JPH04211140A - 樹脂封止形半導体装置の製造方法 - Google Patents

樹脂封止形半導体装置の製造方法

Info

Publication number
JPH04211140A
JPH04211140A JP3036488A JP3648891A JPH04211140A JP H04211140 A JPH04211140 A JP H04211140A JP 3036488 A JP3036488 A JP 3036488A JP 3648891 A JP3648891 A JP 3648891A JP H04211140 A JPH04211140 A JP H04211140A
Authority
JP
Japan
Prior art keywords
support plate
cavity
mold
resin
gate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3036488A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0566017B2 (2
Inventor
Takaaki Yokoyama
隆昭 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP3036488A priority Critical patent/JPH04211140A/ja
Publication of JPH04211140A publication Critical patent/JPH04211140A/ja
Publication of JPH0566017B2 publication Critical patent/JPH0566017B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP3036488A 1991-02-07 1991-02-07 樹脂封止形半導体装置の製造方法 Granted JPH04211140A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3036488A JPH04211140A (ja) 1991-02-07 1991-02-07 樹脂封止形半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3036488A JPH04211140A (ja) 1991-02-07 1991-02-07 樹脂封止形半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP59122047A Division JPS612348A (ja) 1984-06-15 1984-06-15 樹脂封止形半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH04211140A true JPH04211140A (ja) 1992-08-03
JPH0566017B2 JPH0566017B2 (2) 1993-09-20

Family

ID=12471213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3036488A Granted JPH04211140A (ja) 1991-02-07 1991-02-07 樹脂封止形半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPH04211140A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008192983A (ja) * 2007-02-07 2008-08-21 Kyocera Chemical Corp 半導体パッケージ用樹脂組成物、半導体パッケージの成形方法および半導体パッケージ用樹脂組成物供給装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008192983A (ja) * 2007-02-07 2008-08-21 Kyocera Chemical Corp 半導体パッケージ用樹脂組成物、半導体パッケージの成形方法および半導体パッケージ用樹脂組成物供給装置

Also Published As

Publication number Publication date
JPH0566017B2 (2) 1993-09-20

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Legal Events

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