JPH0419820Y2 - - Google Patents
Info
- Publication number
- JPH0419820Y2 JPH0419820Y2 JP11227684U JP11227684U JPH0419820Y2 JP H0419820 Y2 JPH0419820 Y2 JP H0419820Y2 JP 11227684 U JP11227684 U JP 11227684U JP 11227684 U JP11227684 U JP 11227684U JP H0419820 Y2 JPH0419820 Y2 JP H0419820Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- lead wire
- wire
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
【考案の詳細な説明】
本考案は、フロツピー磁気ヘツドに使用するプ
リント回路基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed circuit board for use in a floppy magnetic head.
従来、この種のプリント回路基板のコイル部の
引き出し線の半田付け箇所は、例えば第１図に示
す如く、金メツキ等のラウンド３のみである。そ
のため、引き出し線の半田付け作業をおこなう
際、引き出し線が強く引張られて半田付けされる
ことにより、断線する虞れがある。尚、２はプリ
ント回路基板を示している。 Conventionally, the lead wires of the coil portion of this type of printed circuit board have only been soldered to round 3, such as gold plating, as shown in FIG. 1, for example. Therefore, when soldering the lead wires, the lead wires are strongly pulled and soldered, and there is a risk of the wires breaking. Note that 2 indicates a printed circuit board.
本考案はこれらの欠点を除去するため、引き出
し線を半田付けするプリント基板の近傍箇所に粘
着部を設け、引き出し線の半田付けの位置決めと
引き出し線のゆるみを与え易くしたことを主たる
目的とする。 In order to eliminate these drawbacks, the main purpose of the present invention is to provide an adhesive part near the printed circuit board to which the lead wire is soldered, making it easier to position the lead wire for soldering and loosen the lead wire. .
以下本考案の一実施例について図面を参照しな
がら詳細に説明する。 An embodiment of the present invention will be described in detail below with reference to the drawings.
第２図は本考案の一例を示す平面図である。４
はプリント回路基板２の半田付け箇所（ラウン
ド）３の近傍に設けられた粘着部を示している。
この粘着部４によつて、第３図に示す如く、例え
ばコイル付き磁気ヘツドの引き出し線の半田付け
作業をする際、フレキシヤー５にＲ／Ｗボビンコ
イル７、ERボビンコイル８を設けた磁気ヘツド
素子６とプリント回路基板２を装着し、Ｒ／Ｗボ
ビンコイル７の引き出し線７a2本、撚線７b1本
及びERボビンコイル８の引き出し線８a2本を指
定された半田付け箇所３にゆるみを与えるように
して回路基板２の粘着部４に一旦粘着し、しかる
後各引き出し線をラウンド３に半田付け作業を行
なうようにすることができる。この場合、第３図
に示す如く、コイル付き磁気ヘツド素子６はプリ
ント回路基板２の上面より上部にあり、各リード
線様引き出し線７ａ，７ｂ，８ａはプリント基板
２より上側から空間を介して粘着部４に一旦粘着
保持されることになるため、その空間内で必要と
するゆるみを与えるようにする。 FIG. 2 is a plan view showing an example of the present invention. 4
indicates an adhesive portion provided near the soldering point (round) 3 of the printed circuit board 2.
With this adhesive part 4, as shown in FIG. 3, when soldering a lead wire of a magnetic head with a coil, for example, a magnetic head element 6 with an R/W bobbin coil 7 and an ER bobbin coil 8 provided on a flexior 5 can be attached. Attach the printed circuit board 2 and connect the two lead wires 7a and one stranded wire 7b of the R/W bobbin coil 7 and the two lead wires 8a of the ER bobbin coil 8 to the designated soldering points 3, leaving them loose on the circuit board. It is possible to temporarily adhere to the adhesive portion 4 of No. 2, and then solder each lead wire to the round No. 3. In this case, as shown in FIG. 3, the coiled magnetic head element 6 is located above the top surface of the printed circuit board 2, and the lead wires 7a, 7b, 8a extend from above the printed circuit board 2 through a space. Since it is once held adhesively by the adhesive part 4, the necessary slack should be given within that space.
以上述べたごとく本考案によれば、プリント基
板上に実装した部品より引き出されたリード線様
引き出し線を半田付けするプリント基板の半田付
け近傍箇所に粘着部を設け、リード線様引き出し
線の半田付けの位置決めと上記部品と粘着部との
間にリード線様引き出し線のゆるみを与えるよう
にしたので、引き出し線のゆるみが容易に得ら
れ、半田付け後の断線防止に極めて有効である。
よつて信頼性の高い磁気ヘツドを提供することが
できる。 As described above, according to the present invention, an adhesive part is provided in the vicinity of the soldering area of the printed circuit board to which the lead wire drawn out from the component mounted on the printed circuit board is soldered. Since the lead wire is loosened between the attachment position and the above-mentioned component and the adhesive part, the lead wire can be easily loosened, which is extremely effective in preventing wire breakage after soldering.
Therefore, a highly reliable magnetic head can be provided.
第１図は従来のフレキシブルの回路基板の例を
示す平面図、第２図は本考案の一例を示す平面
図、第３図はフレキシヤーに磁気ヘツド素子とフ
レキシブル回路基板を装着した本案の一使用態様
図である。
２……フレキシブル回路基板、３……半田付け
箇所（ラウンド）、４……粘着部、７ａ……Ｒ／
Ｗ引き出し線、８ａ，……ER引き出し線。
Fig. 1 is a plan view showing an example of a conventional flexible circuit board, Fig. 2 is a plan view showing an example of the present invention, and Fig. 3 is a use of the present invention in which a magnetic head element and a flexible circuit board are attached to a flexi wire. FIG. 2...Flexible circuit board, 3...Soldering point (round), 4...Adhesive part, 7a...R/
W lead line, 8a,...ER lead line.
Claims (1)
たリード線様引き出し線を半田付けするプリント
基板の半田付け近傍箇所に粘着部を設け、 リード線様引き出し線の半田付けの位置決めと
上記部品と粘着部との間にリード線様引き出し線
のゆるみを与えるようにしたことを特徴とするプ
リント回路基板。[Scope of Claim for Utility Model Registration] An adhesive part is provided near the soldering area of a printed circuit board to which a lead wire-like outgoing wire drawn out from a component mounted on a printed circuit board is soldered, and the soldering of the lead wire-like outgoing wire is provided. A printed circuit board characterized by providing slack in a lead wire-like outgoing wire between the positioning part and the adhesive part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11227684U JPS6127368U (en) | 1984-07-24 | 1984-07-24 | printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11227684U JPS6127368U (en) | 1984-07-24 | 1984-07-24 | printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6127368U JPS6127368U (en) | 1986-02-18 |
| JPH0419820Y2 true JPH0419820Y2 (en) | 1992-05-06 |
Family
ID=30671338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11227684U Granted JPS6127368U (en) | 1984-07-24 | 1984-07-24 | printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6127368U (en) |
-
1984
- 1984-07-24 JP JP11227684U patent/JPS6127368U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6127368U (en) | 1986-02-18 |
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