JPH04199600A - Component mounting apparatus - Google Patents

Abstract

PURPOSE:To allow the reduction of the cycle time in mounting a component by arranging either a suction nozzle or a recognition mechanism so as to be traversable on a component mounting head relative to the other. CONSTITUTION:A component mounting head 2 is provided with a suction nozzle 3 and a recognition mechanism 5 which recognizes the presence of a component 4 attracted by the suction nozzle 3, and either the suction nozzle or the mechanism is arranged to be traversable relative to the other on the mounting head 2. Subsequently to the attraction of a component by the suction nozzle 3, the presence of the attracted component 4 on the component mounting head 2 is immediately acknowledged by means of the recognition mechanism 5 on the basis of a relative movement between the suction nozzle 3 and the recognition mechanism 5. This leads to the cycle time in mounting components being reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a component mounting apparatus, and particularly to a component mounting apparatus used for mounting IC chip components and the like on a semiconductor substrate.

[Conventional technology]

In general, component mounting equipment, such as chip mounters, uses IC
The component mounting head holding the chip component moves to the component recognition section, where an imaging device such as a CCD camera images the chip component, captures image data, and calculates the difference between the center positions of the suction nozzle and the chip component. Moving to the component mounting position.

[The problem that the invention seeks to solve]

However, in such conventional equipment, the component mounting head moves to the chip component recognition position after picking up the chip component.
This method requires a step to recognize chip components, which lengthens the cycle time for component mounting and hinders improvement in operating efficiency.

The present invention seeks to eliminate the above-mentioned drawbacks.

[Failure to solve the problem]

In the component mounting apparatus of the present invention, the component mounting head is provided with a suction nozzle and a recognition mechanism for the component suctioned by the suction nozzle, and one of the suction nozzle and the recognition mechanism is configured to move the part relative to the other. [Function] In the component mounting apparatus of the present invention, after the component is suctioned by the suction nozzle, it is moved on the component suction head by the relative movement of the suction nozzle and the component recognition mechanism. The suctioned component comes to be recognized by the component recognition mechanism.

〔Example〕

The present invention will be explained in detail below with reference to the drawings.

FIG. 1 shows a component mounting apparatus of the present invention, in which 1 is a two-dimensionally movable robot, 2 is a component mounting head that is moved between a chip component supply section and a chip component mounting section by this robot, and 8 is a component mounting head that is moved between a chip component supply section and a chip component mounting section. This is a suction nozzle that suctions a chip component 4 provided on a head 2.

In the present invention, the recognition mechanism 5 for the chip component 4 is provided in the head 2.
At the same time, the suction nozzle 8 is made movable on the head 2 from the suction position of the chip component 4 shown by the chain line to the imaging position shown by the solid line, and the recognition mechanism 5 has the suction nozzle 3 moved to the imaging position. A chip component illumination light source 6 such as an LED that illuminates the chip component 4 sucked by the suction nozzle 3 when the chip component 4 is sucked, and a prism 7a that receives reflected light from the chip component 4.

7b, an optical system 7 consisting of a lens 7C, and an imaging device 8 are provided.

The present invention has the above-mentioned configuration, and the head 2 moves above a chip feeder (not shown) such as an IC, and the nozzle 3 descends to adsorb a chip component 4 and then ascends. Thereafter, the head 2 starts to move onto the substrate (not shown), the nozzle 3 moves onto the bullstom 7a, and the imaging device W8 performs a process based on the imaging data of the chip component 4, for example, in Japanese Patent Application No.
The center of gravity position is determined as described in the specification and drawings of No. 203957, and the head 2 is positioned so that the center of gravity position is aligned with a predetermined position on the substrate.

The case of the above-mentioned recognition mechanism 5 has an L-shape that protrudes to the extent that it consists of the head 2 and then bends and extends toward the suction nozzle.
Chip component 4 on suction nozzle 3 moved to the above imaging position
The light source 6 and the prism 7a are attached to the extended portion where the light source 6 and the prism 7a can be recognized.
The imaging device 8 and the lens 7c are arranged in a part adjacent to the head 2, but as shown in FIG. 2, the imaging device 8 and the lens 7C are arranged in a part adjacent to the prism 7a, and the prism 7b is omitted. You can also force it.

In addition, as shown in FIG. 3, the suction nozzle 3 is fixed to the head 2, and a recognition mechanism 5 is movably provided to the head 2 instead. It is also possible to evacuate it to the position shown in .

Figure 4 shows both the suction nozzle 8 and the recognition mechanism 5 on the head 2.
Another embodiment is shown in which the case of the recognition mechanism 5 is rotatable around an axis 9 parallel to the axis of the suction nozzle 3 so that it can be rotated and retracted during chip component suction work. It may be tilted instead of rotating.

In FIG. 5, illumination light #6 is provided on the suction nozzle 3 side instead of on the recognition mechanism 5, and the light from this illumination light source 6 is transmitted to the diffusion plate 1.
Another embodiment is shown in which the tip is directed to the back of the chip component 4 that has been sucked through the tip.

[Effects of the Invention] Since the component mounting apparatus of the present invention has the above-described configuration, the recognition mechanism can immediately image the component after the suction nozzle suctions the component, and start calculating the center position of the component with respect to the suction nozzle. This eliminates the need to move the head to the component recognition position after the suction nozzle suctions the component, as in the past.
The cycle time for component mounting can be shortened.

In addition, if the head has multiple suction nozzles and there are parts that do not require image recognition, they can be mounted while the recognition mechanism is performing calculations to recognize the center positions of other suction parts, thereby increasing the operation rate. There are significant benefits that can be further improved.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of the component mounting apparatus of the present invention, and FIGS.
The figures are illustrations of other embodiments of the present invention. l...Robot, 2...Component mounting head, 3...
Suction nozzle, 4... Chip component, 5... Recognition mechanism,
6...Illumination light source, 7...Optical system, 7a, 7b...
・Prism, 7c... Lens, 8... Imaging device, 9
... Axis line, 1o... Diffusion plate.

Claims (2)

[Claims] (1) The component mounting head is equipped with a suction nozzle and a recognition mechanism for the components suctioned by the suction nozzle.
A component mounting apparatus characterized in that either the suction nozzle or the recognition mechanism is movable on the component mounting head relative to the other. (2) The component mounting apparatus according to claim 1, wherein the movement is any one of linear deviation, rotation, and tilting, or a combination thereof.