JPH042031U - - Google Patents

Info

Publication number
JPH042031U
JPH042031U JP1990041824U JP4182490U JPH042031U JP H042031 U JPH042031 U JP H042031U JP 1990041824 U JP1990041824 U JP 1990041824U JP 4182490 U JP4182490 U JP 4182490U JP H042031 U JPH042031 U JP H042031U
Authority
JP
Japan
Prior art keywords
semiconductor integrated
correcting
utility
manufacturing apparatus
function
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990041824U
Other languages
Japanese (ja)
Other versions
JP2514007Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990041824U priority Critical patent/JP2514007Y2/en
Publication of JPH042031U publication Critical patent/JPH042031U/ja
Application granted granted Critical
Publication of JP2514007Y2 publication Critical patent/JP2514007Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例を示す図である。第２
図は従来のボンデイング位置修正方法を示す図で
ある。 １……ＩＣチツプ、２……ボンデイングパツド
、３……インナーリード、４……マンピユレータ
。 FIG. 1 is a diagram showing an embodiment of the present invention. Second
The figure shows a conventional bonding position correction method. 1...IC chip, 2...bonding pad, 3...inner lead, 4...manpilator.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体集積回路のワイヤーボンデイングにおい
て、ボンデイング位置修正時の修正可能範囲を任
意に設定できる機能を有することを特徴とする半
導体集積回路製造装置。 A semiconductor integrated circuit manufacturing apparatus having a function of arbitrarily setting a correctable range when correcting a bonding position in wire bonding of semiconductor integrated circuits.
JP1990041824U 1990-04-19 1990-04-19 Semiconductor integrated circuit manufacturing equipment Expired - Lifetime JP2514007Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990041824U JP2514007Y2 (en) 1990-04-19 1990-04-19 Semiconductor integrated circuit manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990041824U JP2514007Y2 (en) 1990-04-19 1990-04-19 Semiconductor integrated circuit manufacturing equipment

Publications (2)

Publication Number Publication Date
JPH042031U true JPH042031U (en) 1992-01-09
JP2514007Y2 JP2514007Y2 (en) 1996-10-16

Family

ID=31552824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990041824U Expired - Lifetime JP2514007Y2 (en) 1990-04-19 1990-04-19 Semiconductor integrated circuit manufacturing equipment

Country Status (1)

Country Link
JP (1) JP2514007Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0212932A (en) * 1988-06-30 1990-01-17 Mitsubishi Electric Corp Wire bonding apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0212932A (en) * 1988-06-30 1990-01-17 Mitsubishi Electric Corp Wire bonding apparatus

Also Published As

Publication number Publication date
JP2514007Y2 (en) 1996-10-16

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term