JPH04199538A - Semiconductor integrated circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a discrimination code provided inside a semiconductor integrated circuit, particularly for distinguishing the type thereof.

C. Prior Art FIG. 3 is a block diagram of a silicon trencher circuit conventionally used in EPROMs and the like.

In the figure, (1) is the signature created internally, (2) is the signal external terminal that outputs the signature (1), and (3) is the signal external terminal (2) that outputs the signature (1) by the output control signal of the signature. ) is a switch circuit connected to

Next, the operation will be explained. Is it possible to write to an E P ROM electrically from the outside? Depending on the type, the write voltage may differ. When writing with an EPR (1.1 writer), the writer first
PROM) or whatever, and write accordingly. For this reason, the EPROM has a type code called a silicon signature so that the type of writer can be determined.

In conventional semiconductor integrated circuits, when there is an external signature request, the switch circuit (3) is turned on by the signature control signal, and the internally generated signature (1) signal is sent to the signal external terminal (2). introduce.

[Invention or problem to be solved]

Conventional semiconductor integrated circuits have been configured as described above, so when different types are manufactured using the wire bonding process, it is difficult to distinguish between different types without passing through the wire bonding process. There was a point.

This invention was made in order to solve the above-mentioned problems, and it is possible to set different signatures for each type of semiconductor integrated circuit that is configured to create different types during a specific process, such as wire bonding. The purpose is to obtain a device that can

[Means to solve the problem]

The semiconductor device according to the present invention has a plurality of signatures provided therein, and is capable of selecting and outputting a signature depending on the honding situation of a specific process, for example, wire bonding.

[Effect]

In the semiconductor integrated circuit according to the present invention, when different types are produced in a specific process, the cider structure can be changed depending on the situation of the process.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, (1) and OD are internally built signatures, (2) are signal external terminals that output the signature -+1111), and (3) are signal terminals that output the signature (1) 0υ by the output control signal of the signature. The switch circuit (4) connected to the bonding state is a nignature selection circuit which receives a signal indicating the bonding state and selects the fern char (1) or 0D that matches the signal.

Next, the operation will be explained.

For example, if the semiconductor integrated circuit in this embodiment is a semiconductor integrated circuit that uses wire bonding to create an I10XI configuration and a ×4 configuration, in the case of an ILO or ×1 configuration, there is a request for a solicon signature from the outside. In this case, the switch circuit (3) is activated by the fern char control signal.
is turned on, and the signature A (1) selected by the silicon signature selection circuit (4) is connected to the signal external terminal (2).
).

At this time, the fern char selection circuit (4) selects fern char A (1) based on the signal indicating the bonding situation that the wire bonding is in the x1 configuration, so the signal external terminal (2) Fern char A (
1+ is output.

Conversely, in the case of ×4 configuration, the signature selection circuit (4)
Since signature B 11) is selected, signature B will be output to the signal external terminal (2) in response to the signature request.

In the above embodiment, a fern signature selection circuit (4) is provided to select and output from a plurality of prepared signatures (1) 0υ. Signature generation circuit (5) that generates the signature itself based on the signal
) may be provided (in this case, all the plurality of signatures are unnecessary), and the same effect as in the above embodiment is achieved.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to set different signatures based on the information obtained from the specific process of manufacturing different types, so it is possible to obtain semiconductor integrated circuits with a large amount of information about the types. It's effective.

[Brief explanation of the drawing]

Fig. 1 is a block diagram of a signature circuit of a semiconductor integrated circuit which is an embodiment of the present invention, Fig. 2 is a block diagram of a signature circuit which shows another embodiment of the invention, and Fig. 3 is a conventional semiconductor integrated circuit. FIG. 2 is a block diagram of the signature circuit of FIG. (1) is signature A, (2) is the signal external terminal, (3
) is a switch circuit, (4) is a fern char selection circuit, (
5) is a signature generation circuit, and OD indicates signature B. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] 1. A semiconductor integrated circuit configured to produce different types in a specific process, characterized in that different signatures are set depending on information obtained in the process.