JPH04199531A - Measuring device for semiconductor - Google Patents

Abstract

PURPOSE:To shorten time needed for inserting or extracting numerous ICs into or from an aging board, by making an IC receiving tray have IC positioning guides, measuring cavities, and cover pressing cavities. CONSTITUTION:An IC 5 to be measured, put on an IC receiving tray 1, is positioned with precision by the action of IC guides 7 on the tray 1, and fitted to an aging board 3 along with the tray 1. At this time, positioning of a socket 2 against the tray 1 is done with precision by socket positioning pins 13 and socket positioning holes 14, and contact pins 6 touch the IC leads 8 through cavities 11 for the contact pins. Next an IC socket cover 4 is fixed by inserting cover holdfasts 10 into cavities 12 for the cover holdfasts, and IC lead pressing protrusions 9 make the contact between the contact pins 6 and IC leads 8 secure. Accordingly, ICs received by the IC receiving tray can be inserted into or extracted from the aging board at one time, and the inserting or extracting time can be shortened.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to high temperature aging testing of semiconductor integrated circuits (hereinafter referred to as ICs).

[Conventional technology]

In recent years, as ICs have become more highly integrated, an increasing number of ICs are being subjected to high-temperature aging tests in order to improve their reliability.

FIG. 2 is a plan view of a conventional aging board, FIG. 3 is a front view of a conventional IC socket, and FIG. 4 is a perspective view of a conventional IC tray.

In the figure, (1) is the IC storage tray, (2) is the ICC
The age knob socket (3) is an aging board, (4) is an IC socket lid, (6) is a contact pin, (7) is an IC guide, and the head is a lid holder.

Next, the operation will be explained. A measurement IC (not shown) is taken out from the IC storage tray (1) and inserted into the IC aging socket (2) along the IC guide (7). Next, close the IC socket lid (4) and secure it with the lid holder (101).

[Problem to be solved by the invention]

Conventional semiconductor measurement equipment was configured as described above, so when aging is performed, an aging substrate is required for each IC, so aging many ICs at high temperatures requires a lot of manpower and time. was there.

The present invention was made to solve the above-mentioned problems, and an object of the present invention is to provide a semiconductor measuring device that eliminates the need to transfer an IC from an IC storage tray to an IC socket.

[Means for Solving the Problems] A semiconductor measuring device according to the present invention is capable of integrating with a socket by providing an IC positioning guide, a measurement cavity, and a lid holding cavity in an IC housing/ray. be.

[Effect]

The semiconductor measuring device according to the present invention can perform high-temperature aging by making the material of the tray heat-resistant.

〔Example〕

Hereinafter, embodiments of the device of the present invention will be described with reference to the drawings.

FIG. 1 is an exploded perspective view of a semiconductor measuring device that is an embodiment of the present invention. In the figure, (1) is an IC storage tray;
2) is the IC aging socket l-, (31 is the aging board, (4j is the IC socket lid, and (5) is the measured I
C, fil is contact pinot, (7) is IC guide, (8)
is IC lead, (9) is IC lead holder, QOI +,
t M presser, (11) is a cavity for contact pinot, (12) is a cavity for lid presser, (13) is a socket positioning pin, (14)
) is the socket positioning hole.

Next, the operation will be explained.

The IC under test (5) stored in the IC storage tray (1)
), positional accuracy is ensured by the action of the IC guide (7) on the tray (1), and the tray (1) is attached to the aging board (3) as it is. At this time, the socket positioning pin (
13) The socket positioning hole (14) provides positional accuracy between the socket (2) and the tray (1). Further, the contact pin (6) and the IC lead (8) come into contact with each other through the contact pin cavity (12). Next, attach the lid presser G [to the lid presser cavity (1
1), the IC socket N (4) is fixed, and the IC lead presser (9) ensures contact between the contact pin (6) and the IC lead (8).

Note that although the above embodiment shows the case when the aging board is inserted, the same effect can be obtained when the aging board is removed.

Similar effects can be achieved with QFP packaged ICs.

〔Effect of the invention〕

As described above, according to the present invention, since the storage tray or IC can be aged, the number of storage trays stored in the storage tray can be inserted into and removed from the aging board at one time, which is effective in shortening the insertion/removal time.

[Brief explanation of the drawing]

Fig. 1 is an exploded perspective view of a semiconductor measuring device for one IC which is an embodiment of the present invention, Fig. 2 is a plan view of a conventional aging board, and Fig. 3 is a front view of a conventional IC aging socket. , FIG. 4 is a perspective view of a conventional IC storage tray. In the figure, (1) is an IC storage tray, (2) is an IC aging socket, (3) is an aging board, and (4) is an IC aging socket.
) is the IC socket cover, (5) is the IC to be measured, (61 is the contact pin, (7) is the IC guide, (8) is the IC lead,
(9) is the rc lead holder, (101 is the lid holder, (11)
is a cavity for the contact pin, (12) is a cavity for holding the lid, (18)
indicates a socket positioning pin, and (14) indicates a socket positioning hole. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] A semiconductor measuring device characterized by being capable of aging each storage tray in a high temperature aging test of semiconductor integrated circuits.