JPH0566017B2 - - Google Patents

Info

Publication number
JPH0566017B2
JPH0566017B2 JP3036488A JP3648891A JPH0566017B2 JP H0566017 B2 JPH0566017 B2 JP H0566017B2 JP 3036488 A JP3036488 A JP 3036488A JP 3648891 A JP3648891 A JP 3648891A JP H0566017 B2 JPH0566017 B2 JP H0566017B2
Authority
JP
Japan
Prior art keywords
support plate
cavity
mold
resin
gate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP3036488A
Other languages
English (en)
Japanese (ja)
Other versions
JPH04211140A (ja
Inventor
Takaaki Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP3036488A priority Critical patent/JPH04211140A/ja
Publication of JPH04211140A publication Critical patent/JPH04211140A/ja
Publication of JPH0566017B2 publication Critical patent/JPH0566017B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP3036488A 1991-02-07 1991-02-07 樹脂封止形半導体装置の製造方法 Granted JPH04211140A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3036488A JPH04211140A (ja) 1991-02-07 1991-02-07 樹脂封止形半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3036488A JPH04211140A (ja) 1991-02-07 1991-02-07 樹脂封止形半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP59122047A Division JPS612348A (ja) 1984-06-15 1984-06-15 樹脂封止形半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH04211140A JPH04211140A (ja) 1992-08-03
JPH0566017B2 true JPH0566017B2 (2) 1993-09-20

Family

ID=12471213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3036488A Granted JPH04211140A (ja) 1991-02-07 1991-02-07 樹脂封止形半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPH04211140A (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5134257B2 (ja) * 2007-02-07 2013-01-30 京セラケミカル株式会社 半導体パッケージ用樹脂組成物、半導体パッケージの成形方法および半導体パッケージ用樹脂組成物供給装置

Also Published As

Publication number Publication date
JPH04211140A (ja) 1992-08-03

Similar Documents

Publication Publication Date Title
KR100889422B1 (ko) 반도체 장치의 제조 방법 및 반도체 장치
US3531856A (en) Assembling semiconductor devices
JPS6220705B2 (2)
JP2558413B2 (ja) リードフレーム上へのプラスチック部材の形成方法
EP0066188A1 (en) Plastic encapsulated semiconductor device and method for manufacturing the same
US4981776A (en) Method of manufacturing a plastic encapsulated semiconductor device with insulated heat sink
KR100591718B1 (ko) 수지-밀봉형 반도체 장치
US4910581A (en) Internally molded isolated package
JPH0566017B2 (2)
JPH0210572B2 (2)
JPH0566016B2 (2)
US20030134452A1 (en) Method for manufacturing semiconductor device packages
JPH0213462B2 (2)
JPH0244147B2 (2)
JP2555931B2 (ja) 半導体装置の製造方法
JPH0135478Y2 (2)
JPH0213461B2 (2)
JP2601033B2 (ja) 樹脂封止型半導体装置およびその製造方法
JP2726011B2 (ja) 半導体装置
JPH0744195B2 (ja) 樹脂封止型半導体装置の製造方法
JP2522304B2 (ja) 半導体素子収納パッケ−ジの製造方法
JPH0378779B2 (2)
CN116169102A (zh) 半导体装置及其制造方法
CN118116813A (zh) 制造半导体器件的方法以及对应的半导体器件
JPH0744194B2 (ja) 樹脂封止形半導体装置の製造方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees