JPH04196455A - Tester of lead bend in electronic component - Google Patents

Abstract

PURPOSE:To sense whether lead bend is proper or not by comparing output signals from two beams of light and by testing respective leads for bend one after another. CONSTITUTION:A measuring apparatus 3 comprises a light source 10 such as semiconductor laser which emits two measuring beams of light 8,9 almost in parallel with a component support base 1 and a sensor 11 such as photodetector. The beams of light 8,9 irradiating electronic component leads 13 from the light source 10 are sensed with a slight time difference t in data of position sensing for example with two beams of light in the case of bent leads 14: this allows immediate sensing of lead bend. Thus, abnormality such as bend of leads 14 can be simply sensed without arithmetic operation which causes miscalculation.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for inspecting the shape of a lead of an electronic component such as a puff cage integrated circuit, and particularly relates to an inspection apparatus for inspecting lead bending.

[Prior Art] Conventional electronic component lead bending inspection devices of this type include, for example, a device that photographs and inspects the silhouette of a lead as shown in Japanese Patent Laid-Open No. 1-297541, and a device that inspects the lead by photographing the silhouette of the lead. There is a method of measuring and inspecting leads using light, as disclosed in Publication No. 122557/1982. The former, as shown in Figure 4, detects the lateral silhouette of the lead using the wound imaging section, measures the thickness of the lead component, compares it with a preset thickness, and determines whether it is defective or defective. 1. In the latter case, as shown in Figure 5, the beam light emitted from the light source is transmitted through the lead and scanned, received by the light receiving element, the lead condition and lead pitch are calculated, and the results are used as the standard. The quality of the lead of an electronic component was judged based on whether the lead was located inside the lead or not. A device that detects a silhouette in the direction and determines whether it is good or bad by comparing it with a reference value.
Not only does this make the equipment complex, but it also requires detailed adjustments such as how to apply lighting, adjust focus, and set reference values, and sometimes the inspection itself becomes impossible. In addition, the light beam emitted from the light source is received by the light receiving element and the lead pitch is calculated.

This method is used to judge the quality of the leads of electronic components, and although it is relatively easy to detect missing or bent leads, it can also detect slanted leads (all leads are bent in a negative manner). is almost impossible,
Even with improved equipment that can horizontally slant leads, the measurement reference point is determined for each electronic component inspection before applying a beam of light to the leads, so the inspection results vary widely and are not suitable for practical use. there were.

Accordingly, the present invention makes it possible to detect whether or not the lead of an electronic component is bent or not using a relatively simple device and operation.

[Means for Solving the Problems] In order to solve the above problems, the present invention provides a light beam that intersects the arrangement of the leads of the electronic component to be inspected and is orthogonal to the length direction of the leads. A measurement device that measures the position of a reliable lead using two light beams with axes, and a relative movement between this measurement device and the direction in which the leads of the electronic component are arranged, allows multiple positions of each lead to be measured. This is an electronic component lead bending inspection device that determines lead bending using a calculation processing unit that calculates the distance or inclination between each lead based on data.

[Function] According to the electronic component lead bending inspection device of the present invention, 2
It is possible to compare the output signals of the main beam light and sequentially inspect the bending of each tree F based on the results, and it is also possible to easily detect the slant tree r without setting an external reference. be.

[Example] The present invention will be described in detail below with reference to the drawings. 1 and 2 show an embodiment of an electronic component glue bending inspection device according to the present invention. FIG. 1 is a conceptual diagram showing the entire system, and FIG. 2 is an example of the measuring device. A configuration explanatory diagram showing li! FIG. 3 is a block diagram of the main parts of the measuring device.

In Fig. 1, <1) is the electronic component (12) to be inspected.
(2) is a cylinder groove 2 that moves the component support in the direction of the arrow. (3) is a measuring device placed on the side of the component support. measuring device(
3) Receiving the signal, calculates whether the lead is bent or not, displays the result on the display (5), and sends a complement to the transfer processing mechanism (6) to correct the lead surface. This is an arithmetic processing unit that sends electronic components with bent leads to a processing device (7) for reprocessing.

The measuring device (3) consists of a one-component support stand (as shown in Fig. 2).
For 1), two light beams for measurement are approximately parallel to each other <8
)(9) A light source such as a semiconductor laser (]0)
It is composed of a sensor (11) such as a light receiving element that receives light emitted from the light source and transmitted between the arrays of leads of the electronic component at a position facing the light source (10). The light source 10) has a structure in which a mask with two holes is attached to a single laser light source, and two measurement beams (8) and (9) are emitted from this light source, as shown in Figure 3. , or a structure using two laser light sources is used, such that the light 1. When the lead (13) is normal, the beam light (8)<9) irradiated from the lead (10) to the electronic component lead (13) is blocked as shown in Fig. 4 (a). When there is no lead, it reaches the sensor as shown in (b), but when there is a bent lead (14), 1
For example, as shown in FIG. 4C, there is a slight time difference .DELTA.t between the data of the position detection using the two light beams, and the bending of the lead is immediately detected.

In such a lead bending inspection device for electronic components, electronic components (12) are sequentially measured on a component support stand (-1) by a measuring device (
3), the table (1) is moved according to the amount of movement of the component support table (1).
1) is output to the arithmetic unit (4), while the electronic component glue-F (13) to be measured passes between the light source (10) and the sensor (11), causing the light source (lO
) The two beams of light (8) and (9) transmitted to the sensor are:
Depending on the position and degree of bending of each lead (13), it changes, for example, in the form shown in FIG.
Process 11: In the form shown in Figure 4, information such as normal, bent lead, slanted lead, etc. is displayed externally, and lead bending is transferred to the line for correction processing! Operations such as sending a signal to the structure (6) are performed externally.

In this case, the measuring device (3) and the electronic component (412)
) from the moving mechanism (2) that moves relative to the arithmetic processing unit (4
), and the position data of each lead is sampled at fixed time intervals in synchronization with this movement (see Figure 4 d), the transmission signal and the two signals from the measuring device (3) can be synchronized. By comparison, the bending of the lead (13) can be immediately determined, and the calculation mechanism of the calculation processing section can be simplified.

Figure 2 shows an example in which two such measuring devices are placed side by side so that leads on both sides of an electronic component can be inspected at the same time, but depending on the combination with other devices, only one measuring device can be used. Also, in the above embodiment, the measuring device (
The measurement method according to 3) also uses light! (10)
The explanation has been made using a transmission type structure in which a lead is inserted between the light source (lO) and the sensor (l1), but this relationship applies to a reflection type structure in which the beam light from the light source (lO) is reflected by the lead (13) and detected by the sensor. Measuring devices can also be used to fully implement the present invention.

[Effect] As described above, the electronic component lead bending inspection device according to the present invention applies two beams to the lead arrangement of the electronic component such as a puff cage integrated circuit to be measured.
1, and by detecting the displacement of this light, abnormalities such as bent leads can be easily detected without performing calculations that can cause miscalculations. Yes, all you have to do is feed the electronic components one by one through the inspection equipment.

The inspection can be performed continuously and at high speed.

[Brief explanation of the drawing]

Fig. 1 is an overall conceptual diagram showing an example of a lead bending inspection device for electronic components according to the present invention; Fig. 2 is an explanatory diagram showing an example of a measuring device; Fig. 3 is a diagram showing the main parts of the measuring device; Fourth
The figure is a time chart illustrating examples of measurement and processing results according to the present invention, and FIGS. 5 and 6 are explanatory diagrams illustrating an example of a conventional electronic component lead bending inspection apparatus. 2. ---Moving mechanism 53 ・Measuring device, 4.
Arithmetic device, 8.9 Beam light, 12- Electronic components, 13 Lead.

Claims (1)

[Claims] 1) Positioning of individual leads using two light beams having optical axes that intersect with the array of leads of the electronic component to be inspected and are perpendicular to the length direction of the leads. A measuring device designed to measure An electronic component comprising: a calculation processing unit that calculates the distance or inclination of each lead for each electronic component based on the above, and displays or outputs the calculation result or the result of determining whether the lead is bent or not. lead bending inspection device. 2) The position of each individual lead is measured using two beams whose optical axes intersect with the arrangement of the leads of the electronic component being inspected and are orthogonal to the length direction of the leads. A measuring device, a moving mechanism that moves the measuring device relative to the direction in which the leads of the electronic component are arranged, and a plurality of position data for each lead measured by the measuring device are sampled at regular time intervals and based on this data. 1. A lead for an electronic component, comprising: a calculation processing unit that calculates the distance or inclination of each lead for each electronic component, and displays or outputs the calculation result or the result of determining whether lead bending is good or bad. Bending inspection device.