JPH0456340U - - Google Patents
Info
- Publication number
- JPH0456340U JPH0456340U JP1990098834U JP9883490U JPH0456340U JP H0456340 U JPH0456340 U JP H0456340U JP 1990098834 U JP1990098834 U JP 1990098834U JP 9883490 U JP9883490 U JP 9883490U JP H0456340 U JPH0456340 U JP H0456340U
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- test pad
- circuit board
- circuit
- output terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
図は本発明の実施例の構成を示す断面図である
。
主要部分の符号の説明、１……回路基板、２…
…ＩＣチツプ、３……半導体集積回路、４……ボ
ンデイングランド、５……ワイヤ、６……接続ラ
ンド、７……リード、８……スルーホール、９…
…試験用パツド。
The figure is a sectional view showing the configuration of an embodiment of the present invention. Explanation of symbols of main parts, 1...Circuit board, 2...
...IC chip, 3...Semiconductor integrated circuit, 4...Bonding land, 5...Wire, 6...Connection land, 7...Lead, 8...Through hole, 9...
...Test pad.
Claims (1)
つて、他主表面に設けられた試験用パツドと、前
記回路部品の入出力端子と前記試験用パツドとを
接続する接続手段とを含むことを特徴とする回路
基板。 A circuit board with circuit components mounted on one main surface, including a test pad provided on the other main surface, and connection means for connecting the input/output terminal of the circuit component and the test pad. A circuit board featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990098834U JPH0456340U (en) | 1990-09-20 | 1990-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990098834U JPH0456340U (en) | 1990-09-20 | 1990-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0456340U true JPH0456340U (en) | 1992-05-14 |
Family
ID=31840308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990098834U Pending JPH0456340U (en) | 1990-09-20 | 1990-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0456340U (en) |
-
1990
- 1990-09-20 JP JP1990098834U patent/JPH0456340U/ja active Pending