JPH02102741U - - Google Patents

Info

Publication number
JPH02102741U
JPH02102741U JP1989012007U JP1200789U JPH02102741U JP H02102741 U JPH02102741 U JP H02102741U JP 1989012007 U JP1989012007 U JP 1989012007U JP 1200789 U JP1200789 U JP 1200789U JP H02102741 U JPH02102741 U JP H02102741U
Authority
JP
Japan
Prior art keywords
hole
mounting
semiconductor element
semiconductor
mounting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989012007U
Other languages
Japanese (ja)
Other versions
JP2546304Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989012007U priority Critical patent/JP2546304Y2/en
Publication of JPH02102741U publication Critical patent/JPH02102741U/ja
Application granted granted Critical
Publication of JP2546304Y2 publication Critical patent/JP2546304Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本考案の半導体素子の固定装置の正
面図、第２図は、同じく第１図のＡ―Ａ′におけ
る断面図、第３図は同じく分解斜視図である。 １……プリント基板、４……パワーアンプＩＣ
（半導体素子）、６Ａ，６Ｂ……取付部、７……
放熱板（放熱部材）、８Ａ，８Ｂ……透孔、１０
……取付金具、１１Ａ，１１Ｂ……ネジ（ネジ部
材）、１２Ａ，１２Ｂ……ネジ孔（透孔）、１３
Ａ，１３Ｂ……リブ、１５……折曲片。 FIG. 1 is a front view of the semiconductor device fixing device of the present invention, FIG. 2 is a sectional view taken along line AA' in FIG. 1, and FIG. 3 is an exploded perspective view. 1...Printed circuit board, 4...Power amplifier IC
(semiconductor element), 6A, 6B... mounting portion, 7...
Heat dissipation plate (heat dissipation member), 8A, 8B...Through hole, 10
...Mounting bracket, 11A, 11B...Screw (screw member), 12A, 12B...Screw hole (through hole), 13
A, 13B...Rib, 15...Bent piece.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板と、取付部を有すると共に前記プ
リント基板に端子が半田付けされる半導体素子と
、前記取付部と対応する位置に透孔を有する放熱
部材と、前記放熱部材の透孔および前記半導体の
取付部と対応する位置に透孔を有する取付金具と
、前記放熱部材を半導体素子及び取付金具に前記
取付部及び夫々の前記透孔を介してネジ止めする
ネジ部材とを備え、前記取付金具は前記透孔の周
囲に前記半導体素子の取付部に挿入可能な突出リ
ブが設けられ、且つ前記半導体素子の放熱部材側
の面に係合可能な折曲片が設けられていることを
特徴とする半導体素子の固定装置。 a printed circuit board, a semiconductor element having a mounting portion and having a terminal soldered to the printed circuit board, a heat radiation member having a through hole at a position corresponding to the mounting portion, a through hole in the heat radiation member and mounting of the semiconductor. a mounting bracket having a through hole at a position corresponding to the part; and a screw member for screwing the heat dissipating member to the semiconductor element and the mounting bracket through the mounting part and each of the through holes, A semiconductor characterized in that a protruding rib that can be inserted into the mounting portion of the semiconductor element is provided around the through hole, and a bent piece that can be engaged with the surface of the semiconductor element on the heat dissipation member side is provided. Element fixing device.
JP1989012007U 1989-02-02 1989-02-02 Device for fixing semiconductor elements Expired - Lifetime JP2546304Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989012007U JP2546304Y2 (en) 1989-02-02 1989-02-02 Device for fixing semiconductor elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989012007U JP2546304Y2 (en) 1989-02-02 1989-02-02 Device for fixing semiconductor elements

Publications (2)

Publication Number Publication Date
JPH02102741U true JPH02102741U (en) 1990-08-15
JP2546304Y2 JP2546304Y2 (en) 1997-08-27

Family

ID=31221063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989012007U Expired - Lifetime JP2546304Y2 (en) 1989-02-02 1989-02-02 Device for fixing semiconductor elements

Country Status (1)

Country Link
JP (1) JP2546304Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0567891A (en) * 1991-09-09 1993-03-19 Matsushita Electric Ind Co Ltd Electronic component mounting device
JPH07235783A (en) * 1994-02-22 1995-09-05 Ebara Densan:Kk How to fix the power module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0567891A (en) * 1991-09-09 1993-03-19 Matsushita Electric Ind Co Ltd Electronic component mounting device
JPH07235783A (en) * 1994-02-22 1995-09-05 Ebara Densan:Kk How to fix the power module

Also Published As

Publication number Publication date
JP2546304Y2 (en) 1997-08-27

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