晶粒である。この結晶粒402の大きさは電極層1
02の製法として通常の真空蒸着法、スパッタ法等を用
いると30〜50nm程度である。401 is a data bit recorded in the recording layer 103, 40
2 are crystal grains formed when the electrode layer 102 was formed on the substrate 101. The size of the crystal grains 402 is the same as that of the electrode layer 1.
When a normal vacuum evaporation method, sputtering method, etc. is used as a manufacturing method for 02, the thickness is about 30 to 50 nm.
プローブ電極202と記録層103との間隙は第7図に
示された回路構成により一定に保つことができる。すな
わちプローブ電極202と記録層103の間に流れるト
ンネル電流を検出し対数圧縮器302、低域通過フィル
タ303を介した後、この値を基準電圧と比較し、この
比較値が零に近付(ようにプローブ電極202を支持す
る2軸リニアアクチユエータ204を制御することによ
り、プローブ電極202と記録層103の間隙を一定に
することができる。The gap between the probe electrode 202 and the recording layer 103 can be kept constant by the circuit configuration shown in FIG. That is, the tunnel current flowing between the probe electrode 202 and the recording layer 103 is detected, and after passing through the logarithmic compressor 302 and the low-pass filter 303, this value is compared with a reference voltage, and when this comparison value approaches zero ( By controlling the biaxial linear actuator 204 that supports the probe electrode 202 in this manner, the gap between the probe electrode 202 and the recording layer 103 can be made constant.
さらに、XYステージ201を駆動することにより記録
媒体の表面をプローブ電極202がなぞり、0点の信号
の高域周波数成分を分離することにより記録層103の
データを検出できる。Further, by driving the XY stage 201, the probe electrode 202 traces the surface of the recording medium, and data on the recording layer 103 can be detected by separating the high frequency component of the signal at the 0 point.
このときの0点の信号の周波数に対する信号強度スペク
トラムを第9図に示す。FIG. 9 shows the signal strength spectrum with respect to the frequency of the signal at the 0 point at this time.
fo以下の周波数成分の信号は基板101の反り、歪等
による媒体の緩やかな起伏によるものである。flを中
心とした信号は記録N103の表面の凹凸によるもので
、主として電極材料形成時に生じる結晶粒402による
ものである。f2は記録データの搬送波成分で、403
はデータ信号帯域である。f3は記録層103の原子、
分子配列から生じる信号成分である。Signals with frequency components below fo are due to gentle undulations of the medium due to warping, distortion, etc. of the substrate 101. The signal centered on fl is due to the unevenness of the surface of the recording N103, and is mainly due to the crystal grains 402 generated during the formation of the electrode material. f2 is the carrier wave component of the recording data, 403
is the data signal band. f3 is an atom of the recording layer 103,
It is a signal component resulting from molecular arrangement.
従来例に示された記録媒体を使用した場合以下のような
問題点があった。When the recording medium shown in the conventional example was used, there were the following problems.
STMの特徴である高分解能を生かし高密度記録を行う
には、データ信号帯域403をflとf3の間に置かな
ければならない。この場合、データ成分を分離するため
遮断周波数fcの高域通過フィルタ307を用いる。し
かしながら、flの信号成分の裾野がデータ信号帯域4
03と重なっている。これはf、の信号成分が電極層1
02の結晶粒402に起因しているためであり、結晶粒
402の30〜50nmに対しデータの記録サイズおよ
びビット間隔が1〜10nmと接近していることによる
。In order to perform high-density recording by taking advantage of the high resolution that is a feature of STM, the data signal band 403 must be placed between fl and f3. In this case, a high-pass filter 307 with a cutoff frequency fc is used to separate the data components. However, the base of the signal component of fl is in the data signal band 4.
It overlaps with 03. This means that the signal component of f is the electrode layer 1
This is due to the crystal grains 402 of No. 02, and the data recording size and bit interval are close to each other, 1 to 10 nm, compared to 30 to 50 nm of the crystal grains 402.
このためデータ再生のS/N比が低下し、読取りデータ
の誤り率を著しく高くしている。As a result, the S/N ratio of data reproduction decreases, and the error rate of read data becomes extremely high.
そこで本発明の目的は、上記課題に鑑みて、高いS/N
比、高速再生を可能とする記録媒体、かかる記録媒体に
用いる電極基板、かかる記録媒体を持ちいた情報処理装
置、情報処理方法を提供することにある。Therefore, in view of the above problems, an object of the present invention is to achieve a high S/N ratio.
The object of the present invention is to provide a recording medium that enables high-speed reproduction, an electrode substrate for use in such a recording medium, an information processing apparatus having such a recording medium, and an information processing method.
また本発明の目的は、十分にS/N比向上向上られるこ
とにより、読取りデータの誤り率を著しく低下させた記
録媒体、かかる記録媒体に用いる電極基板、およびかか
る記録媒体を用いた情報処理装置、情報処理方法を提供
することにある。Another object of the present invention is to provide a recording medium in which the error rate of read data is significantly reduced by sufficiently improving the S/N ratio, an electrode substrate for use in such a recording medium, and an information processing apparatus using such a recording medium. , to provide an information processing method.
[課題を解決するための手段および作用]上記の目的は
、以下の本発明によって達成される。[Means and effects for solving the problems] The above objects are achieved by the present invention as described below.
すなわち本発明は、表面凹凸が1nm以下であり、大き
さが1μm口以上である平滑面を有することを特徴とす
る電極基板であり、
また本発明は、表面凹凸が1nm以下であり、大きさが
1μm口以上である平滑面を有する母材に電極材料を含
む電極層を形成する工程と該電極層を母材から分離する
工程を含むことを特徴とする電極基板の製造方法であり
、
また本発明は、表面凹凸が1nm以下であり、大きさが
1μm口以上である平滑面を有することを特徴とする記
録媒体であり、
また本発明は、表面凹凸が1nm以下であり、大きさが
ILLm口以上である平滑面を有する母材に電極材料を
含む電極層を形成する工程、該電極層を母材から分離す
る工程および該電極層上に記録層を形成する工程を含む
ことを特徴とする記録媒体の製造方法であり、
また本発明は、表面凹凸が1nm以下であり、大きさが
1μm口以上である平滑面を有する記録媒体、該記録媒
体に近接して配置される導電性プローブと記録用パルス
電圧印加回路を備えたことを特徴とする情報処理装置で
あり、
また本発明は、表面凹凸が1nm以下であり、大きさが
1μm口以上である平滑面を有する記録媒体と、該記録
媒体に近接して配置される導電性プローブと記録用パル
ス電圧印加回路および再生用バイアス電圧印加回路を備
えたことを特徴とする情報処理装置であり、
また本発明は、表面凹凸が1nm以下であり、大きさが
1μm口以上である平滑面を有し、情報が記録されてな
る記録媒体、該記録媒体に近接して配置される導電性プ
ローブおよび再生用バイアス電圧印加回路を備えたこと
を特徴とする情報処理装置であり、
また本発明は、電極基板上に記録層を有し、表面凹凸が
1nm以下であり、大きさが1μm口以上である平滑面
を有する記録媒体に導電性プローブを近接させ、電極基
板と導電性プローブの間にパルス電圧を印加して情報の
記録を行うことを特徴とする情報処理方法であり、
また本発明は、電極基板上に記録層を有し、表面凹凸が
1nm以下であり、大きさが1μm口以上である平滑面
を有する記録媒体に導電性プローブを近接させ、電極基
板と導電性プローブの間にパルス電圧を印加して情報の
記録を行い、バイアス電圧を印加することで記録情報の
再生を行うことを特徴とする情報処理方法であり、
また本発明は、電極基板上に記録層を有し、表面凹凸が
1nm以下であり、大きさが1μm口以上である平滑面
を有する記録媒体に導電性プローブを近接させ、電極基
板と導電性プローブの間に第1のパルス電圧を印加して
情報の記録を行い、バイアス電圧を印加することで記録
情報の再生を行い、さらに第2のパルス電圧を印加する
ことで記録情報の消去を行うことを特徴とする情報処理
方法である。That is, the present invention is an electrode substrate characterized by having a smooth surface having surface irregularities of 1 nm or less and a size of 1 μm or more; A method for manufacturing an electrode substrate, comprising the steps of forming an electrode layer containing an electrode material on a base material having a smooth surface with a diameter of 1 μm or more, and separating the electrode layer from the base material, and The present invention is a recording medium characterized by having a smooth surface having surface irregularities of 1 nm or less and a size of 1 μm or more; It is characterized by comprising the steps of forming an electrode layer containing an electrode material on a base material having a smooth surface that is larger than ILLm, separating the electrode layer from the base material, and forming a recording layer on the electrode layer. A method for manufacturing a recording medium, and the present invention also provides a recording medium having a smooth surface with surface irregularities of 1 nm or less and a size of 1 μm or more, and a conductive material disposed close to the recording medium. An information processing device characterized by comprising a probe and a recording pulse voltage application circuit, and the present invention also provides a recording medium having a smooth surface with surface irregularities of 1 nm or less and a size of 1 μm or more. , an information processing device characterized by comprising a conductive probe disposed close to the recording medium, a recording pulse voltage application circuit, and a reproduction bias voltage application circuit; A recording medium having a smooth surface with a diameter of 1 nm or less and a size of 1 μm or more, on which information is recorded, a conductive probe disposed close to the recording medium, and a reproduction bias voltage application circuit. The present invention also provides a recording medium having a recording layer on an electrode substrate, a smooth surface having surface irregularities of 1 nm or less, and a size of 1 μm or more. This is an information processing method characterized by recording information by bringing conductive probes close to each other and applying a pulse voltage between an electrode substrate and the conductive probe. A conductive probe is brought close to a recording medium having a smooth surface with surface irregularities of 1 nm or less and a size of 1 μm or more, and a pulse voltage is applied between the electrode substrate and the conductive probe to read information. An information processing method characterized by performing recording and reproducing recorded information by applying a bias voltage, and the present invention also provides an information processing method that has a recording layer on an electrode substrate, and has a surface unevenness of 1 nm or less. , a conductive probe is brought close to a recording medium having a smooth surface with a diameter of 1 μm or more, a first pulse voltage is applied between the electrode substrate and the conductive probe to record information, and a bias voltage is applied. This information processing method is characterized in that recorded information is reproduced by applying a pulse voltage, and recorded information is erased by further applying a second pulse voltage.
本発明による平滑面を有する記録媒体を提供することに
より、STMの原理を応用した情報処理装置の機能を十
分に生かすことを可能とした。By providing a recording medium having a smooth surface according to the present invention, it has become possible to fully utilize the functions of an information processing device to which the principles of STM are applied.
以下、図面に従って本発明を説明する。The present invention will be explained below with reference to the drawings.
第1図は本発明による記録媒体の断面図を示す。101
は基板、102は平滑面を有する電極層、103は記録
層である。FIG. 1 shows a cross-sectional view of a recording medium according to the invention. 101
102 is a substrate, 102 is an electrode layer having a smooth surface, and 103 is a recording layer.
第3図は本発明にかかわる記録媒体の作成の各工程にお
ける断面図を示したものである。FIG. 3 shows cross-sectional views at each step of producing a recording medium according to the present invention.
第3図(a)に於てまず平滑基板11を用意する。この
平滑基板は表面凹凸が1nm以下の平滑面を、好ましく
は1μmμm上有するものを必要とする。In FIG. 3(a), first, a smooth substrate 11 is prepared. This smooth substrate needs to have a smooth surface with surface irregularities of 1 nm or less, preferably 1 μm or more.
表面凹凸の測定は、微小プローブの先端を試料基板表面
に接近させ、該微小プローブの先端原子と試料基板表面
の原子との間に働く原子間力を計測し試料表面形状を観
察するAFM(Atomic−Force−Micro
scopy)という手法を用いて行うことができる。Surface unevenness is measured using AFM (Atomic), which brings the tip of a microprobe close to the surface of a sample substrate, measures the atomic force acting between the atom at the tip of the microprobe and the atom on the surface of the sample substrate, and observes the shape of the sample surface. -Force-Micro
This can be done using a technique called ``scopy''.
かかるAFMを用いると、試料の導電性、絶縁性を問わ
ず原子オーダーの分解能で試料の表面形状を計測するこ
とができる。本発明者等はAFMを用いて各種材料の表
面を評価したところ、以下の材料が本発明における平滑
基板11として適していることが判明した。When such an AFM is used, the surface shape of a sample can be measured with resolution on the atomic order, regardless of whether the sample is conductive or insulative. The present inventors evaluated the surfaces of various materials using AFM and found that the following materials were suitable as the smooth substrate 11 in the present invention.
■、結晶の劈開面・・結晶の劈開面はきわめて平滑な表
面を容易に得ることができ、結晶材料としてはマイカ、
MgO,Tic、Si、HOPG。■Crystal cleavage plane: The crystal cleavage plane can easily obtain an extremely smooth surface, and mica,
MgO, Tic, Si, HOPG.
等が挙げられる。etc.
■、溶融したガラス表面・・・例えば、フロートガラス
、#7059フュージョン溶融石英5等が挙げられる。(2) Molten glass surface: Examples include float glass, #7059 Fusion fused quartz 5, and the like.
AFMにより上記材料の表面形状を測定したところ、1
0μm口の領域において全て表面凹凸は1nm以下であ
った。特にマイカ襞開面は、劈開時に生じる格子面の段
差も少なく、大面積(kmm)に亘って空間周波数3.
3x l O’ cm−’以下の凹凸が1nm以下であ
り、本発明に用いる平滑基板として好適である。When the surface shape of the above material was measured by AFM, it was found that 1
All surface irregularities were 1 nm or less in the 0 μm opening region. In particular, mica fold-opened surfaces have few steps in the lattice plane that occur during cleavage, and have a spatial frequency of 3.5 mm over a large area (km).
The unevenness of 3x l O'cm-' or less is 1 nm or less, and is suitable as a smooth substrate for use in the present invention.
次に第3図(b)に示すように、電極層102を平滑基
板11上に形成する。本発明に係る電極層102として
は高導電性を有するもので、さらに平滑基板11と密着
性の良くない材料が好ましい。例えばAu、Ag、Pt
、Pdなとの貴金属およびAu−Pd、Pt−Pdなど
の合金、さらにそれらの積層膜が挙げられる。このよう
な材料を用いた電極形成法としても従来公知の薄膜形成
技術で十分である。Next, as shown in FIG. 3(b), an electrode layer 102 is formed on the smooth substrate 11. The electrode layer 102 according to the present invention is preferably made of a material that has high conductivity and does not have good adhesion to the smooth substrate 11. For example, Au, Ag, Pt
, noble metals such as Pd, alloys such as Au-Pd and Pt-Pd, and laminated films thereof. Conventionally known thin film forming techniques are sufficient for forming electrodes using such materials.
次に第3図(C)に示すように、電極層102上に接着
層12を形成する。本発明にかかる接着層12としては
無溶剤型の体積収縮がないものが好ましく、例えばエポ
キシ樹脂系、α−シアノアクリレート系などの絶縁性接
着剤やエボテック銀シリーズなどの導電性接着剤などが
挙げられる。Next, as shown in FIG. 3(C), an adhesive layer 12 is formed on the electrode layer 102. The adhesive layer 12 according to the present invention is preferably a solvent-free adhesive that does not have volumetric shrinkage, and examples include insulating adhesives such as epoxy resin-based and α-cyanoacrylate-based adhesives, and conductive adhesives such as Evotec Silver series. It will be done.
次に第3図(d)に示すように接着層12上に基板10
1をはり付ける。この工程に於て、基板101と電極層
102が直接接合される場合、例えば共晶結合、電鋳な
どの場合は接着層12を省くことができる。本発明に係
る基板101としては接着層12を介する場合は金属、
ガラス、セラミックス、プラスチック材料等いずれの材
料も使用できる。また直接基板101と接合させる場合
は比較的平滑な材料が好ましい。さらに電極層102が
厚い場合は、基板101を省くことも可能である。Next, as shown in FIG. 3(d), the substrate 10 is placed on the adhesive layer 12.
Attach 1. In this step, when the substrate 101 and the electrode layer 102 are directly bonded, for example, by eutectic bonding, electroforming, etc., the adhesive layer 12 can be omitted. When using the adhesive layer 12 as the substrate 101 according to the present invention, metal,
Any material such as glass, ceramics, or plastic material can be used. Further, when directly bonding to the substrate 101, a relatively smooth material is preferable. Further, if the electrode layer 102 is thick, the substrate 101 can be omitted.
次に第3図(e)に示すように、平滑基板11を電極層
102から引き剥すことにより表面凹凸が1nm以下の
平滑面を1μmμm上有する平滑電極基板が形成できる
。Next, as shown in FIG. 3(e), by peeling off the smooth substrate 11 from the electrode layer 102, a smooth electrode substrate having a smooth surface of 1 μm μm with surface irregularities of 1 nm or less can be formed.
次に第3図(f)に示すように平滑電極基板の電極層1
02上に記録層103を形成することにより記録媒体が
得られる。Next, as shown in FIG. 3(f), the electrode layer 1 of the smooth electrode substrate is
A recording medium is obtained by forming a recording layer 103 on 02.
前記記録層103としては、電流−電圧特性においてメ
モリースイッチング現象(電気メモリー効果)を有する
材料、例えば、π電子準位をもつ群と0電子率位のみを
有する群を併有する分子を電極上に積層した有機単分子
膜あるいはその累積膜を用いることが可能となる。電気
メモリー効果は前記の有機単分子膜、その累積膜等の薄
膜を一対の電極間に配置させた状態でそれぞれ異なる2
つ以上の導電率を示す状態(第11図ON状態、OFF
状態)へ遷移させることが可能な閾値を越えた電圧を印
加することにより可逆的に低抵抗状態(ON状態)およ
び高抵抗状態(OFF状態)へ遷移(スイッチング)さ
せることができる。またそれぞれの状態は電圧を印加し
なくとも保持(メモリー)しておくことができる。The recording layer 103 is made of a material having a memory switching phenomenon (electrical memory effect) in current-voltage characteristics, such as molecules having both a group having a π electron level and a group having only a 0 electron level, on an electrode. It becomes possible to use a stacked organic monomolecular film or a cumulative film thereof. The electrical memory effect differs depending on the state in which a thin film such as the organic monomolecular film or its cumulative film is placed between a pair of electrodes.
States exhibiting more than one conductivity (Figure 11: ON state, OFF state)
By applying a voltage exceeding a threshold that can cause a transition to a low resistance state (ON state) and a high resistance state (OFF state), it is possible to reversibly transition (switch) to a low resistance state (ON state) and a high resistance state (OFF state). Further, each state can be maintained (memory) without applying a voltage.
一般に有機材料のほとんどは絶縁性もしくは半絶縁性を
示すことから係る本発明において、適用可能なπ電子準
位を持つ群を有する有機材料は著しく多岐にわたる。本
発明に好適なπ電子系を有する色素の構造として例えば
、フタロシアニン、テトラフェニルポリフィリン等のポ
ルフィリン骨格を有する色素、スクアリリウム基および
クロコニックメチン基を結合鎖として持つアズレン系色
素およびキノリン、ベンゾチアゾール、ベンゾオキサゾ
ール等の2個の含窒素複素環をスクアリリウム基および
クロコニックメチン基により結合したシアニン系類似の
色素、またはシアニン色素、アントラセンおよびピレン
等の縮合多環芳香族、および芳香環および複素環化合物
が重合した鎖状化合物およびジアセチレン基の重合体、
さらにはテトラシアノキノジメタンまたはテトラチアフ
ルバレンの誘導体およびその類縁体およびその電荷移動
錯体、またさらにはフェロセン、トリスビピリジンルテ
ニウム錯体等の金属錯体化合物が挙げられる。Since most organic materials generally exhibit insulating or semi-insulating properties, there is a wide variety of organic materials having a group having a π-electron level that can be applied to the present invention. Structures of dyes having a π-electron system suitable for the present invention include, for example, phthalocyanine, dyes having a porphyrin skeleton such as tetraphenylporphyrin, azulene dyes having squarylium groups and croconic methine groups as bonding chains, quinoline, benzothiazole, Cyanine-based similar dyes, such as benzoxazole, in which two nitrogen-containing heterocycles are bonded by a squarylium group and a croconic methine group, or cyanine dyes, fused polycyclic aromatics such as anthracene and pyrene, and aromatic and heterocyclic compounds. chain compounds and diacetylene group polymers,
Further examples include derivatives of tetracyanoquinodimethane or tetrathiafulvalene, analogs thereof and charge transfer complexes thereof, and metal complex compounds such as ferrocene and trisbipyridine ruthenium complexes.
本発明に好適な高分子材料としては、例えばポリアクリ
ル酸誘導体等の付加重合体、ポリイミド等の縮合重合体
、ナイロン等の開環重合体等の生体高分子が挙げられる
。Examples of polymeric materials suitable for the present invention include biopolymers such as addition polymers such as polyacrylic acid derivatives, condensation polymers such as polyimide, and ring-opening polymers such as nylon.
前記記録層103の形成に関しては、具体的には蒸着法
やクラスターイオンビーム法等の適用も可能であるが、
制御性、容易性そして再現性から公知の従来技術の中で
はLB法が極めて好適である。Regarding the formation of the recording layer 103, specifically, it is possible to apply a vapor deposition method, a cluster ion beam method, etc.
Among the known prior art techniques, the LB method is highly preferred due to its controllability, ease of use, and reproducibility.
このLB法によれば、1分子中に疎水性部位と親水性部
位とを有する有機化合物の単分子膜またはその累積膜を
基板上に容易に形成することができ、分子オーダーの厚
みを有し、かつ大面積にわたって均一、均質な有機超薄
膜を安定に供給することができる。According to this LB method, a monomolecular film of an organic compound having a hydrophobic site and a hydrophilic site in one molecule or a cumulative film thereof can be easily formed on a substrate, and the thickness is on the order of a molecule. , and can stably supply a uniform and homogeneous ultra-thin organic film over a large area.
LB法は分子内に親水性部位と疎水性部位とを有する構
造の分子において、両者のバランス(両親媒性のバラン
ス)が適度に保たれているとき、分子は水面上で親水性
基を下に向けて単分子の層になることを利用して単分子
膜またはその累積膜を形成する方法である。The LB method is a molecule with a structure that has a hydrophilic site and a hydrophobic site, and when the balance between the two (amphiphilic balance) is maintained appropriately, the molecule lowers the hydrophilic group on the water surface. This is a method of forming a monomolecular film or a cumulative film thereof by utilizing the fact that the monomolecular layer becomes a monomolecular layer.
疎水性部位を構成する基としては、一般に広く知られて
いる飽和および不飽和炭化水素基や縮合多環芳香族基お
よび鎖状多環フェニル基等の各種疎水基が挙げられる。Examples of the group constituting the hydrophobic moiety include various hydrophobic groups such as generally widely known saturated and unsaturated hydrocarbon groups, fused polycyclic aromatic groups, and chain polycyclic phenyl groups.
これらは各々単独またはその複数が組み合わされて疎水
性部位を構成する。These each constitute a hydrophobic site singly or in combination.
一方、親水性部位の構成要素として最も代表的なものは
、例えばカルボキシル基、エステル基、酸アミド基、イ
ミド基、ヒドロキシル基、さらにはアミノ基(1,2,
3級及び4級)等の親水性基等が挙げられる。On the other hand, the most typical constituent elements of the hydrophilic site are, for example, carboxyl groups, ester groups, acid amide groups, imide groups, hydroxyl groups, and even amino groups (1, 2,
Examples include hydrophilic groups such as tertiary and quaternary).
これらの疎水性基と親水性基をバランス良く併有した有
機分子であれば、水面上で単分子膜を形成することが可
能であり、本発明に対して極めて好適な材料となる。Organic molecules containing these hydrophobic groups and hydrophilic groups in a well-balanced manner are capable of forming a monomolecular film on the water surface, and are extremely suitable materials for the present invention.
これらのπ電子準位を有する化合物の電気メモリー効果
は数+nm以下の膜厚のもので観測されているが、成膜
性、均一性の観点から5〜300人の厚さとすることが
好ましい。Although the electric memory effect of these compounds having the π electron level has been observed with a film thickness of several nanometers or less, it is preferable to have a thickness of 5 to 300 nanometers from the viewpoint of film formability and uniformity.
本発明による記録媒体を第7図の情報処理装置に用いた
場合の、0点の信号の周波数スペクトラムを第2図に示
す。FIG. 2 shows the frequency spectrum of the zero point signal when the recording medium according to the present invention is used in the information processing apparatus shown in FIG. 7.
f、以下の周波数成分の信号は基板101の反り、歪等
による媒体の緩やかな起伏によるものである。f2は記
録データの搬送波成分で、403はデータ信号帯域を示
す。f3は記録層103の原子、分子配列から生じる信
号成分である。The signals with frequency components below f are due to gentle undulations of the medium due to warping, distortion, etc. of the substrate 101. f2 is a carrier wave component of recording data, and 403 indicates a data signal band. f3 is a signal component generated from the arrangement of atoms and molecules in the recording layer 103.
flを中心とした信号は母材の表面の僅かな凹凸が電極
層102の表面に転写されたもので、この凹凸はデータ
の記録信号と同等もしくは記録信号より小さく作成され
る。この凹凸の変化はSTMを応用した記録再生では1
nm以下である。また本発明による記録媒体では、記録
層103表面の平滑面の大きさが1μm口以上になる。The signal centered on fl is a result of slight irregularities on the surface of the base material being transferred to the surface of the electrode layer 102, and these irregularities are created to be equal to or smaller than the data recording signal. This change in unevenness is 1 in recording and reproducing using STM.
nm or less. Further, in the recording medium according to the present invention, the size of the smooth surface of the recording layer 103 is 1 μm or more.
このことにより、以下のような作用効果が得られる。This provides the following effects.
(1)記録層103表面の凹凸による信号成分子1とデ
ータ信号帯域403は重なりあうことはなく、flのス
ペクトラムの拡がりによるS/Nの低下はない。すなわ
ち、データ誤り率を小さくすることができる。(1) The signal component element 1 and the data signal band 403 do not overlap due to the unevenness of the surface of the recording layer 103, and there is no reduction in S/N due to the spread of the spectrum of fl. That is, the data error rate can be reduced.
(2)記録層103表面の凹凸がないため、記録層10
3の表面とプローブ電極202との間隙を一定にしなか
らXY定走査行う時のプローブ電極202のZ軸の変位
は少ない。このため、極めて高速にXYステージ201
を駆動することができる。(2) Since there is no unevenness on the surface of the recording layer 103, the recording layer 10
The displacement of the probe electrode 202 along the Z axis is small when performing XY constant scanning without keeping the gap between the surface of the probe electrode 202 and the surface of the probe electrode 3 constant. Therefore, the XY stage 201 can be
can be driven.
(3)記録層103表面の凹凸がないことから、プロー
ブ電極202の先端、すなわちトンネル電流が流れる先
端原子の位置が安定して選択される。また凹凸のある記
録層103表面でみられるような、プローブ電極202
の複数の原子と記録層103との間で、トンネル電流が
流れる所謂ゴースト現象がなくなる。(3) Since there is no unevenness on the surface of the recording layer 103, the tip of the probe electrode 202, that is, the position of the tip atom through which the tunneling current flows, can be stably selected. In addition, the probe electrode 202 as seen on the uneven surface of the recording layer 103
The so-called ghost phenomenon in which a tunnel current flows between the plurality of atoms and the recording layer 103 is eliminated.
[実施例]
実施例1
本発明の実施例1を第3図(a)〜(flを参照しつつ
説明する。[Example] Example 1 Example 1 of the present invention will be described with reference to FIGS. 3(a) to (fl).
まず第3図(a)に示すように、大気中でマイカ板を劈
開し平滑基板11とする。続いて第3図(b)に示すよ
うに平滑基板11上に真空蒸着法により金を成膜し電極
層102を形成する。該電極層102は基板温度を室温
に保ち、蒸着速度10人/ s e c、到達圧力2
X 10−’T o r r、膜厚2000人の条件で
行った。続いて第3図(C)に示すように、接着層12
(コニシ製ハイテンプHT−10)を電極層102上に
塗布する。First, as shown in FIG. 3(a), a mica plate is cleaved in the atmosphere to form a smooth substrate 11. Subsequently, as shown in FIG. 3(b), a gold film is formed on the smooth substrate 11 by vacuum evaporation to form an electrode layer 102. The electrode layer 102 maintains the substrate temperature at room temperature, the deposition rate is 10 persons/sec, and the ultimate pressure is 2.
The test was carried out under the conditions of X 10-' Torr and film thickness of 2,000 people. Subsequently, as shown in FIG. 3(C), the adhesive layer 12
(High Temp HT-10 manufactured by Konishi) is applied onto the electrode layer 102.
続いて第3図(d)に示すように、基板101を接着層
12上に貼り付ける。該基板101の接着は加圧力5k
g/cm2、温度200℃、硬化時間1時間の条件で行
った。続いて第3図(e)に示すように、平滑基板11
を電極層102から引き剥し、基板101、接着層12
、電極層102からなる平滑電極基板を得た。このよう
にして得られた平滑電極基板の表面をSTMで観察した
ところ、10ILm口において表面凹凸は1nm以下で
あった。Subsequently, as shown in FIG. 3(d), the substrate 101 is attached onto the adhesive layer 12. The substrate 101 is bonded with a pressure of 5k.
g/cm2, temperature of 200°C, and curing time of 1 hour. Subsequently, as shown in FIG. 3(e), the smooth substrate 11
is peeled off from the electrode layer 102, and the substrate 101 and adhesive layer 12 are separated.
A smooth electrode substrate consisting of the electrode layer 102 was obtained. When the surface of the thus obtained smooth electrode substrate was observed by STM, the surface unevenness was 1 nm or less at 10 ILm opening.
次に第3図(f)に示すようにこの平滑電極基板上に4
層のポリイミドLB膜を形成し記録層103とした。以
下、ポリイミドLB膜を用いた記録層103形成方法に
ついて述べる。Next, as shown in FIG. 3(f), four electrodes are placed on this smooth electrode substrate.
A polyimide LB film was formed as a recording layer 103. A method for forming the recording layer 103 using a polyimide LB film will be described below.
(1)式に示すポリアミド酸をN、N” −ジメチルア
セトアミド−ベンゼン混合溶媒(1:IV/V)に溶解
させた(単量体換算濃度1×10−”M)後、別途調整
したN、N−ジメチルオクタデシルアミンの同溶媒によ
るlXl0−”M溶液とを1 : 2 (V/V)に混
合して(2)式に示すポリアミド酸オクタデシルアミン
塩溶液を調製した。After dissolving the polyamic acid shown in formula (1) in a mixed solvent of N,N''-dimethylacetamide-benzene (1:IV/V) (monomer equivalent concentration 1 x 10-''M), separately prepared N , and a 1X10-''M solution of N-dimethyloctadecylamine in the same solvent were mixed at a ratio of 1:2 (V/V) to prepare a polyamic acid octadecylamine salt solution shown in formula (2).
かかる溶液を水温20℃の純水から成る水相上に展開し
、水面上に単分子膜を形成した。溶媒蒸発除去後、表面
圧を25mN/mに迄高めた。表面圧を一定に保ちなが
ら上述平滑電極基板を水面を横切る方向に速度5mm/
minで静かに浸漬した後、続いて5mm/minで静
かに引き上げて2層のY型単分子累積膜を作製した。か
かる操作を繰り返して4層のポリアミド酸オクタデシル
アミン塩の単分子累積膜を形成した。次に、この基板を
減圧(〜1mmHg)下、300℃で10分間加熱焼成
してポリアミド酸オクタデシルアミン塩をイミド化しく
式3)、
4層のポリイミド単分子累積膜を得た。This solution was spread on an aqueous phase consisting of pure water at a water temperature of 20°C to form a monomolecular film on the water surface. After evaporating the solvent, the surface pressure was increased to 25 mN/m. While keeping the surface pressure constant, move the above-mentioned smooth electrode substrate across the water surface at a speed of 5 mm/
After gently dipping at a speed of 5 mm/min, the film was gently pulled up at a rate of 5 mm/min to produce a two-layer Y-type monomolecular cumulative film. These operations were repeated to form a four-layer monomolecular cumulative film of polyamic acid octadecylamine salt. Next, this substrate was baked under reduced pressure (~1 mmHg) at 300° C. for 10 minutes to imidize the polyamic acid octadecylamine salt (Formula 3) to obtain a four-layer polyimide monomolecular cumulative film.
次に上述した方法により作製した記録媒体を用いて、第
7図に示す情報処理装置により表面形状を調べたところ
、記録媒体表面が電極の平滑面を反映しており、10u
m口に於いて表面凹凸は1層m以下であった。次に記録
・再生の実験を行った。Next, using the recording medium produced by the method described above, the surface shape was examined using the information processing apparatus shown in FIG. 7, and it was found that the surface of the recording medium reflected the smooth surface of the electrode.
The surface unevenness at the opening was 1 layer m or less. Next, we conducted recording/playback experiments.
プローブ電極202として白金/ロジウム製のプローブ
電極202を用いた。このプローブ電極202は記録層
103の表面との距離(Z)を制御するものによって電
流を一定に保つように、圧電素子により、その距離(Z
)が微動制御されている。さらにリニアアクチュエータ
204゜205.206は距離2を一定に保ったまま、
面内(X、Y)方向にも微動制御できるように設計され
ている。A platinum/rhodium probe electrode 202 was used as the probe electrode 202. This probe electrode 202 uses a piezoelectric element to control the distance (Z) from the surface of the recording layer 103 so that the current is kept constant.
) is controlled by fine movements. Furthermore, the linear actuators 204, 205, and 206 keep the distance 2 constant,
It is designed to allow fine movement control in the in-plane (X, Y) directions as well.
また、プローブ電極202は直接記録・再生・消去を行
うことができる。また、記録媒体は高精度のXYステー
ジ201の上に置かれ、任意の位置に移動させることが
できる。Further, the probe electrode 202 can directly perform recording, reproduction, and erasing. Further, the recording medium is placed on a high-precision XY stage 201 and can be moved to any position.
前述したポリイミド4層を累積した記録層103を有す
る記録媒体を、XYステージ201上に置いた。次にプ
ローブ電極202と記録媒体の電極層102との間に+
1.5■の電圧を印加し、電流をモニターしながらプロ
ーブ電極202と記録層103表面との距離(Z)を調
整した。A recording medium having a recording layer 103 in which the four polyimide layers described above were accumulated was placed on an XY stage 201. Next, between the probe electrode 202 and the electrode layer 102 of the recording medium, +
A voltage of 1.5 cm was applied, and the distance (Z) between the probe electrode 202 and the surface of the recording layer 103 was adjusted while monitoring the current.
この時、プローブ電極202と記録層103表面との距
離Zを制御するためのプローブ電流Ipを10−”A≧
Ip≧10−”Aになるように設定した。At this time, the probe current Ip for controlling the distance Z between the probe electrode 202 and the surface of the recording layer 103 is set to 10-"A≧
It was set so that Ip≧10−”A.
次に、プローブ電極202を記録層103上で走査させ
ながら、100人ピッチで情報の記録を行った。かかる
情報の記録は、プローブ電極202を+側、電極層10
2を一側にして、電気メモリー材料(ポリイミドLB膜
4層)が低抵抗状態(ON状態)に変化する第10図に
示す閾値電圧■thONを越えた矩形パルス電圧(第1
のパルス電圧)を加えた。その後、プローブ電極202
を記録開始点に戻し、再び記録層103上を走査させた
。この時、記録の読み出し時に於いてはZ=一定になる
ように調整したdその結果、データビット401に於い
ては10nA程度のプローブ電流が流れ、ON状態とな
っていることが示された。Next, while scanning the probe electrode 202 over the recording layer 103, information was recorded at a pitch of 100 people. Recording of such information is performed with the probe electrode 202 on the + side and the electrode layer 10
With 2 on one side, the electric memory material (polyimide LB film 4 layers) changes to a low resistance state (ON state).
pulse voltage) was applied. After that, the probe electrode 202
was returned to the recording start point, and the recording layer 103 was scanned again. At this time, when reading the record, adjustment was made so that Z=constant. As a result, a probe current of about 10 nA flowed in the data bit 401, indicating that it was in the ON state.
なお、プローブ電圧を電気メモリー材料がON状態から
OFF状態に変化する閾値電圧V thOF Fを越え
た10■(第2のパルス電圧)に設定し、再び記録位置
をトレースした結果、全ての記録状態が消去されOFF
状態に遷移したことも確認した。さらに読取りデータの
誤り率を読取り速度を一定にして調べたところ、従来例
では1o−4であったのが、本実施例では10−7と著
しく小さくすることが可能となった。In addition, as a result of setting the probe voltage to 10 mm (second pulse voltage) exceeding the threshold voltage V thOF at which the electric memory material changes from the ON state to the OFF state and tracing the recording position again, all recording states were is erased and turned OFF.
It was also confirmed that the state had changed. Furthermore, when the error rate of the read data was examined while keeping the reading speed constant, it was found that while it was 10-4 in the conventional example, it was possible to significantly reduce it to 10-7 in this embodiment.
実施例2
本発明の実施例2を第4図(a)〜(e)を参照しつつ
説明する。まず第4図(a)に示すように、大気中でマ
イカ板を劈開し平滑基板21とする。続いて第4図(b
)に示すように平滑基板21上に真空蒸着法により金を
成膜し電極層102を形成する。該電極層102は基板
温度を室温に保ち、蒸着速度10人/ s e c、到
達圧力2X10−’Torr、膜厚5000人の条件で
行った。続いて第4図(c)に示すように、Siウェハ
ーを基板101としてヒーターにより加熱し一定の温度
に保ち、続いて平滑基板21に形成された電極層102
の表面を基板101に軽(こすり付けることにより、電
極層102と基板101を共晶接合させる。該接合は基
板温度を400’Cに保ち、加圧力2kg/cm2、保
持時間1分の条件で行った。続いて第4図(d)に示す
ように平滑基板21を電極層102から引き剥し、基板
101、電極層102からなる平滑電極基板を得た。Example 2 Example 2 of the present invention will be described with reference to FIGS. 4(a) to (e). First, as shown in FIG. 4(a), a mica plate is cleaved in the atmosphere to form a smooth substrate 21. Next, Figure 4 (b
), a gold film is formed on a smooth substrate 21 by vacuum evaporation to form an electrode layer 102. The electrode layer 102 was formed under the following conditions: the substrate temperature was kept at room temperature, the deposition rate was 10 people/sec, the ultimate pressure was 2×10-'Torr, and the film thickness was 5000 people. Next, as shown in FIG. 4(c), a Si wafer is heated as a substrate 101 using a heater and kept at a constant temperature, and then an electrode layer 102 formed on the smooth substrate 21 is heated.
The electrode layer 102 and the substrate 101 are eutectically bonded by rubbing the surface of the substrate 101 against the substrate 101.The bonding is performed under the conditions that the substrate temperature is kept at 400'C, the pressure is 2 kg/cm2, and the holding time is 1 minute. Subsequently, as shown in FIG. 4(d), the smooth substrate 21 was peeled off from the electrode layer 102 to obtain a smooth electrode substrate consisting of the substrate 101 and the electrode layer 102.
このようにして得られた平滑電極基板の表面をSTMで
観察したところ、10μm口において表面凹凸は1nm
以下であった。When the surface of the thus obtained smooth electrode substrate was observed by STM, the surface unevenness was 1 nm at a 10 μm opening.
It was below.
次に、第4図(e)に示すように、この平滑電極基板上
に4層のポリイミドLB膜を形成し記録層103とした
。Next, as shown in FIG. 4(e), a four-layer polyimide LB film was formed on this smooth electrode substrate to form a recording layer 103.
次に上述した方法により作製した記録媒体を用いて、第
7図に示す情報処理装置により表面形状を調べたところ
、言a録媒体表面が電極の平滑面を反映しており、10
μm口に於いて表面凹凸は1nm以下であった。次に記
録・再生・消去の実験を行ったところ、実施例1と同様
に記録・再生・消去が行えることを確認した。Next, using the recording medium produced by the method described above, the surface shape was examined using the information processing apparatus shown in FIG. 7, and the surface shape of the recording medium reflected the smooth surface of the electrode.
The surface unevenness at the μm opening was 1 nm or less. Next, an experiment of recording, reproducing, and erasing was conducted, and it was confirmed that recording, reproducing, and erasing could be performed in the same manner as in Example 1.
実施例3
本発明の実施例3を第5図(a)〜(e)を参照しつつ
説明する。まず第5図(a)に示すように、大気中でマ
イカ板を劈開し平滑基板31とする。続いて第5図(b
)に示すように、平滑基板31上に真空蒸着法によりA
u−F’dを成膜し電極層102を形成する。該電極層
102は基板温度を室温に保ち、蒸着速度10人/ s
e c、到達圧力2 X 10−’T o r r、
膜厚1000人の条件で行った。続いて第5図(c)に
示すように、電極層102上にニッケルを電鋳により形
成し基板101とする。該電鋳はワット浴を用いて温度
を50℃に保ち、電流密度0.06A/cm” 、電鋳
時間2時間の条件で行い、厚さ1100tLを得た。続
いて第5図(d)に示すように、平滑基板31を電極層
102から引き剥し、基板101、電極102からなる
平滑電極基板を得た。Example 3 Example 3 of the present invention will be described with reference to FIGS. 5(a) to (e). First, as shown in FIG. 5(a), a mica plate is cleaved in the atmosphere to form a smooth substrate 31. Next, Figure 5 (b
), A is deposited on the smooth substrate 31 by vacuum evaporation.
The electrode layer 102 is formed by depositing u-F'd. The electrode layer 102 maintains the substrate temperature at room temperature, and the deposition rate is 10 people/s.
e c, ultimate pressure 2 x 10-'T o r r,
The test was conducted under the condition that the film thickness was 1000. Subsequently, as shown in FIG. 5(c), nickel is formed on the electrode layer 102 by electroforming to form the substrate 101. The electroforming was carried out using a Watt bath at a temperature of 50°C, a current density of 0.06 A/cm", and an electroforming time of 2 hours to obtain a thickness of 1100 tL. Subsequently, as shown in Fig. 5(d). As shown in FIG. 2, the smooth substrate 31 was peeled off from the electrode layer 102 to obtain a smooth electrode substrate consisting of the substrate 101 and the electrode 102.
このようにして得られた平滑電極基板の表面をSTMで
観察した結果、10μm口において表面凹凸が1nm以
下であった。As a result of observing the surface of the thus obtained smooth electrode substrate by STM, the surface unevenness was 1 nm or less at a 10 μm opening.
次に、第5図(e)に示すように、平滑電極基板上に4
層のポリイミドLB膜を形成し記録層103とした。Next, as shown in FIG. 5(e), four electrodes were placed on the smooth electrode substrate.
A polyimide LB film was formed as a recording layer 103.
次に上述した方法により作製した記録媒体を用いて、第
7図に示す情報処理装置により表面形状を調べたところ
、記録媒体表面が電極の平滑面を反映しており、10μ
m口に於いて表面凹凸は1nm以下であった。次に、記
録・再生・消去の実験を行ったところ、実施例1と同様
に記録・再生・消去が行えることを確認した。Next, using the recording medium produced by the method described above, the surface shape was examined using the information processing apparatus shown in FIG. 7, and it was found that the surface of the recording medium reflected the smooth surface of the electrode,
The surface unevenness at the m-port was 1 nm or less. Next, an experiment of recording, reproducing, and erasing was conducted, and it was confirmed that recording, reproducing, and erasing could be performed in the same manner as in Example 1.
実施例4
本発明の実施例4を第6図(a)〜(e)を参照しつつ
説明する。まず第6図(a)に示すように、洗浄した溶
融石英を基板101とする。続いて第6図(b)に示す
ように、金を真空蒸着法により、基板101上に成膜し
電極層102を形成する。該電極層102は基板電極を
室温に保ち、蒸着速度10人/ s e c、到達圧力
2 X I O−’T o r r、膜厚5000人、
下引き層Cr50人の条件で行った。続いて第6図(c
)に示すように、大気中で劈開したマイカ板を平滑基板
41とし、電極層102上にのせ、プレスを行う。該プ
レスは窒素雰囲気中、加圧力10kg/cm”、温度5
00℃1時間の条件で行った。続いて第6図(d)に示
すように、平滑基板41を電極層102から引き剥すこ
とにより、電極層102及び基板101からなる平滑電
極基板を得た。Example 4 Example 4 of the present invention will be described with reference to FIGS. 6(a) to (e). First, as shown in FIG. 6(a), a substrate 101 is made of cleaned fused silica. Subsequently, as shown in FIG. 6(b), a gold film is deposited on the substrate 101 by vacuum evaporation to form an electrode layer 102. The electrode layer 102 was formed by keeping the substrate electrode at room temperature, at a deposition rate of 10 persons/sec, at an ultimate pressure of 2 X I O-'T or r, and at a film thickness of 5000 persons.
The test was carried out under the conditions of 50 Cr sublayers. Next, Figure 6 (c
), a mica plate cleaved in the atmosphere is used as a smooth substrate 41, placed on the electrode layer 102, and pressed. The press was operated in a nitrogen atmosphere with a pressure of 10 kg/cm" and a temperature of 5.
The test was carried out at 00°C for 1 hour. Subsequently, as shown in FIG. 6(d), the smooth substrate 41 was peeled off from the electrode layer 102, thereby obtaining a smooth electrode substrate consisting of the electrode layer 102 and the substrate 101.
このようにして得られた平滑電極の表面をSTMで観察
したところ、10μm口において表面凹凸が1nm以下
であった。When the surface of the thus obtained smooth electrode was observed by STM, the surface unevenness was 1 nm or less at a 10 μm opening.
次に第6図(e)に示すように、この平滑電極基板上に
4層のポリイミドLB膜を形成し配録層103とした。Next, as shown in FIG. 6(e), a four-layer polyimide LB film was formed on this smooth electrode substrate to form a recording layer 103.
次に上述した方法により作製した記録媒体を用いて、第
7図に示す情報処理装置により表面形状を調べたところ
、記録媒体表面が電極の平滑面を反映しており、10μ
m口に於いて表面凹凸は1層m以下であった。次に、記
録・再生・消去の実験を行ったところ、実施例1と同様
に記録・再生・消去が行えることを確認した。Next, using the recording medium produced by the method described above, the surface shape was examined using the information processing apparatus shown in FIG. 7, and it was found that the surface of the recording medium reflected the smooth surface of the electrode,
The surface unevenness at the opening was 1 layer m or less. Next, an experiment of recording, reproducing, and erasing was conducted, and it was confirmed that recording, reproducing, and erasing could be performed in the same manner as in Example 1.
実施例5
実施例1に於いて、金の蒸着をP ctに変え、記録層
103をポリイミドからスクアリリウムービスー6−オ
クチルアズレン(以下5OAZと略す)の4層LB膜に
変えた他は実施例1と全く同様にして、記録媒体を形成
した。以下5OAZを用いた記録層103形成方法につ
いて述べる。Example 5 The same as Example 1 except that the gold vapor deposition was changed to Pct and the recording layer 103 was changed from polyimide to a four-layer LB film of squarylium-bis-6-octyl azulene (hereinafter abbreviated as 5OAZ). A recording medium was formed in exactly the same manner as in Example 1. A method for forming the recording layer 103 using 5OAZ will be described below.
先ず、5OAZを濃度0.2mg/mffで溶かしたベ
ンゼン溶液を20℃の水相上に展開し、水面上に単分子
膜を形成した。溶媒の蒸発を待ち、かかる単分子膜の表
面圧を20 m N / mまで高め、さらにこれを一
定に保ちながら、前記平滑電極基板を水面を横切る方向
に速度3 m m /分で静かに浸漬・引き上げをし、
5OAZ単分子膜の2層累積膜を平滑電極基板上に形成
させた。First, a benzene solution in which 5OAZ was dissolved at a concentration of 0.2 mg/mff was spread on an aqueous phase at 20° C. to form a monomolecular film on the water surface. After waiting for the solvent to evaporate, the surface pressure of the monomolecular film was increased to 20 mN/m, and while this was kept constant, the smooth electrode substrate was gently immersed at a speed of 3 mm/min across the water surface.・Pull up,
A two-layer cumulative film of 5OAZ monolayer was formed on a smooth electrode substrate.
次に上述した方法により作製した記録媒体を用いて、第
7図に示す情報処理装置により表面形状を調べたところ
、記録媒体表面が電極の平滑面を反映しており、10μ
m口に於いて表面凹凸は1nm以下であった。次に、記
録・再生・消去の実験を行ったところ、実施例1と同様
に記録・再生・消去が行えることを確認した。Next, using the recording medium produced by the method described above, the surface shape was examined using the information processing apparatus shown in FIG. 7, and it was found that the surface of the recording medium reflected the smooth surface of the electrode,
The surface unevenness at the m-port was 1 nm or less. Next, an experiment of recording, reproducing, and erasing was conducted, and it was confirmed that recording, reproducing, and erasing could be performed in the same manner as in Example 1.
[発明の効果]
以上説明したように本発明の記録媒体によれば、平滑基
板の有する表面形状を転写させることにより、表面凹凸
が1nm未満の表面を有する記録媒体の形成が可能とな
った。[Effects of the Invention] As explained above, according to the recording medium of the present invention, by transferring the surface shape of a smooth substrate, it is possible to form a recording medium having a surface with surface irregularities of less than 1 nm.
さらに本発明による記録媒体は、
(1)母材の表面形状を転写できるので、基板上の任意
の場所に平滑面を形成することが可能となり、基準マー
カ等の形成も同時に行なうことができる。Furthermore, the recording medium according to the present invention has the following features: (1) Since the surface shape of the base material can be transferred, it is possible to form a smooth surface anywhere on the substrate, and it is also possible to form reference markers and the like at the same time.
(2)電極層は母材上に形成した後、基板に貼りつける
ことができるので、基板はどのような材料、形態のもの
でも用いることができる。たとえばSi chip上
に書込み、読出しの制御回路を組込み、このchipを
基板として本発明の記録媒体を形成する。これにより、
書き込み、読出しの制御回路と記録層が一体に形成され
た記録媒体を提供できる。(2) Since the electrode layer can be formed on the base material and then attached to the substrate, the substrate can be made of any material and in any form. For example, a write and read control circuit is built into a Si chip, and the recording medium of the present invention is formed using this chip as a substrate. This results in
A recording medium in which a write/read control circuit and a recording layer are integrally formed can be provided.
最近のマイクロメカニクス技術を応用し、5ichip
上に駆動アクチュエータを組込み、このアクチュエータ
上に、本発明の電極層を設け、微動機構付の記録媒体と
することもできる。Applying the latest micromechanics technology, 5chip
A recording medium with a fine movement mechanism can also be obtained by incorporating a drive actuator thereon and providing the electrode layer of the present invention on this actuator.
さらにかかる記録媒体を用いれば読取りデータの誤り率
を著しく低下させることができ、高速再生が可能となる
。Furthermore, if such a recording medium is used, the error rate of read data can be significantly reduced, and high-speed reproduction becomes possible.
第1図は本発明に用いられる記録媒体の模式断面図、第
2図は本発明の再生信号の周波数スペクトラムのダイヤ
グラム、第3図〜第6図は各実施例に於ける製造工程図
、第7図はSTMを応用した情報処理装置の構成図、第
8図は従来例の記録媒体の模式断面図、第9図は従来例
の再生信号の周波数スペクトラムのダイヤグラム、第1
0図は本発明の記録媒体に記録を行う際に加えるパルス
電圧の波形図、第11図電流−電圧特性グラフである。
101:基板
102:電極層
103:記録層
11.21,31,41:平滑基板
、第1図
問■−
第4図
第8図
周颯畝□
8寺
間
第10図FIG. 1 is a schematic cross-sectional view of a recording medium used in the present invention, FIG. 2 is a diagram of the frequency spectrum of the reproduced signal of the present invention, and FIGS. 3 to 6 are manufacturing process diagrams for each embodiment. Fig. 7 is a configuration diagram of an information processing device applying STM, Fig. 8 is a schematic cross-sectional view of a conventional recording medium, Fig. 9 is a diagram of the frequency spectrum of a conventional reproduction signal, and Fig. 1
FIG. 0 is a waveform diagram of a pulse voltage applied when recording on the recording medium of the present invention, and FIG. 11 is a current-voltage characteristic graph. 101: Substrate 102: Electrode layer 103: Recording layer 11. 21, 31, 41: Smooth substrate, Figure 1 Question ■ - Figure 4 Figure 8 Zhousao □ 8 Terama Figure 10
Claims (48)
以上である平滑面を有することを特徴とする電極基板。(1) Surface unevenness is 1 nm or less, and the size is 1 μm□
An electrode substrate having a smooth surface as described above.
以上である平滑面を有する母材に電極材料を含む電極層
を形成する工程と該電極層を母材から分離する工程を含
むことを特徴とする電極基板の製造方法。(2) Surface unevenness is 1 nm or less, and the size is 1 μm□
A method for manufacturing an electrode substrate, comprising the steps of forming an electrode layer containing an electrode material on a base material having a smooth surface as described above, and separating the electrode layer from the base material.
いることを特徴とする請求項(2)に記載の電極基板の
製造方法。(3) The method for manufacturing an electrode substrate according to claim (2), characterized in that a crystal substrate whose main surface is cleaved is used as the base material.
ガラスを用いることを特徴とする請求項(2)に記載の
電極基板の製造方法。(4) The method for manufacturing an electrode substrate according to claim (2), characterized in that glass whose main surface is formed by melting is used as the base material.
を特徴とする請求項(2)に記載の電極基板の製造方法
。(5) The method for manufacturing an electrode substrate according to claim (2), wherein the electrode material is a noble metal or an alloy of noble metals.
以上である平滑面を有することを特徴とする記録媒体。(6) Surface unevenness is 1 nm or less, and the size is 1 μm□
A recording medium characterized by having a smooth surface as described above.
求項(6)に記載の記録媒体。(7) The recording medium according to claim (6), further comprising a recording layer on the electrode substrate.
項(6)に記載の記録媒体。(8) The recording medium according to claim (6), which has an electric memory effect.
膜を含むことを特徴とする請求項(7)に記載の記録媒
体。(9) The recording medium according to claim (7), wherein the recording layer includes a monomolecular film or a monomolecular cumulative film of an organic compound.
を特徴とする請求項(7)に記載の記録媒体。(10) The recording medium according to claim (7), wherein the recording layer has a thickness in the range of 5 to 300 Å.
□以上である平滑面を有する母材に電極材料を含む電極
層を形成する工程、該電極層を母材から分離する工程お
よび該電極層上に記録層を形成する工程を含むことを特
徴とする記録媒体の製造方法。(11) Surface irregularities are 1 nm or less and the size is 1 μm
□It is characterized by comprising a step of forming an electrode layer containing an electrode material on a base material having a smooth surface as described above, a step of separating the electrode layer from the base material, and a step of forming a recording layer on the electrode layer. A method for manufacturing a recording medium.
用いることを特徴とする請求項(11)に記載の記録媒
体の製造方法。(12) The method for manufacturing a recording medium according to claim (11), wherein a crystal substrate whose main surface is cleaved is used as the base material.
たガラスを用いることを特徴とする請求項(11)に記
載の記録媒体の製造方法。(13) The method for manufacturing a recording medium according to claim (11), wherein glass whose main surface is formed by melting is used as the base material.
とを特徴とする請求項(11)に記載の記録媒体の製造
方法。(14) The method for manufacturing a recording medium according to claim (11), wherein the electrode material is a noble metal or an alloy of noble metals.
法)により有機化合物から形成されることを特徴とする
請求項(11)に記載の記録媒体の製造方法。(15) The recording layer is formed using the Langmuir-Prodgett method (LB).
12. The method for producing a recording medium according to claim 11, wherein the recording medium is formed from an organic compound by a method (method).
□以上である平滑面を有する記録媒体、該記録媒体に近
接して配置される導電性プローブと記録用パルス電圧印
加回路を備えたことを特徴とする情報処理装置。(16) Surface irregularities are 1 nm or less and the size is 1 μm
□An information processing device comprising a recording medium having a smooth surface as described above, a conductive probe disposed close to the recording medium, and a recording pulse voltage application circuit.
請求項(16)に記載の情報処理装置。(17) The information processing device according to claim (16), further comprising a recording layer on the electrode substrate.
徴とする請求項(16)に記載の情報処理装置。(18) The information processing device according to claim (16), wherein the recording medium has an electric memory effect.
積膜を含むことを特徴とする請求項(17)に記載の情
報処理装置。(19) The information processing device according to claim (17), wherein the recording layer includes a monomolecular film or a monomolecular cumulative film of an organic compound.
を特徴とする請求項(17)に記載の情報処理装置。(20) The information processing device according to claim 17, wherein the recording layer has a thickness in the range of 5 to 300 Å.
□以上である平滑面を有する記録媒体と、該記録媒体に
近接して配置される導電性プローブと記録用パルス電圧
印加回路および再生用バイアス電圧印加回路を備えたこ
とを特徴とする情報処理装置。(21) Surface irregularities are 1 nm or less and the size is 1 μm
□An information processing device comprising a recording medium having a smooth surface as described above, a conductive probe disposed close to the recording medium, a recording pulse voltage application circuit, and a reproduction bias voltage application circuit. .
請求項(21)に記載の情報処理装置。(22) The information processing device according to claim (21), further comprising a recording layer on the electrode substrate.
徴とする請求項(21)に記載の情報処理装置。(23) The information processing device according to claim (21), wherein the recording medium has an electric memory effect.
積膜を含むことを特徴とする請求項(22)に記載の情
報処理装置。(24) The information processing device according to claim (22), wherein the recording layer includes a monomolecular film or a monomolecular cumulative film of an organic compound.
を特徴とする請求項(22)に記載の情報処理装置。(25) The information processing device according to claim 22, wherein the recording layer has a thickness in the range of 5 to 300 Å.
□以上である平滑面を有し、情報が記録されてなる記録
媒体と、該記録媒体に近接して配置される導電性プロー
ブおよび再生用バイアス電圧印加回路を備えたことを特
徴とする情報処理装置。(26) Surface unevenness is 1 nm or less and the size is 1 μm
□ Information processing characterized by comprising a recording medium having a smooth surface as described above and on which information is recorded, a conductive probe disposed close to the recording medium, and a bias voltage application circuit for reproduction. Device.
請求項(26)に記載の情報処理装置。(27) The information processing device according to claim 26, further comprising a recording layer on the electrode substrate.
徴とする請求項(26)に記載の情報処理装置。(28) The information processing device according to claim (26), wherein the recording medium has an electric memory effect.
積膜を含むことを特徴とする請求項(27)に記載の情
報処理装置。(29) The information processing device according to claim (27), wherein the recording layer includes a monomolecular film or a monomolecular cumulative film of an organic compound.
を特徴とする請求項(27)に記載の情報処理装置。(30) The information processing device according to claim (27), wherein the recording layer has a thickness in the range of 5 to 300 Å.
以下であり、大きさが1μm□以上である平滑面を有す
る記録媒体に導電性プローブを近接させ、電極基板と導
電性プローブの間にパルス電圧を印加して情報の記録を
行うことを特徴とする情報処理方法。(31) A recording layer is provided on the electrode substrate, and the surface unevenness is 1 nm.
A conductive probe is brought close to a recording medium having a smooth surface with a size of 1 μm or more, and a pulse voltage is applied between an electrode substrate and a conductive probe to record information. information processing method.
徴とする請求項(31)に記載の情報処理方法。(32) The information processing method according to claim (31), wherein the recording medium has an electric memory effect.
値を越えた電圧であることを特徴とする請求項(31)
に記載の情報処理方法。(33) Claim (31) characterized in that the pulse voltage is a voltage exceeding a threshold value at which the conductivity of the recording medium changes.
The information processing method described in .
積膜を含むことを特徴とする請求項(31)に記載の情
報処理方法。(34) The information processing method according to claim (31), wherein the recording layer includes a monomolecular film or a monomolecular cumulative film of an organic compound.
を特徴とする請求項(31)に記載の情報処理方法。(35) The information processing method according to claim (31), wherein the thickness of the recording layer is in the range of 5 to 300 Å.
以下であり、大きさが1μm□以上である平滑面を有す
る記録媒体に導電性プローブを近接させ、電極基板と導
電性プローブの間にパルス電圧を印加して情報の記録を
行い、バイアス電圧を印加することで記録情報の再生を
行うことを特徴とする情報処理方法。(36) A recording layer is provided on the electrode substrate, and the surface unevenness is 1 nm.
A conductive probe is brought close to a recording medium having a smooth surface with a size of 1 μm or more, and a pulse voltage is applied between the electrode substrate and the conductive probe to record information, and a bias voltage is applied. An information processing method characterized in that recorded information is reproduced by applying a voltage.
徴とする請求項(36)に記載の情報処理方法。(37) The information processing method according to claim (36), wherein the recording medium has an electric memory effect.
値を越えた電圧であることを特徴とする請求項(36)
に記載の情報処理方法。(38) Claim (36) characterized in that the pulse voltage is a voltage exceeding a threshold value at which the conductivity of the recording medium changes.
The information processing method described in .
閾値を越えない電圧であることを特徴とする請求項(3
6)に記載の情報処理方法。(39) Claim (3) characterized in that the bias voltage is a voltage that does not exceed a threshold value at which the conductivity of the recording medium changes.
The information processing method described in 6).
積膜を含むことを特徴とする請求項(36)に記載の情
報処理方法。(40) The information processing method according to claim (36), wherein the recording layer includes a monomolecular film or a monomolecular cumulative film of an organic compound.
を特徴とする請求項(36)に記載の情報処理方法。(41) The information processing method according to claim (36), wherein the recording layer has a thickness in the range of 5 to 300 Å.
以下であり、大きさが1μm□以上である平滑面を有す
る記録媒体に導電性プローブを近接させ、電極基板と導
電性プローブの間に第1のパルス電圧を印加して情報の
記録を行い、バイアス電圧を印加することで記録情報の
再生を行い、さらに第2のパルス電圧を印加することで
記録情報の消去を行うことを特徴とする情報処理方法。(42) A recording layer is provided on the electrode substrate, and the surface unevenness is 1 nm.
A conductive probe is brought close to a recording medium having a smooth surface with a size of 1 μm or more, and a first pulse voltage is applied between the electrode substrate and the conductive probe to record information, An information processing method characterized in that recorded information is reproduced by applying a bias voltage, and recorded information is erased by further applying a second pulse voltage.
徴とする請求項(42)に記載の情報処理方法。(43) The information processing method according to claim (42), wherein the recording medium has an electric memory effect.
する閾値を越えた電圧であることを特徴とする請求項(
42)に記載の情報処理方法。(44) Claim characterized in that the first pulse voltage is a voltage exceeding a threshold value at which the electrical conductivity of the recording medium changes.
42).
閾値を越えない電圧であることを特徴とする請求項(4
2)に記載の情報処理方法。(45) Claim (4) characterized in that the bias voltage is a voltage that does not exceed a threshold value at which the conductivity of the recording medium changes.
The information processing method described in 2).
する閾値を越えた電圧であることを特徴とする請求項(
42)に記載の情報処理方法。(46) Claim characterized in that the second pulse voltage is a voltage exceeding a threshold value at which the electrical conductivity of the recording medium changes.
42).
積膜を含むことを特徴とする請求項(32)に記載の情
報処理方法。(47) The information processing method according to claim (32), wherein the recording layer includes a monomolecular film or a monomolecular cumulative film of an organic compound.
を特徴とする請求項(42)に記載の情報処理方法。(48) The information processing method according to claim (42), wherein the thickness of the recording layer is in the range of 5 to 300 Å.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA002035748A CA2035748C (en) | 1990-02-07 | 1991-02-06 | Medium, process for preparing the same, information processing device, information processing method |
| EP91301000A EP0441626B1 (en) | 1990-02-07 | 1991-02-07 | Medium, process for preparing the same, information processing device, information processing method |
| DE1991630337 DE69130337T2 (en) | 1990-02-07 | 1991-02-07 | Medium, manufacturing method of the same, information processing device and information processing method |
| US08/967,784 US6308405B1 (en) | 1990-02-07 | 1997-11-10 | Process for preparing an electrode substrate |
| US09/920,967 US20020000036A1 (en) | 1990-02-07 | 2001-08-03 | Process for preparing an electrode substrate and process for preparing a recording medium |
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2773890 | 1990-02-07 | ||
| JP7218590 | 1990-03-23 | ||
| JP7345090 | 1990-03-26 | ||
| JP2-73450 | 1990-03-27 | ||
| JP2-27738 | 1990-03-27 | ||
| JP2-72185 | 1990-03-27 | ||
| JP7576390 | 1990-03-27 | ||
| JP2-75763 | 1990-03-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH041950A true JPH041950A (en) | 1992-01-07 |
| JP2866164B2 JP2866164B2 (en) | 1999-03-08 |
Family
ID=27458751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2199251A Expired - Fee Related JP2866164B2 (en) | 1990-02-07 | 1990-07-30 | Recording medium, method of manufacturing the same, information processing method, and information processing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2866164B2 (en) |
-
1990
- 1990-07-30 JP JP2199251A patent/JP2866164B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2866164B2 (en) | 1999-03-08 |
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