JPH0420877A - Semiconductor-device testing apparatus - Google Patents

Abstract

PURPOSE:To achieve high efficiency in a testing process by providing a sample mounting stage wherein coupling pins are provided at the four corners of the bottom surface in which a hole is opened in the upright pattern, a supporting plate which is coupled so that the plate can be moved up and down is provided in the main body, and a package holding tool can be capped so that the tool can be attached and removed. CONSTITUTION:A package holding tool 1 comprises a main body 2 and a supporting plate 3. Coupling pins 2a are provided at the four corners of the main body 2. A recess part 3a into which a package 5 escapes is provided at the central part of the supporting plate 3. A holding member 3b for elastically holding the corner of the package 5 is provided at one corner of the recess part 3a. A plurality of leads 5a are guided out of the package 5 and coupled into guide grooves 3c one by one. The guide grooves 3c are provided at the peripheral part at the same interval as the leads 5a. The supporting plate 3 is coupled in the main body 2 so that the plate can be moved up and down. The plate is elastically energized with a spring and the like so that the plate protrudes from the bottom surface of the main body 2. At the central part of the sample mounting stage 4, a recess 4a into which the package 5 escapes is patterned. A contact piece 4b is patterned at the peripheral part of the recess 4a. Coupling holes 4c into which the pins 2a that are provided at the main body 2 of the holding tool 1 are coupled are provided at the four corners.

Description

[Detailed Description of the Invention] [Summary] The purpose of the present invention is to provide a package holder and a sample mounting device for the purpose of holding the leads in a manner that enables accurate positioning, particularly for test equipment for semiconductor devices with high-speed operating characteristics and a large number of leads. The package holder has a box-shaped main body with fitting pins erected at four corners of an open bottom surface, and is fitted into the main body so as to be movable up and down, and is elastically biased downward. The support plate has a recessed portion in the center in which the package is placed, a holding member in at least one corner to which a corner of the package comes into elastic contact, and a plurality of leads led out from the package in the peripheral portion. Each of the sample mounting tables is fitted in a positionable manner and has a guide groove led out downward, and the sample mounting table has a package holder removably attached thereto, and a lead 5a is provided in the center of the table. It is configured to have a recess that escapes, a contact on the peripheral edge to which each of the leads fitted in the guide groove comes into elastic contact, and fitting holes at four corners into which fitting pins are inserted.

[Industrial application field]

The present invention relates to a testing apparatus for semiconductor devices, and more particularly to a testing apparatus for semiconductor devices in which a semiconductor element having a high operating frequency and a large number of leads is packaged.

In recent years, the integration of semiconductor elements with fast operating characteristics made of compound semiconductors such as gallium arsenide, which replaces silicon, has been progressing. However, for semiconductor devices with a high operating frequency and a large number of lead-out leads, it is difficult to use the conventional ICC probe, which allows chip evaluation and has good test efficiency, due to frequency band limitations.

Therefore, once a chip is sealed in a package, it is necessary to evaluate the chip using the package, and the challenge is how to evaluate accurately (and efficiently).

[Conventional technology]

Conventionally, the following methods have been used to mount a package of a semiconductor element (hereinafter abbreviated as high-speed IC) that operates at high speed and has a large number of leads into a test apparatus.

■An IC socket is mounted on a printed circuit board installed inside the test equipment, and a package is attached to the IC socket.

■The leads led out from the package are directly fixed to the printed circuit board installed inside the test equipment using solder or the like.

(2) A wiring pattern corresponding to the leads led out from the package is provided on the printed circuit board installed inside the test equipment to serve as contacts, and the leads are overlapped and pressed onto the contacts.

First, according to the method (2), the package can be easily attached and detached without destruction, but when evaluating high-speed ICs, it is necessary to match the impedance between the IC socket or the leads led out from the package and the contacts of the IC socket. This is troublesome.

Next, with the method (2), it takes a lot of man-hours to fix the package to the printed circuit board and to remove it from the printed circuit board, and it is difficult to attach and detach the sample without damaging the printed circuit board and without destroying it.

On the other hand, the method (2) allows attachment and detachment without damaging the sample. Furthermore, it is easy to match impedances, and is a suitable means for evaluating high-speed RC.

[Problems to be Solved by the Invention] As described above, in order to mount a package on a test device for high-speed IC evaluation, it is necessary to align the leads and the contacts provided on the printed circuit board of the test device. A suitable method is to apply pressure by applying pressure.

By the way, the contacts provided on the printed circuit board can be provided with high precision.

However, when it comes to packages, when the leads are thin and the number of leads increases, it is difficult to align the leads and contacts all at once, making it difficult to align the leads and contacts all at once. Dena (Naru. And,
There were problems with reliability of the test, such as short circuits between adjacent wires and F, and poor continuity between leads and contacts.

If an attempt is made to avoid this, it becomes necessary to take the time and effort to check the deformed state of each lead, which poses a problem in terms of work efficiency.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a semiconductor device testing apparatus that includes a pan cage holder that can hold leads led out from a package in a positionable and accurate manner.

[Means for Solving the Problems] The above-mentioned problems are as follows: The package holder is a box having a package holder and a sample mounting table, and the package holder is a box with fitting pins erected at the four corners of the open bottom surface. The mold has a main body, and a support plate that fits into the main body so as to be movable up and down and is elastically biased downward, and the support plate has a recess in the center in which the pan cage is placed;
A holding member having at least one corner in elastic contact with a corner of the package, and a guide groove in which each of the plurality of leads led out from the package is fitted in a positioning manner at the peripheral edge and curved downward, The sample mounting table has a package holder removably attached thereto, and has a recess in the center where the leads 5a escape, and a contact on the periphery with which each of the leads fitted in the guide groove comes into elastic contact. This problem is solved by a semiconductor device testing apparatus configured to have fitting holes at four corners into which fitting pins are inserted.

[For production]

When evaluating high-speed ICs with a large number of leads, for example, with conventional test equipment that places contacts on a printed circuit board and makes elastic contact with the leads, there are difficulties in aligning the contacts and leads due to deformation of the leads. In contrast, in the present invention, the leads can be positioned accurately.

That is, a guide groove into which each lead is fitted is provided on the peripheral edge of a support plate that fits into the main body of the package holder and can be moved up and down by being biased downward, and the leads are moved along the guide groove. We are trying to correct deformities, etc.

In addition, by setting up the fitting pins at the four corners of the main body and fitting the fitting pins into the fitting holes provided on the printed circuit board, the leads fitted in the guide grooves and the contacts provided on the sample mounting table will automatically connect. This ensures accurate alignment.

Furthermore, the guide groove is curved downward to ensure stable elastic contact between the lead and the contact.

In this way, a high-speed IC package with a large number of thin leads can be stably mounted on the test equipment.

〔Example〕

1 is an exploded perspective view of an embodiment of the present invention, FIG. 2 is a sectional view of FIG. 1, and FIG. 3 is a partially enlarged perspective view of FIG. 1.

In the figure, 1 is a package holder, 2 is a main body, 2a is a fitting pin, 3 is a support plate, 3a is a recess, 3b is a holding member, 3c is a guide groove, 3d is a spring, 4 is a sample mounting table, 4a is a hollow, 4
b is a contact, 4C is a fitting hole, 5 is a package, and 5a is a lead.

In FIGS. 1 and 2, the package holder 1 is the main body 2.
and a support plate 3.

The main body 2 is a box with an open bottom, and may be made of metal or plastic. Fitting pins 2a are provided at the four corners of the main body 2.

The support plate 3 is made of an insulating material such as plastic. A recess 3a for the package 5 to escape is provided in the center, and at least one corner of the recess 3a is provided with a clamping member 3b that elastically contacts and clamps the corner of the package 5.
is provided.

In addition, a guide groove 3C in which each of the plurality of glue portions 5a drawn out from the package 5 is fitted is provided on the periphery of the REET'5.
They are provided at the same intervals as a, and in a curved shape as shown in FIG. The wire 5a led out from the package 5 has a width of 0.16 mm and a thickness of 0.08 mm, for example.
mm, the shape of the guide groove 30 is, for example, 0.2 m wide.
m, the depth is 0.03 mm, and the lead 5a protrudes from the guide groove 3c by 0.05 mm.

This support plate 3 is fitted into the main body 2 so as to be movable up and down, and is elastically biased by a spring 3d or the like so as to protrude from the bottom surface of the main body 2 by, for example, about 0.5 mm.

The sample mounting table 4 forms a part of a test apparatus (not shown), and its surface is formed of, for example, a printed circuit board. A depression 4a in which the package 5 escapes is formed in the center, and contacts 4b are patterned around the periphery of the depression 4a. Moreover, fitting holes 4c into which fitting pins 2a provided on the main body 2 of the package holder 1 are fitted are provided at the four corners.

Then, when the package holder 1 is placed over the sample mounting table 4 and the fitting pin 2a is fitted into the fitting hole 4C, the lead 5a fitted in the guide groove 30 and protruding comes into contact with the contact 4b. It is now aligned.

Therefore, the support plate 3 is biased downward, and the guide groove 3
Since c is curved, when the package holder 1 is mounted on the sample mounting table 4, the leads 5a and the contacts 4b come into elastic contact with good positioning accuracy.

Sample package holder 1! ! 21 In order to fix it to the base 4, for example, at least one of the fitting pins 2a is made into a male thread, penetrates the main body 2, and is screwed into the fitting hole 4c of a female thread, but various modifications can be made. is possible.

〔Effect of the invention〕

According to the present invention, when evaluating a high-speed IC consisting of a package with a large number of leads, even if the leads are deformed, the guide grooves provided on the support plate of the pan cage holder allow accurate positioning.

In addition, by biasing the support plate downward and making the guide groove curved, the leads can be brought into stable elastic contact with the contacts of the sample mounting table.

Thus, the present invention greatly contributes to streamlining the testing process and improving the reliability of testing for high-speed ICs consisting of packages with a large number of leads.

[Brief explanation of drawings]

1 is an exploded perspective view of an embodiment of the present invention, FIG. 2 is a sectional view of FIG. 1, and FIG. 3 is a partially enlarged perspective view of FIG. 1. In the figure, ■ is a package holder, 2 is a main body, 3 is a support plate, 3b is a holding member, 2a is a fitting pin, 3a is a recess, 3c is a guide groove, 4 is a sample mounting table, 4b is a contact, 5 is the package, 4a is the recess, 4c is the insertion hole, 5a is the lead,

Claims (1)

[Scope of Claims] 1) It has a package holder (1) and a sample mounting table (4), and the package holder (1) has fitting pins (2a) standing at four corners of an open bottom surface. The support plate (3) is fitted into the main body (2) so as to be movable up and down and is elastically biased downward. )teeth,
a recess (3a) in which the package (5) is placed in the center;
a clamping member (3b) with which a corner of the package (5) comes into elastic contact with at least one corner, and a plurality of leads (5a) led out from the package (5) are fitted into the peripheral edge thereof so as to be positionable; The sample mounting table (4) has a downwardly curved guide groove (3c), and the package holder (1) is removably attached to the sample mounting table (4), and the sample mounting table (4) has a guide groove (3c) that is curved downward. Recess (4a) where package (5) escapes
, contacts (4b) on the peripheral edge of which each of the leads (5a) fitted in the guide groove (3c) comes into elastic contact; and fitting holes (4c) in the four corners into which the fitting pins (2a) are inserted. ) A testing device for a semiconductor device, characterized in that it has the following features. 2) The semiconductor device testing apparatus according to claim 1, wherein at least one of the fitting pins (2a) has a male thread, and the fitting hole (4c) facing the fitting pin (2a) has a female thread.