JPH04207018A - Semiconductor manufacturing device - Google Patents
Semiconductor manufacturing deviceInfo
- Publication number
- JPH04207018A JPH04207018A JP33974990A JP33974990A JPH04207018A JP H04207018 A JPH04207018 A JP H04207018A JP 33974990 A JP33974990 A JP 33974990A JP 33974990 A JP33974990 A JP 33974990A JP H04207018 A JPH04207018 A JP H04207018A
- Authority
- JP
- Japan
- Prior art keywords
- boat
- reaction tube
- semiconductor manufacturing
- wafers
- electromagnet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000004065 semiconductor Substances 0.000 title claims description 11
- 235000012431 wafers Nutrition 0.000 claims abstract description 13
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 abstract description 3
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、半導体製造装置、特にＣＶＤ装置に関する
。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to semiconductor manufacturing equipment, particularly CVD equipment.
（発明の概要）
この発明は、半導体装置の製造に用いるＣＶＤ装置の反
応管にウェハーをローディングしたボートを挿入、搬出
する時にボートが、反応管に触れないようにしたことを
特徴とする半導体製造装置である。(Summary of the Invention) This invention is a semiconductor manufacturing method characterized in that when a boat loaded with wafers is inserted into and taken out of a reaction tube of a CVD apparatus used for manufacturing semiconductor devices, the boat does not touch the reaction tube. It is a device.
（従来の技術）
従来の半導体製造装置は第２図に示すように、反応管１
の内面とボート３が接触しているため、ウェハー２をロ
ーディングしたボードを挿入搬出する際に、反応管の内
面に堆積したＣＶＤ膜が剥がれる。(Prior Art) A conventional semiconductor manufacturing apparatus has a reaction tube 1 as shown in FIG.
Since the inner surface of the reaction tube is in contact with the boat 3, the CVD film deposited on the inner surface of the reaction tube is peeled off when the board loaded with the wafers 2 is inserted and carried out.
（発明が解決しようとする課題）
従来の半導体製造装置では反応管内にボードを挿入した
際に。ＣＶＤ膜が剥がれて、ウェハーの表面に付着し、
その上からＣＶＤ膜をデポジションするため取れなくな
ってしまい、ウェハー上の異物として、その部分は不良
品となってしまうことが多い。(Problem to be Solved by the Invention) In conventional semiconductor manufacturing equipment, when a board is inserted into a reaction tube. The CVD film peels off and adheres to the wafer surface,
Since the CVD film is deposited on top of the wafer, it cannot be removed, and the wafer often becomes a defective product because of foreign matter on the wafer.
（課題を解決するための手段）
上記問題点を解決するために、本発明において反応管の
底部に電磁石を配し、ボートの底部に永久磁石を配しリ
ニアモーターによりボートを浮かした状態で反応管にボ
ートを挿入。搬出することでＣＶＤ膜の剥がれを防止す
ることが可能とした。(Means for Solving the Problems) In order to solve the above problems, in the present invention, an electromagnet is arranged at the bottom of the reaction tube, a permanent magnet is arranged at the bottom of the boat, and the reaction is carried out while the boat is floated by a linear motor. Insert the boat into the tube. This made it possible to prevent the CVD film from peeling off.
（作用）
上記のように反応管内へのボートの挿入、搬出をリニア
モーターによっておこなうことによってＣＶＤ膜の堆積
物の剥がれが無くなりウェハーの異物がなくなった。(Function) By inserting and carrying out the boat into and out of the reaction tube using a linear motor as described above, the CVD film deposits were not peeled off and foreign matter on the wafers was eliminated.
（実施例）
以下に、この発明の半導体製造装置の実施例を図面にも
とづいて説明する。(Example) Below, an example of the semiconductor manufacturing apparatus of the present invention will be described based on the drawings.
第１図に示すように、反応管１の内部にウェハー２をロ
ーディングしたボード３を挿入するときボート底部の磁
石４と反応管底部の電磁石５のはたらきでボード３に浮
力と推進力を与えることにより、ボート３が反応管１の
内部に触れることなく挿入と搬出することが出来る。As shown in FIG. 1, when a board 3 loaded with wafers 2 is inserted into a reaction tube 1, buoyancy and propulsion are applied to the board 3 by the action of a magnet 4 at the bottom of the boat and an electromagnet 5 at the bottom of the reaction tube. This allows the boat 3 to be inserted into and taken out of the reaction tube 1 without touching the inside thereof.
（発明の効果）
この発明により、以上説明したように反応管内部に堆積
したＣＶＤ膜の剥がれが無くなり、ウェハー表面に付着
する異物がなくなった。(Effects of the Invention) As explained above, the present invention eliminates peeling of the CVD film deposited inside the reaction tube and eliminates foreign matter adhering to the wafer surface.
第１図は、この発明によってリニアモーターの取り付け
られた半導体製造装置（ＣＶＤ装置）の反応部分の断面
図である。第２図は。従来の半導体製造装置（ＣＶＤ装
置）の反応部分の断面図である。
１・・・反応管
２・・・ウェハー
３・・・ボート
４・・・永久磁石
５・・・電磁石
以 上
出願人 セイコー電子工業株式会社
代理人 弁理士 林 敬 之 助FIG. 1 is a sectional view of a reaction part of a semiconductor manufacturing device (CVD device) equipped with a linear motor according to the present invention. Figure 2 is. FIG. 2 is a cross-sectional view of a reaction part of a conventional semiconductor manufacturing device (CVD device). 1...Reaction tube 2...Wafer 3...Boat 4...Permanent magnet 5...Electromagnet and above Applicant Seiko Electronic Industries Co., Ltd. Agent Patent attorney Keinosuke Hayashi
Claims (1)
ェハーの出し入れを行うことを特徴とする半導体製造装
置。A semiconductor manufacturing device characterized in that an electromagnet is used to load and unload wafers into a CVD device used for manufacturing semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33974990A JPH04207018A (en) | 1990-11-30 | 1990-11-30 | Semiconductor manufacturing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33974990A JPH04207018A (en) | 1990-11-30 | 1990-11-30 | Semiconductor manufacturing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04207018A true JPH04207018A (en) | 1992-07-29 |
Family
ID=18330447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33974990A Pending JPH04207018A (en) | 1990-11-30 | 1990-11-30 | Semiconductor manufacturing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04207018A (en) |
-
1990
- 1990-11-30 JP JP33974990A patent/JPH04207018A/en active Pending
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