JPH042027U - - Google Patents
Info
- Publication number
- JPH042027U JPH042027U JP1990043302U JP4330290U JPH042027U JP H042027 U JPH042027 U JP H042027U JP 1990043302 U JP1990043302 U JP 1990043302U JP 4330290 U JP4330290 U JP 4330290U JP H042027 U JPH042027 U JP H042027U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pattern
- pattern
- row
- circuit board
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Description
第１図はこの考案の実施例の一部拡大平面図、
第２図及び第５図は従来の一部拡大平面図、第３
図は第１図に対応する一部拡大側面図、第４図及
び第６図は第２図に対応する一部拡大側面図であ
る。
１，１２……第２列ボンデイングパターン、２
，３……ＩＣボンデイングパツト、４……ＩＣパ
ツトピツチ、５，６，１３……ワイヤー、７，１
４……ボンデイングパターンピツチ、８……ＩＣ
、９，１１……第１列ボンデイングパターン、１
０……基板。
Figure 1 is a partially enlarged plan view of an embodiment of this invention;
Figures 2 and 5 are partially enlarged plan views of the conventional model;
The figure is a partially enlarged side view corresponding to FIG. 1, and FIGS. 4 and 6 are partially enlarged side views corresponding to FIG. 2. 1, 12...Second row bonding pattern, 2
, 3...IC bonding patch, 4...IC patch pitch, 5, 6, 13...Wire, 7, 1
4...Bonding pattern pitch, 8...IC
, 9, 11...first row bonding pattern, 1
0...Substrate.
Claims (1)
と前記回路基板の第１列ボンデイングパターン９
と第２列ボンデイングパターン１で千鳥状に形成
されワイヤーボンデイングで接続されているワイ
ヤーボンデイングパターン形状において、第２列
ボンデイングパターン１のＩＣ側のパターン形状
を円弧にしたことを特徴とするワイヤーボンデイ
ングパターン形状。 an IC, a circuit board on which the IC is mounted at a predetermined location, and a first row bonding pattern 9 of the circuit board
and a second row bonding pattern 1 formed in a staggered manner and connected by wire bonding, the wire bonding pattern characterized in that the pattern shape on the IC side of the second row bonding pattern 1 is an arc. shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990043302U JPH042027U (en) | 1990-04-23 | 1990-04-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990043302U JPH042027U (en) | 1990-04-23 | 1990-04-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH042027U true JPH042027U (en) | 1992-01-09 |
Family
ID=31555603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990043302U Pending JPH042027U (en) | 1990-04-23 | 1990-04-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042027U (en) |
-
1990
- 1990-04-23 JP JP1990043302U patent/JPH042027U/ja active Pending