JPH042048U - - Google Patents
Info
- Publication number
- JPH042048U JPH042048U JP4253290U JP4253290U JPH042048U JP H042048 U JPH042048 U JP H042048U JP 4253290 U JP4253290 U JP 4253290U JP 4253290 U JP4253290 U JP 4253290U JP H042048 U JPH042048 U JP H042048U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation structure
- metal fitting
- dissipation plate
- bending part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 14
- 238000005452 bending Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 description 4
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図乃至第３図はこの考案に係るＩＣの放熱
構造の実施例を示し、第１図は本考案のＩＣの放
熱構造を示す斜視図、第２図は同放熱構造の第２
の実施例を示す斜視図、第３図は同放熱構造の第
３の実施例を示す斜視図である。第４図及び第５
図は従来例のＩＣの放熱構造を示し、第４図は押
し出し放熱板によるＩＣの放熱構造を示す斜視図
、第５図は折り返し放熱板による同放熱構造を示
す斜視図である。
主な符号の説明、１……プリント基板、２……
ＩＣ、３……ストツパー金具、４……放熱板、４
ａ……ＩＣを挟持するための曲げ部、５……ネジ
、６……ストツパー金具、６ａ……放熱用曲げ部
、７……放熱板、７ａ……ＩＣを挟持するための
曲げ部、７ｂ……放熱用曲げ部、８……ストツパ
ー金具、８ａ，８ｂ……放熱用曲げ部、９……放
熱板、９ａ……ＩＣを挟持するための曲げ部、９
ｂ……放熱用曲げ部、１１……押し出し放熱板、
１１ａ……固定部、１２……コ字状板バネ、１３
……折り曲げ放熱板、１３ａ……固定部。
1 to 3 show examples of the heat dissipation structure of an IC according to the present invention, FIG. 1 is a perspective view showing the heat dissipation structure of the IC of the present invention, and FIG.
FIG. 3 is a perspective view showing a third embodiment of the same heat dissipation structure. Figures 4 and 5
The figures show a conventional IC heat dissipation structure, FIG. 4 is a perspective view showing an IC heat dissipation structure using an extruded heat dissipation plate, and FIG. 5 is a perspective view showing the same heat dissipation structure using a folded heat dissipation plate. Explanation of main symbols, 1...Printed circuit board, 2...
IC, 3...stopper metal fitting, 4...heat sink, 4
a...Bending part for holding the IC, 5...Screw, 6...Stopper fitting, 6a...Bending part for heat radiation, 7...Radiation plate, 7a...Bending part for holding the IC, 7b ... Bending portion for heat radiation, 8... Stopper fitting, 8a, 8b... Bending portion for heat radiation, 9... Heat sink, 9a... Bending portion for holding IC, 9
b... Heat dissipation bending part, 11... Extruded heat dissipation plate,
11a... Fixed part, 12... U-shaped leaf spring, 13
...Folded heat sink, 13a...Fixed part.
Claims (1)
、放熱板に設けたＩＣ用曲げ部とでＩＣを挟持し
放熱板をストツパー金具に固定するように構成し
たことを特徴とするＩＣの放熱構造。[Scope of Claim for Utility Model Registration] In the heat dissipation structure of an IC used in electronic equipment, the IC is held between a stopper metal fitting provided to fix the IC and a bending part for the IC provided on the heat dissipation plate, and the heat dissipation plate is stopped. A heat dissipation structure for an IC, characterized in that it is configured to be fixed to a metal fitting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4253290U JPH042048U (en) | 1990-04-23 | 1990-04-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4253290U JPH042048U (en) | 1990-04-23 | 1990-04-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH042048U true JPH042048U (en) | 1992-01-09 |
Family
ID=31554159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4253290U Pending JPH042048U (en) | 1990-04-23 | 1990-04-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042048U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012134200A (en) * | 2010-12-20 | 2012-07-12 | Cosel Co Ltd | Semiconductor heat radiator |
-
1990
- 1990-04-23 JP JP4253290U patent/JPH042048U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012134200A (en) * | 2010-12-20 | 2012-07-12 | Cosel Co Ltd | Semiconductor heat radiator |
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