JPH0420235U - - Google Patents

Info

Publication number
JPH0420235U
JPH0420235U JP1990062518U JP6251890U JPH0420235U JP H0420235 U JPH0420235 U JP H0420235U JP 1990062518 U JP1990062518 U JP 1990062518U JP 6251890 U JP6251890 U JP 6251890U JP H0420235 U JPH0420235 U JP H0420235U
Authority
JP
Japan
Prior art keywords
aluminum
bonding pad
integrated circuit
substrate
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990062518U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990062518U priority Critical patent/JPH0420235U/ja
Publication of JPH0420235U publication Critical patent/JPH0420235U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの考案の一実施例をであるボンデイ
ングパツトを印刷された金属基板上へマウントし
た状態を示す断面図、第２図は従来およびこの考
案共通のボンデイングパツトを使用した混成集積
回路装置を示す断面図、第３図は従来のボンデイ
ングパツトを印刷された金属基板上へマウントし
た状態を示す断面図である。 図において、１は金属基板、２は絶縁性接着剤
層、３は銅箔電極、４はボンデイング用パツト、
５は半導体チツプ、６は半田層、７はアルミ線、
８はアルミニウム、１１はＮｉめつき層、１２は
印刷半田を示す。なお、図中、同一符号は同一、
又は相当部分を示す。 Figure 1 is a cross-sectional view showing an embodiment of this invention in which bonding pads are mounted on a printed metal substrate, and Figure 2 is a hybrid integrated circuit device using bonding pads common to conventional and this invention. FIG. 3 is a sectional view showing a conventional bonding pad mounted on a printed metal substrate. In the figure, 1 is a metal substrate, 2 is an insulating adhesive layer, 3 is a copper foil electrode, 4 is a bonding pad,
5 is a semiconductor chip, 6 is a solder layer, 7 is an aluminum wire,
8 is aluminum, 11 is a Ni plating layer, and 12 is printed solder. In addition, in the figure, the same reference numerals are the same,
or a corresponding portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に搭載されたチツプのアルミニウム電極
が前記基板上に設けられた配線導体上に固着され
るボンデイング用パツトの上面とアルミニウム線
によつて接続される混成集積回路において、前記
ボンデイング用パツトはアルミニウムあるいはア
ルミニウム合金からなり、配線導体上に固定され
る側がアルミニウムあるいはアルミニウム合金の
厚さより薄いニツケルめつきが施されているボン
デイング用パツトを印刷用半田で半田付けしこと
を特徴とする混成集積回路装置。 In a hybrid integrated circuit in which an aluminum electrode of a chip mounted on a substrate is connected by an aluminum wire to the upper surface of a bonding pad fixed on a wiring conductor provided on the substrate, the bonding pad is made of aluminum. Alternatively, a hybrid integrated circuit device comprising a bonding pad made of aluminum alloy and having a nickel plating thinner than the thickness of the aluminum or aluminum alloy on the side fixed to the wiring conductor, soldered with printed solder. .
JP1990062518U 1990-06-12 1990-06-12 Pending JPH0420235U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990062518U JPH0420235U (en) 1990-06-12 1990-06-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990062518U JPH0420235U (en) 1990-06-12 1990-06-12

Publications (1)

Publication Number Publication Date
JPH0420235U true JPH0420235U (en) 1992-02-20

Family

ID=31591742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990062518U Pending JPH0420235U (en) 1990-06-12 1990-06-12

Country Status (1)

Country Link
JP (1) JPH0420235U (en)

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