JPH0420265U - - Google Patents

Description

[Brief explanation of the drawing]

Fig. 1 is a side sectional view schematically showing an embodiment of high-density packaging according to the present invention, and Fig. 2a shows a four-sided connected composite substrate as a preliminary stage of a four-sided connected module used in this packaging. A plan view, FIG. 2b is a sectional view taken along the line b-b in FIG. FIG. 5a is a plan view of a main part showing an example in which the physical conductors that electrically connect these composite substrates are printed conductors or vapor-deposited conductors, and FIG. 5b is a plan view showing the state of conductor formation. bb line sectional view at a, Figure 5c
is a sectional view taken along the line c-c in Fig. 5a, Fig. 6a is a plan view of the main part showing an example in which the conductor is a metal foil conductor or a metal wire, and Fig. 6b is a sectional view taken along the line b-b in Fig. 6a. 7 is a plan view showing various components mounted on the electric circuit formed on each composite substrate, and FIG. 8 is a volume to the window formed through the board surface of the composite substrate. FIG. 9 is a diagram illustrating the folding operation of the jig for the four-sided connected module, FIG. 10 is a perspective view illustrating the three-dimensional joining order of each module, and FIG. An enlarged sectional view of the main part showing how the conductor is accommodated in the corner pocket when the conductor is a printed conductor or a vapor-deposited conductor. Figure 12 shows how the conductor is accommodated in the corner pocket when the bridge conductor is a metal foil conductor or metal wire. 13 is an enlarged sectional view of the main part showing an example of conductor connection processing at a corner when no corner pocket or bridge conductor is provided. FIG. 14 is a side sectional view showing conventional packaging. FIG. 15 is a diagram illustrating the miniaturization and high density required for this packaging. 100... Four-sided connection module, 110... Cable module, 120... Sensor module, 200... High-density packaging, 10-11
~10-41, 11-1, 12-1...Substrate surface,
10-41a, 10-41b, 11-1a... window, 13... volume, 10-7, 10-8...
Bridge conductor, P...corner pocket, 10-1
2B~10-42B...Convex portion, 10-13B~
10-43B, 10-14B to 10-44B, 1
0-15B to 10-45B...Concave portion.

Claims (1)

[Claims for Utility Model Registration] (1) A module comprising a plurality of modules each having various parts mounted on an electric circuit formed on the board surface;
High-density packaging made by three-dimensionally joining these modules with the substrate surface as the inner surface. (2) The high-density packaging according to claim 1, wherein a part of the components mounted on the module is exposed to the outside world through a through hole formed in the substrate surface. (3) The high-density packaging according to claim 1, characterized in that the electric circuits between the modules are connected by a bridge conductor, and the bridge conductor is housed in a corner pot formed at the abutting portion of the modules. (4) The high-density packaging according to claim 1, characterized in that the electric circuits between the modules are connected by a bridge conductor, and the bridge conductor is formed for all modules at the same time. (5) The high-density packaging according to claim 1, characterized in that the modules are combined with each other by a concavo-convex structure formed at their abutting portions.