JPH04211452A - Polyamide molding material with improved processability - Google Patents
Polyamide molding material with improved processabilityInfo
- Publication number
- JPH04211452A JPH04211452A JP3010376A JP1037691A JPH04211452A JP H04211452 A JPH04211452 A JP H04211452A JP 3010376 A JP3010376 A JP 3010376A JP 1037691 A JP1037691 A JP 1037691A JP H04211452 A JPH04211452 A JP H04211452A
- Authority
- JP
- Japan
- Prior art keywords
- polyamide
- molding material
- weight
- polyamide molding
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004952 Polyamide Substances 0.000 title claims abstract description 57
- 229920002647 polyamide Polymers 0.000 title claims abstract description 57
- 239000012778 molding material Substances 0.000 title claims abstract description 32
- 239000000654 additive Substances 0.000 claims abstract description 30
- 150000001408 amides Chemical class 0.000 claims abstract description 14
- 230000000996 additive effect Effects 0.000 claims abstract description 9
- 125000003118 aryl group Chemical group 0.000 claims abstract description 9
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000004202 carbamide Substances 0.000 claims abstract description 5
- 229930195733 hydrocarbon Natural products 0.000 claims abstract 3
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000001257 hydrogen Substances 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 6
- 229920000962 poly(amidoamine) Polymers 0.000 claims description 5
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 claims description 3
- 125000002947 alkylene group Chemical group 0.000 claims description 3
- 125000004122 cyclic group Chemical group 0.000 claims description 3
- 125000005842 heteroatom Chemical group 0.000 claims description 3
- JOSCNYCOYXTLTN-GFCCVEGCSA-N [3-[4-(aminomethyl)-6-(trifluoromethyl)pyridin-2-yl]oxyphenyl]-[(3R)-3-(hydroxymethyl)pyrrolidin-1-yl]methanone Chemical compound NCC1=CC(=NC(=C1)C(F)(F)F)OC=1C=C(C=CC=1)C(=O)N1C[C@@H](CC1)CO JOSCNYCOYXTLTN-GFCCVEGCSA-N 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 229920002302 Nylon 6,6 Polymers 0.000 abstract description 8
- 239000002131 composite material Substances 0.000 abstract description 8
- 239000003365 glass fiber Substances 0.000 abstract description 5
- 239000000945 filler Substances 0.000 abstract description 3
- 239000004215 Carbon black (E152) Substances 0.000 abstract 2
- 239000004615 ingredient Substances 0.000 abstract 1
- 239000012744 reinforcing agent Substances 0.000 abstract 1
- 239000000047 product Substances 0.000 description 20
- 239000000203 mixture Substances 0.000 description 18
- 239000000956 alloy Substances 0.000 description 16
- 229910045601 alloy Inorganic materials 0.000 description 16
- 238000000034 method Methods 0.000 description 14
- 229920002292 Nylon 6 Polymers 0.000 description 10
- 239000002253 acid Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 229920000768 polyamine Polymers 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- -1 aliphatic alcohols Chemical class 0.000 description 9
- 229920001577 copolymer Polymers 0.000 description 7
- 239000000835 fiber Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 235000021355 Stearic acid Nutrition 0.000 description 5
- 235000013877 carbamide Nutrition 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 5
- 230000008025 crystallization Effects 0.000 description 5
- 238000005265 energy consumption Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 5
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 5
- 239000011265 semifinished product Substances 0.000 description 5
- 239000008117 stearic acid Substances 0.000 description 5
- 239000004609 Impact Modifier Substances 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- 150000001735 carboxylic acids Chemical class 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- 230000009435 amidation Effects 0.000 description 3
- 238000007112 amidation reaction Methods 0.000 description 3
- 229920006020 amorphous polyamide Polymers 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920006380 polyphenylene oxide Polymers 0.000 description 3
- 229920001897 terpolymer Polymers 0.000 description 3
- 150000003672 ureas Chemical class 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000012963 UV stabilizer Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229940059260 amidate Drugs 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- NPUKDXXFDDZOKR-LLVKDONJSA-N etomidate Chemical compound CCOC(=O)C1=CN=CN1[C@H](C)C1=CC=CC=C1 NPUKDXXFDDZOKR-LLVKDONJSA-N 0.000 description 2
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 229920005669 high impact polystyrene Polymers 0.000 description 2
- 239000004797 high-impact polystyrene Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920006123 polyhexamethylene isophthalamide Polymers 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- FARHYDJOXLCMRP-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-1-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]pyrazol-3-yl]oxyacetic acid Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C=1C(=NN(C=1)CC(N1CC2=C(CC1)NN=N2)=O)OCC(=O)O FARHYDJOXLCMRP-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- FKLJPTJMIBLJAV-UHFFFAOYSA-N Compound IV Chemical compound O1N=C(C)C=C1CCCCCCCOC1=CC=C(C=2OCCN=2)C=C1 FKLJPTJMIBLJAV-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- NEAPKZHDYMQZCB-UHFFFAOYSA-N N-[2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]ethyl]-2-oxo-3H-1,3-benzoxazole-6-carboxamide Chemical compound C1CN(CCN1CCNC(=O)C2=CC3=C(C=C2)NC(=O)O3)C4=CN=C(N=C4)NC5CC6=CC=CC=C6C5 NEAPKZHDYMQZCB-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 125000002511 behenyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- MRNZSTMRDWRNNR-UHFFFAOYSA-N bis(hexamethylene)triamine Chemical compound NCCCCCCNCCCCCCN MRNZSTMRDWRNNR-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 150000003841 chloride salts Chemical class 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 229920003244 diene elastomer Polymers 0.000 description 1
- AGDANEVFLMAYGL-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCCCCCCCCCC(O)=O AGDANEVFLMAYGL-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- QHZOMAXECYYXGP-UHFFFAOYSA-N ethene;prop-2-enoic acid Chemical compound C=C.OC(=O)C=C QHZOMAXECYYXGP-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N ethyl ethylene Natural products CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000002421 finishing Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 235000019256 formaldehyde Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000000755 henicosyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- KYYWBEYKBLQSFW-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCCCC(O)=O KYYWBEYKBLQSFW-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- GKQPCPXONLDCMU-CCEZHUSRSA-N lacidipine Chemical compound CCOC(=O)C1=C(C)NC(C)=C(C(=O)OCC)C1C1=CC=CC=C1\C=C\C(=O)OC(C)(C)C GKQPCPXONLDCMU-CCEZHUSRSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- LSHROXHEILXKHM-UHFFFAOYSA-N n'-[2-[2-[2-(2-aminoethylamino)ethylamino]ethylamino]ethyl]ethane-1,2-diamine Chemical compound NCCNCCNCCNCCNCCN LSHROXHEILXKHM-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- RQFLGKYCYMMRMC-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCCCCCC(O)=O RQFLGKYCYMMRMC-UHFFFAOYSA-N 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 229920006114 semi-crystalline semi-aromatic polyamide Polymers 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229960001124 trientine Drugs 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/20—Carboxylic acid amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/21—Urea; Derivatives thereof, e.g. biuret
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【0001】本発明は、加工性を改良したポリアミド成
型材料、その製造法、成型品、シート製品、繊維及び複
合材料の製造におけるその利用ならびにこの成型材料か
ら製造した成型品、シート製品、繊維、半製品、複合材
料及び他の製品に関する。本発明は、成形材料に大きく
向上した流動性を付与する少量の特定のアミド及び/又
は尿素類を使用することを特徴としている。The present invention relates to a polyamide molding material with improved processability, a method for producing the same, its use in the production of molded products, sheet products, fibers and composite materials, and molded products, sheet products, fibers and composite materials manufactured from this molding material. Regarding semi-finished products, composite materials and other products. The invention is characterized by the use of small amounts of specific amides and/or ureas which impart significantly improved flow properties to the molding composition.
【0002】射出成型による熱可塑性樹脂の加工には、
溶融粘度が十分低いこと及び離型性が良いこと、ならび
に、部分的結晶性熱可塑性樹脂の場合は、結晶化速度の
制御が最も重要である。溶融粘度が高すぎると型の正確
な複製を得るのが非常に困難であるか又は不可能でさえ
ある。離型性が悪いと、型から取り出す過程で成型品が
型に粘着するか又は歪む可能性もある。結晶化を制御し
ていないと、例えば型を完全に満たす前に結晶化が始ま
り、最終製品機械的特性の表面の質を損なう結果となる
。従って熱可塑性樹脂の加工には、加工性に影響する溶
融粘度、離型性及び結晶化を制御できるということが非
常に重要である。[0002] Processing of thermoplastic resin by injection molding includes:
Sufficiently low melt viscosity and good mold release properties, and in the case of partially crystalline thermoplastic resins, control of the crystallization rate are most important. If the melt viscosity is too high, it is very difficult or even impossible to obtain an accurate reproduction of the mold. If the mold release properties are poor, the molded product may stick to the mold or become distorted during the process of being removed from the mold. Uncontrolled crystallization can, for example, begin before the mold is completely filled, resulting in a loss of surface quality and mechanical properties of the final product. Therefore, in processing thermoplastic resins, it is very important to be able to control melt viscosity, mold release properties, and crystallization, which affect processability.
【0003】ポリアミド(PA)は長い間実際の多くの
用途に満足なものとされ、種々の方法により製造するこ
とができ、広い範囲で異なるポリアミド形成単位から合
成でき、特別な用途のためには単独で仕上げることもで
き、又は特性を特別に組み合わせた素材の製造のために
加工助剤、ポリマ−アロイ成分及び無機強化材(例えば
充填剤又はガラス繊維)と組み合わせて仕上げることも
できる種類のポリマ−である。このようにポリアミドは
、繊維、合成樹脂成型品及びシート製品の製造に大量に
使用され、又例えばホットメルト接着剤として及び多く
の技術的応用における助剤として使用される。Polyamides (PA) have long been found to be satisfactory for many practical applications, can be produced by various methods, can be synthesized from a wide range of different polyamide-forming units, and for special applications can be Types of polymers that can be finished alone or in combination with processing aids, polymer alloy components and inorganic reinforcements (e.g. fillers or glass fibers) to produce materials with special combinations of properties. − is. Polyamides are thus used in large quantities in the production of fibers, plastic moldings and sheet products, and are also used, for example, as hotmelt adhesives and as auxiliaries in many technological applications.
【0004】一般に強化をしていない従来の種類の射出
成型材料は、十分容易に流動するが、強化材料及び/又
はアロイ中で流動性は非常に減少する。強化ポリアミド
及びポリアミドアロイは、特に有利な機械的特性を持つ
ので、これは特に重大な欠点である。この流動性の減少
は、ポリアミド成型材料の利用を制限する。従ってこの
欠点を克服することが望まれている。[0004] Conventional types of injection molding materials, which are generally unreinforced, flow quite easily, but in reinforced materials and/or alloys the flowability is greatly reduced. This is a particularly serious disadvantage since reinforced polyamides and polyamide alloys have particularly advantageous mechanical properties. This reduced flowability limits the use of polyamide molding materials. Therefore, it is desired to overcome this drawback.
【0005】ポリアミドのための離型剤は公知であり、
例えばシリコーン油、ステアリン酸及びそのカルシウム
又は亜鉛塩(Kunststoffe 47, 389
(1957))、長鎖脂肪族エステル(DAS 1
081 218)、脂肪族アルコ−ル(Kunstst
off−Handbuch 巻VI、Polyamid
e,出版 Carl Hanser Verlag,
Munich 1966)である。これらはすべて、例
えば効果が不十分である、又は大量に使用するとひどい
不相溶性を示す、又は分子量を減少させる、あるいは材
料中への混入が困難になる(液体添加)などの、欠点を
現わす。Mold release agents for polyamides are known;
For example silicone oil, stearic acid and its calcium or zinc salts (Kunststoffe 47, 389
(1957)), long chain aliphatic esters (DAS 1
081 218), aliphatic alcohols (Kunstst
off-Handbuch Volume VI, Polyamide
e, published by Carl Hanser Verlag,
Munich 1966). All of these exhibit drawbacks, such as insufficient efficacy or severe incompatibility when used in large quantities, or a reduction in molecular weight or difficulty in incorporation into the material (liquid addition). Was.
【0006】従って、非常に流動性の良いポリアミド成
型材料が要求されている。[0006]Therefore, there is a need for polyamide molding materials with very good fluidity.
【0007】ここで、少量の特定のアミド及び/又は尿
素類を含むポリアミド成型材料は、上記の欠点のいずれ
も伴わずに、流動性が大きく改良されることを見いだし
た。従って本発明は、流動性の良い新規ポリアミド成型
材料において、
A)85−99.9重量%の自体公知のポリアミド、B
)一般式(I)−(IV)It has now been found that polyamide molding materials containing small amounts of certain amides and/or ureas have greatly improved flow properties without any of the above-mentioned disadvantages. Therefore, the present invention provides a novel polyamide molding material with good fluidity, comprising: A) 85-99.9% by weight of a polyamide known per se;
) General formula (I)-(IV)
【0008】[0008]
【化3】[Chemical formula 3]
【0009】ここでR1は、互いに独立して、炭素数が
少なくとも5、好ましくは少なくとも10の(アリ−ル
)脂肪族炭化水素であり、R2は、互いに独立して、水
素又は式(V)及び(VI)[0009] Here, R1 are independently of each other an (aryl)aliphatic hydrocarbon having at least 5, preferably at least 10 carbon atoms, and R2 are independently of each other hydrogen or a group of formula (V) and (VI)
【0010】0010
【化4】[C4]
【0011】に対応する基であり、水素が好ましく、R
3及びR4は、互いに独立して、炭素数が2−10で複
素原子を含んでいても良く、直鎖又は分枝鎖状、開鎖又
は環状、脂肪族又は芳香族が可能な二価の炭化水素であ
り、炭素数が2−6のアルキレン基が好ましく、特にR
3の場合は、C2H4及びR4の場合はC4H8が好ま
しく、mは、1−50、好ましくは1−10、最も好ま
しくは3−10の値の整数であり、nは、式(II)及
び(IV)の化合物がベ−スとするポリアミドアミンの
平均分子量(Mn)が少なくとも500、好ましくは少
なくとも1000であり、50,000g/mol−1
以上ではないように選んだ整数であり、式(II)及び
(IV)に対応する添加物はどのような末端基(例えば
アミン又はカルボキシル)を持つことも可能である、に
対応するアミド及び/又は尿素0.1−15重量%、及
び任意にC)A)及びB)の合計に対して200重量%
までの慣用の添加剤を含むことを特徴とするポリアミド
成型材料に関する。A group corresponding to R
3 and R4 are, independently of each other, divalent carbon atoms having 2 to 10 carbon atoms, which may contain heteroatoms, and which can be linear or branched, open chain or cyclic, aliphatic or aromatic. Hydrogen, preferably an alkylene group having 2-6 carbon atoms, especially R
In the case of 3, C2H4 and in the case of R4, C4H8 is preferred, m is an integer with a value of 1-50, preferably 1-10, most preferably 3-10, and n is a formula (II) and ( The average molecular weight (Mn) of the polyamidoamine on which the compound IV) is based is at least 500, preferably at least 1000, and 50,000 g/mol-1
an integer chosen such that the additives corresponding to formulas (II) and (IV) can have any terminal group (e.g. amine or carboxyl); or 0.1-15% by weight of urea, and optionally C) 200% by weight relative to the sum of A) and B)
The present invention relates to polyamide molding materials, characterized in that they contain the customary additives up to.
【0012】本発明は又、新規ポリアミド成型材料の製
造法及び成型品、シート製品、繊維、半製品、複合材料
及び他の製品の製造におけるその利用に関する。The invention also relates to a method for producing the new polyamide molding material and its use in the production of molded articles, sheet products, fibers, semi-finished products, composite materials and other products.
【0013】式(I)−(IV)の添加剤B)は、一般
式(VII)Additives B) of the formulas (I)-(IV) are of the general formula (VII)
【0014】[0014]
【化5】[C5]
【0015】に対応するポリアミン、又は一般式(VI
II)A polyamine corresponding to the general formula (VI
II)
【0016】[0016]
【化6】[C6]
【0017】に対応するポリアミドアミンから誘導する
。It is derived from a polyamidoamine corresponding to ##STR2##
【0018】この添加剤は、溶液状態又は無溶媒でポリ
アミン(VII)又はポリアミドアミン(VIII)の
、カルボン酸又はその誘導体、あるいは尿素形成化合物
、好ましくはイソシアネ−トとの反応により製造するこ
とができる。The additives can be prepared by reaction of polyamines (VII) or polyamidoamines (VIII) with carboxylic acids or derivatives thereof or with urea-forming compounds, preferably isocyanates, in solution or without solvent. can.
【0019】これらは、基本的に公知であるか、又は公
知の方法により製造できる。以下は、式(I)−(IV
)の化合物の特定の例である:These are essentially known or can be produced by known methods. The following formula (I)-(IV
) is a specific example of a compound:
【0020】[0020]
【化7】[C7]
【0021】[0021]
【化8】[Chemical formula 8]
【0022】[0022]
【化9】[Chemical formula 9]
【0023】式(I)−(IV)の添加剤B)は、原則
的にアミド又は尿素の製造に関して当業者に知られた任
意の方法で製造することができる。Additives B) of the formulas (I) to (IV) can be prepared in principle by any method known to the person skilled in the art for the preparation of amides or ureas.
【0024】式(I)及び(II)の添加剤は、式(V
II)又は(VIII)の対応するポリアミンからカル
ボン酸及び任意に慣用の触媒を用いた、無溶媒でのアミ
ド化により製造するのが好ましい。各添加剤により約1
60℃−約280℃の温度が適している。式(I)及び
(II)の添加剤は、その酸の一部、好ましくは50モ
ル%以下、特に25モル%以下を、アミドの代わりにポ
リアミンと酸との塩の形で含むことができる。酸の混合
物も使用できる。炭素数が6以下のカルボン酸又はカル
ボン酸誘導体、例えば酢酸も部分的に使用できるが、カ
ルボン酸残基R1が主でなければならない。Additives of formula (I) and (II) are of formula (V
Preference is given to preparing them from the corresponding polyamines of II) or (VIII) by solvent-free amidation using carboxylic acids and optionally customary catalysts. Approximately 1 depending on each additive
Temperatures of 60°C to about 280°C are suitable. The additives of formulas (I) and (II) may contain a part of their acid, preferably up to 50 mol %, in particular up to 25 mol %, in the form of a salt of a polyamine with an acid instead of an amide. . Mixtures of acids can also be used. Carboxylic acids or carboxylic acid derivatives having up to 6 carbon atoms, such as acetic acid, can also be used in part, but the carboxylic acid residue R1 must predominate.
【0025】例えば化合物(I)の場合、ある酸が例え
ば1級アミノ基のアミド化に使用され、その後次の酸が
2級アミノ基のアミド化に使用される。For example, in the case of compound (I), one acid is used, for example, to amidate the primary amino group, and then the next acid is used to amidate the secondary amino group.
【0026】以下は基R1を誘導するのに適した酸の例
である:ラウリン酸、ミリスチン酸、ヘキサデカン酸(
パルミチン酸)、オクタデカン酸(ステアリン酸)及び
ドコサン酸(ベヘン酸)。これらは好ましい酸でもある
。The following are examples of acids suitable for deriving the group R1: lauric acid, myristic acid, hexadecanoic acid (
palmitic acid), octadecanoic acid (stearic acid) and docosanoic acid (behenic acid). These are also the preferred acids.
【0027】ジエチレン トリアミン及びその高級同
族体、ジプロピレン トリアミン及びビス−ヘキサメ
チレン トリアミンは、好ましいポリアミン(VII
)である。式(I)及び(II)の添加剤は、溶液中に
おけるカルボン酸又はその適した誘導体、例えば酸クロ
リドと式(VII)及び(VIII)の化合物の反応に
よっても製造できる。この反応を行う方法は公知である
。Diethylene triamine and its higher homologs, dipropylene triamine and bis-hexamethylene triamine are preferred polyamines (VII
). Additives of formulas (I) and (II) can also be prepared by reaction of compounds of formulas (VII) and (VIII) with carboxylic acids or suitable derivatives thereof, such as acid chlorides, in solution. Methods for carrying out this reaction are known.
【0028】式(I)及び(II)の添加剤は、小過剰
のカルボン酸及び/又はアミン基を含むことができる。
さらに、式(I)及び(II)の添加剤は、3級アミノ
基又はポリアミン(VII)から誘導した環をある割合
で(≦20%)含むこともできる。The additives of formulas (I) and (II) can contain a small excess of carboxylic acid and/or amine groups. Furthermore, the additives of formulas (I) and (II) can also contain a proportion (≦20%) of tertiary amino groups or rings derived from polyamines (VII).
【0029】式(III)及び(IV)の化合物は、式
(VII)及び(VIII)の化合物から、尿素−形成
反応物、好ましくはイソシアネ−トとの反応により製造
する。使用するイソシアネ−トは、酸R1−COOHに
対応するものでよい。反応は溶液で行うのが好ましい。
この反応の方法は公知である。Compounds of formula (III) and (IV) are prepared from compounds of formula (VII) and (VIII) by reaction with a urea-forming reactant, preferably an isocyanate. The isocyanate used may correspond to the acid R1-COOH. Preferably, the reaction is carried out in solution. Methods for this reaction are known.
【0030】式(VIII)のポリアミドアミンは、ジ
カルボン酸及びトリアミンの他に、他のポリアミド形成
単位、好ましくはカプロラクタムを含むことができる。
トリアミンは、部分的に又は完全に、より高級なポリア
ミンで置き換えることができる。式(VIII)の化合
物はアジピン酸とジエチレン トリアミンから、及び
任意にカプロラクタムを加えて製造するのが好ましい。The polyamide amines of formula (VIII) can contain, in addition to dicarboxylic acids and triamines, other polyamide-forming units, preferably caprolactam. Triamines can be partially or completely replaced by higher polyamines. Compounds of formula (VIII) are preferably prepared from adipic acid and diethylene triamine and optionally with the addition of caprolactam.
【0031】本発明に従い使用する添加剤の製造の例は
、実施例の項で知ることができる。添加剤の製造に関す
るさらなる詳細は、我々自身のこれまでに公開されてい
ない出願 P 3 921 259.9 (LeA
26 941)を参照されたい。Examples of the preparation of additives used according to the invention can be found in the Examples section. Further details regarding the manufacture of the additives can be found in our own previously unpublished application P 3 921 259.9 (LeA
26 941).
【0032】完成成型材料は、この添加剤を0.1−1
5重量%、好ましくは0.5−8重量%、最も好ましく
は1−5重量%の量で含む。The finished molding material contains this additive at a concentration of 0.1-1
5% by weight, preferably 0.5-8% by weight, most preferably 1-5% by weight.
【0033】本発明に従い使用する材料は、そのままで
公知であるか又は公知の方法で製造することができる。
これらは単一で又は何等かの混合物として使用すること
ができる。The materials used according to the invention are known as such or can be produced by known methods. These can be used alone or in any mixture.
【0034】式(I)−(IV)の化合物の他に、ポリ
アミド成型材料は、C)において定義した添加剤、例え
ば充填剤及び/又は強化材(ガラス繊維、ガラスビ−ズ
、アラミド繊維、炭素繊維、無機充填剤など)、可塑剤
、さらに流動性改良助剤、UV安定剤、酸化防止剤、顔
料、染料、離型剤、軟化防止剤、吸水性を減少させる添
加剤(好ましくはモノフェノ−ル、ビスフェノ−ルAな
どのビスフエノール及び(アルキル)フェノ−ル−ホル
ムアルデヒド ノボラック)、成核剤、結晶化促進剤
又は抑制剤及びポリマ−アロイ成分(例えば文献により
公知の耐衝撃性改良剤など)を含むことができる。これ
らは単独で又は濃縮物として使用することができる。In addition to the compounds of the formulas (I) to (IV), the polyamide molding material may contain additives as defined under C), such as fillers and/or reinforcing materials (glass fibers, glass beads, aramid fibers, carbon fibers, inorganic fillers, etc.), plasticizers, flowability improving aids, UV stabilizers, antioxidants, pigments, dyes, mold release agents, anti-softening agents, additives that reduce water absorption (preferably monophenol- nucleating agents, crystallization promoters or inhibitors, and polymer alloy components (e.g. impact modifiers known from the literature). ) can be included. These can be used alone or as concentrates.
【0035】さらに加える流動性改良助剤として適した
ものは、我々自身の非公開特許出願P 3 914 0
48.2 (LeA 26 824)に記載の低分子量
液晶添加剤である。Further suitable flow-improving aids are described in our own unpublished patent application P 3 914 0
48.2 (LeA 26 824).
【0036】以下は、適したポリマ−アロイ成分の例で
ある:アロイ成分又は改良剤として当業者に公知の種類
のジエン ゴム、アクリレ−ト ゴム、ポリエチレ
ン、ポリプロピレン、エチレン/プロピレン コポリ
マ−、エチレン/1−ブテン コポリマ−、エチレン
/プロピレン/ジエン 3元ポリマ−、エチレン/ア
クリル酸/アクリル酸エステル 3元ポリマ−、エチ
レン/ビニル アセテ−ト コポリマ−、ポリオク
テニレン、ポリスチレン、(α−メチル)−スチレン/
(メタ)アクリロニトリル コポリマ−、(メタ)ア
クルロニトリル/ブタジエン/(α−メチル)スチレン
ポリマ−(ABS)、耐衝撃性ポリスチレン、ポリ
カ−ボネ−ト、芳香族ポリエステル(カ−ボネ−ト)、
ポリエチレン テレフタレ−トのようなポリエステル
、ポリスルホン、ポリフェニレン オキシド、ポリエ
−テル ケトン、ポリエ−テル エ−テル ケト
ン、ポリアミドアミド、ポリエ−テル スルホン、ポ
リエ−テル イミド、ポリエステル イミド及びポ
リイミド。必要な場合、ポリマ− アロイは、2相の
部分的カップリングが起こるように少なくとも部分的に
、化学的修飾を行わねばならない。これは例えばエチレ
ン及び/又はプロピレンと少量のアクリル酸のコポリマ
−、又は少量の無水マレイン酸をグラフトしたエチレン
/プロピレン(ジエン)ポリマ−、あるいは少量の無水
マレイン酸をグラフトしたポリフェニレン オキシド
を、単独で又は非修飾アロイ成分との混合物として使用
することにより行うことができる。カップリングはエス
テル又はエポキシド基を経ても起こり得る。さらにカッ
プリングは、例えば相溶性を与える適した低分子量又は
ポリマ−試薬を存在させることにより行うことができ、
例えばアクリロニトリル/スチレン/アクリル酸三元ポ
リマ−を、ABSを含むアロイにおける相溶性付与剤と
して使用することができる。アロイ成分は又、ポリアミ
ドと反応する活性末端基、例えばアミノ末端又はカルボ
キシル末端ポリジエン ゴムを含むこともできる。The following are examples of suitable polymer alloy components: diene rubbers, acrylate rubbers, polyethylene, polypropylene, ethylene/propylene copolymers, ethylene/ 1-butene copolymer, ethylene/propylene/diene terpolymer, ethylene/acrylic acid/acrylic acid ester terpolymer, ethylene/vinyl acetate copolymer, polyoctenylene, polystyrene, (α-methyl)-styrene/
(meth)acrylonitrile copolymer, (meth)acrylonitrile/butadiene/(α-methyl)styrene polymer (ABS), high-impact polystyrene, polycarbonate, aromatic polyester (carbonate),
Polyesters such as polyethylene terephthalate, polysulfones, polyphenylene oxides, polyether ketones, polyether ether ketones, polyamide amides, polyether sulfones, polyether imides, polyester imides and polyimides. If necessary, the polymer alloy must be chemically modified, at least in part, so that partial coupling of the two phases occurs. This can be done, for example, by copolymers of ethylene and/or propylene with small amounts of acrylic acid, or ethylene/propylene (diene) polymers grafted with small amounts of maleic anhydride, or polyphenylene oxides grafted with small amounts of maleic anhydride. Alternatively, it can be carried out by using it as a mixture with an unmodified alloy component. Coupling can also occur via ester or epoxide groups. Additionally, coupling can be effected, for example, by the presence of suitable low molecular weight or polymeric reagents that provide compatibility;
For example, an acrylonitrile/styrene/acrylic acid terpolymer can be used as a compatibility agent in alloys containing ABS. The alloy component can also contain active end groups that react with the polyamide, such as amino-terminated or carboxyl-terminated polydiene rubbers.
【0037】ゴムは又、コア/シ−ス構造にグラフトさ
せることもできる。Rubber can also be grafted onto the core/sheath structure.
【0038】ポリアミドと他のポリマ−及び/又はアロ
イ成分との混合物、例えばPA 66、ポリフェニレ
ン オキシド及び耐衝撃性ポリスチレンのアロイ、又
はPA 66、芳香族ポリエステル及び耐衝撃性改良
剤のアロイ、又はポリアミド 6、(メタ)アクリロ
ニトリル/(α−メチル)−スチレン コポリマ−及
び文献により耐衝撃性改良剤として記述されているポリ
ブタジエン−あるいはアクリレ−ト−グラフト ゴム
のアロイは、本発明に従い製造することができる。Mixtures of polyamides with other polymers and/or alloy components, such as PA 66, an alloy of polyphenylene oxide and high-impact polystyrene, or an alloy of PA 66, an aromatic polyester and an impact modifier, or a polyamide. 6. (Meth)acrylonitrile/(α-methyl)-styrene copolymers and polybutadiene- or acrylate-graft rubber alloys described in the literature as impact modifiers can be prepared according to the present invention. .
【0039】本発明により使用するポリアミドと相溶性
及び/又は非相溶性の非晶質ポリアミドも添加剤として
使用できる。例えば、PA 6 I(ポリヘキサメ
チレンイソフタルアミド)又はイソフタル酸、テレフタ
ル酸、ヘキサメチレンジアミン及び任意に4,4’−ジ
アミノ ジシクロヘキシル メタンのポリアミドも
非晶質ポリアミドとして使用できる。Amorphous polyamides which are compatible and/or incompatible with the polyamides used according to the invention can also be used as additives. For example, PA 6 I (polyhexamethylene isophthalamide) or polyamides of isophthalic acid, terephthalic acid, hexamethylene diamine and optionally 4,4'-diamino dicyclohexyl methane can also be used as amorphous polyamides.
【0040】本発明に従い使用するポリアミドの他に、
他のポリマ−を含む混合物及び/又はアロイにおいて、
本発明に従い使用するポリアミド(例えばPA 66
及びそのコポリアミド)の割合は約40重量%以下であ
ってはならず、好ましくは約50重量%以下であっては
ならない。In addition to the polyamides used according to the invention,
In mixtures and/or alloys containing other polymers,
The polyamide used according to the invention (for example PA 66
and copolyamides thereof) should not be less than about 40% by weight, preferably not more than about 50% by weight.
【0041】好ましいアロイ成分は、常温及び/又は乾
燥状態で耐衝撃性を増すために従来使用されてきたもの
(耐衝撃性改良剤)及びガラス転移温度が少なくとも9
0℃、好ましくは少なくとも120℃、最も好ましくは
140℃以上の非晶質熱可塑性樹脂である。Preferred alloy components are those conventionally used to increase impact resistance at room temperature and/or in a dry state (impact modifiers) and those having a glass transition temperature of at least 9.
It is an amorphous thermoplastic resin having a temperature of 0°C, preferably at least 120°C, most preferably 140°C or higher.
【0042】部分的結晶及び非晶質ポリアミド又はその
混合物は、本発明のポリアミドAとして適している。P
A 6,66,6T/6,610,1212,11,
12及び46ならびにPA 6及びPA 66を基
にするコポリアミドが好ましい。PA 6 及び
66 及びその混合物ならびにPA 6 及び
66を基とするコポリアミドが特に好ましい。Partially crystalline and amorphous polyamides or mixtures thereof are suitable as polyamide A according to the invention. P
A 6,66,6T/6,610,1212,11,
Preference is given to copolyamides based on 12 and 46 as well as PA 6 and PA 66. PA 6 and
66 and mixtures thereof and copolyamides based on PA 6 and 66 are particularly preferred.
【0043】本発明のポリアミド成型材料の製造は、溶
媒を含まない成分を、好ましくは混練機又は押し出し機
中で混合することにより行う。この場合、熱可塑性樹脂
の混合に従来使用されているどのような方法も使用でき
る。The polyamide molding composition according to the invention is produced by mixing the solvent-free components, preferably in a kneader or extruder. In this case, any method conventionally used for mixing thermoplastics can be used.
【0044】本発明のポリアミド成型材料は、例えば射
出成型、押し出し成型、引抜き、成型、フィルム堆積な
どにより仕上げ、成型品、シート製品、繊維、半製品、
複合材料などを製造することができる。これらの製品も
本発明の主題である。The polyamide molding material of the present invention can be finished by injection molding, extrusion molding, pultrusion, molding, film deposition, etc., and can be used to produce molded products, sheet products, fibers, semi-finished products, etc.
Composite materials etc. can be manufactured. These products are also the subject of the present invention.
【0045】本発明のポリアミド成型材料は、非常に向
上した流動性を有する。The polyamide molding materials of the invention have significantly improved flow properties.
【0046】本発明に従い使用する添加剤B)が高分子
量であるため、本発明のポリアミド成型材料は揮発性で
はない。これらは一般に固体であり、そのため添加しや
すい。従ってこれらは技術の状態の価値ある豊富化とな
っている。Due to the high molecular weight of the additive B) used according to the invention, the polyamide molding compositions according to the invention are not volatile. These are generally solids and therefore easy to add. These have therefore become a valuable enrichment of the state of the art.
【0047】以下の例では一般的な出発物質を一般的な
量で使用しており、本発明を説明するためのものであっ
て制限するものではない。The following examples employ common starting materials in typical amounts and are intended to be illustrative of the invention and not limiting.
【0048】ηrelは25℃にてm−クレゾ−ル中の
1%溶液について測定した。他に指示がなければ、パ−
セントは重量パ−セントである。ηrel was determined on a 1% solution in m-cresol at 25°C. Unless otherwise instructed, the part
Cents are percentages by weight.
【0049】[0049]
【実施例1】無溶媒アミド化によるN,N’,N’’−
トリス−ステアロイル−ジエチレン トリアミン
3の製造(本発明による使用のため)154.5gのジ
エチレン トリアミン、1280gのステアリン酸及
び0.3gのトリフェニル ホスファイトを窒素下、
180−220℃にて1時間、その後260℃にて4.
5時間撹拌した。冷却後、反応混合物をトルエンから再
結晶した。
1165gの黄色結晶が得られ、流動点は103−10
5℃であった。塩基性窒素の含有量は0.11%であり
、カルボキシル基含有量は0.27%であった。[Example 1] N, N', N''- by solvent-free amidation
Tris-stearoyl-diethylene triamine
Preparation of 3 (for use according to the invention) 154.5 g of diethylene triamine, 1280 g of stearic acid and 0.3 g of triphenyl phosphite under nitrogen
1 hour at 180-220°C, then 4. at 260°C.
Stirred for 5 hours. After cooling, the reaction mixture was recrystallized from toluene. 1165 g of yellow crystals were obtained with a pour point of 103-10
The temperature was 5°C. The basic nitrogen content was 0.11%, and the carboxyl group content was 0.27%.
【0050】[0050]
【実施例2】無溶媒をアミド化によりステアリン酸を用
いて基本的に完全にアミド化したポリアミン 7の製
造(本発明による使用のため)テトラエチレンペンタミ
ン及びペンタエチレン ヘキサミンを主成分とするポ
リエチレン−ポリアミン混合物(ポリアミン B,B
ayer AGの製品)25g、156gのステアリ
ン酸及び0.1gのトリフェニル ホスファイトを、
実施例1に記載のとうりに180−220℃(1時間)
及び260℃(5時間)にて反応させた。トルエンから
再結晶後、融点90−101℃の明褐色の結晶110g
を得た。塩基性窒素の含有量は0.56%であり、カル
ボキシル基含有量は0.27%であった。Example 2 Preparation of essentially fully amidated polyamine 7 using stearic acid by solvent-free amidation (for use according to the invention) Polyethylene based on tetraethylene pentamine and pentaethylene hexamine -Polyamine mixture (polyamine B, B
ayer AG product) 25 g, 156 g stearic acid and 0.1 g triphenyl phosphite,
180-220°C (1 hour) as described in Example 1
and 260°C (5 hours). 110 g of light brown crystals with a melting point of 90-101°C after recrystallization from toluene
I got it. The basic nitrogen content was 0.56% and the carboxyl group content was 0.27%.
【0051】[0051]
【実施例3−5】及び[Example 3-5] and
【比較例1】実施例1によるアミドをポリアミド 6
の顆粒(ηrelは約4.0)と共に種々の温度にてZ
SK 53−2軸押し出し機を通して押し出した。押
し出し量は30kg h−1であった。[Comparative Example 1] The amide according to Example 1 was converted into polyamide 6
Z at various temperatures with the granules (ηrel is about 4.0)
Extruded through an SK 53-twin screw extruder. The extrusion amount was 30 kg h-1.
【0052】流動性の向上を押し出し機のエネルギ−消
費量から決定した。The improvement in flowability was determined from the extruder energy consumption.
【0053】[0053]
【実施例6−9】及び[Example 6-9] and
【比較例2】実施例3−5で使用したPA 6の顆粒
を、実施例1で製造したトリアミド3及びトリエチレン
テトラミン、ステアリン酸及び少量の酢酸を基にす
るアミド(Persoftal UK,Bayer
AGの製品)と共に前記のとうりに270℃にて押し
出した。Comparative Example 2 The PA 6 granules used in Examples 3-5 were mixed with triamide 3 prepared in Example 1 and an amide based on triethylene tetramine, stearic acid and a small amount of acetic acid (Persoftal UK, Bayer).
AG product) at 270° C. as described above.
【0054】エネルギ−消費量を表1に示す。Table 1 shows the energy consumption.
【0055】[0055]
【表1】[Table 1]
【0056】[0056]
【実施例10−13】及び[Example 10-13] and
【比較例3】同様の材料を高分子量PA 6(ηre
lは約5)と共に、実施例6−9に関して記載した方法
により押し出した(押し出し量:24kgh−1)。[Comparative Example 3] The same material was made of high molecular weight PA 6 (ηre
l is about 5) and extruded by the method described in connection with Example 6-9 (extrusion amount: 24 kgh-1).
【0057】エネルギ−消費量に関するデ−タを表2に
示す。Data regarding energy consumption are shown in Table 2.
【0058】[0058]
【表2】[Table 2]
【0059】[0059]
【実施例14及び15】及び[Examples 14 and 15] and
【比較例4】低粘度PA 6(ηrel=2.9)を
前記実施例にて使用した材料と共に、実施例3−5に記
載した方法で押し出した。Comparative Example 4 Low viscosity PA 6 (ηrel=2.9) was extruded in the manner described in Examples 3-5 together with the materials used in the previous examples.
【0060】エネルギ−消費量に関するデ−タを表3に
示す。Table 3 shows data regarding energy consumption.
【0061】[0061]
【表3】[Table 3]
【0062】[0062]
【実施例16−19】及び[Example 16-19] and
【比較例5−7】並の粘度のPA 6(ηrel=3
.5)、アミド 3 及びポリフェノ−ル性化合物
をドライ混合し、実施例6−9で記載した方法により押
し出した(260℃)。[Comparative Example 5-7] PA 6 with average viscosity (ηrel=3
.. 5), amide 3 and polyphenolic compound were dry mixed and extruded (260°C) by the method described in Examples 6-9.
【0063】これらの試料及びアミド 3を用いない
試料のエネルギ−消費量のデ−タを表4に示す。Energy consumption data for these samples and for samples without amide 3 are shown in Table 4.
【0064】[0064]
【表4】
1) フェノ−ル−ホルムアルデヒド縮合物(フェノ
−ル:CH2O=1:0.78)
実施例が示すとうり、本発明に従って用いる添加物は非
常に有効な流動性改良剤であり、非常に少量でさえ効果
がある。[Table 4] 1) Phenol-formaldehyde condensate (phenol:CH2O=1:0.78) As the examples show, the additive used according to the invention is a very effective flow improver. , even very small doses are effective.
【0065】さらに表5に示すように、これらは結晶化
抑制剤として作用する。それにより成型品の表面を改良
することができる。Furthermore, as shown in Table 5, these act as crystallization inhibitors. Thereby, the surface of the molded product can be improved.
【0066】[0066]
【表5】1)
実施例 TS(℃) ΔHS(I/g
) TK(℃) ΔHK(g/g)─────
─────────────────────────
────── 19 214.0
55.5 163.5 54
.7比較例6 215.7 55.5
165.2 57.4比較例7
220.6 61.3
172.1 61.71)DSCにより決定
(加熱速度:20K min−1;冷却速度:40K
min−1)。[Table 5] 1) Example TS (°C) ΔHS (I/g
) TK (℃) ΔHK (g/g)──────
──────────────────────────
────── 19 214.0
55.5 163.5 54
.. 7 Comparative Example 6 215.7 55.5
165.2 57.4 Comparative Example 7
220.6 61.3
172.1 61.71) Determined by DSC (heating rate: 20K min-1; cooling rate: 40K
min-1).
【0067】[0067]
【実施例20】及び[Example 20] and
【比較例8】PA 66(ηrel=3.0)をガラ
ス繊維(配合物に対して30%)及び2%(配合物に対
して)の実施例2によるアミド(実施例20)、又は0
.3%(配合物に対して)のポリエチレン ワックス
(Hostalub WE 1,Hoechst
AGの製品)(比較例8)と配合した(ZSM 5
3)。Comparative Example 8 PA 66 (ηrel=3.0) was mixed with glass fiber (30% relative to the formulation) and 2% (based on the formulation) of the amide according to Example 2 (Example 20) or 0
.. 3% (based on the formulation) of polyethylene wax (Hostalub WE 1, Hoechst
AG product) (Comparative Example 8) and (ZSM 5
3).
【0068】機械的特性及び流れの長さを表6に示す。The mechanical properties and flow length are shown in Table 6.
【0069】[0069]
【表6】
実施例20
比較例8灰分(%)
28.8
28.3σR(mPa)
179
183εR(%)
3.0
3.17Ez(mPa)
9451
9407σB3.5(mPa)
257
258σB(mPa)
274
282EB(mPa)
8308
8269aK1)(KJ/m2)
10.7
10.9an1)(KJ/m2)
51.3
53.6−30℃
46.0
46.2HDT A(
℃) 254
253HDT B(℃
) >254
>253流れの長さ2)(cm)
(280℃)にて
74 58
1)ISO 180;aK:方法1A;an:方法1
c2)流動性の尺度。より高い値が良い流動性を示す。[Table 6]
Example 20
Comparative Example 8 Ash content (%)
28.8
28.3σR (mPa)
179
183εR (%)
3.0
3.17Ez (mPa)
9451
9407σB3.5 (mPa)
257
258σB (mPa)
274
282EB (mPa)
8308
8269aK1) (KJ/m2)
10.7
10.9an1) (KJ/m2)
51.3
53.6-30℃
46.0
46.2HDT A(
°C) 254
253HDT B(℃
) >254
>253 Flow length 2) (cm)
(280℃)
74 58
1) ISO 180; aK: Method 1A; an: Method 1
c2) Measure of liquidity. Higher values indicate better liquidity.
【0070】本発明の主たる特徴及び態様は以下のとう
りである。The main features and aspects of the present invention are as follows.
【0071】1.流動性の良いポリアミド成型材料にお
いて、
A)85−99.9重量%の自体公知のポリアミド、B
)一般式(I)−(IV)1. In the polyamide molding material with good fluidity, A) 85-99.9% by weight of a polyamide known per se, B
) General formula (I)-(IV)
【0072】[0072]
【化8】[Chemical formula 8]
【0073】ここで、R1は、互いに独立して、炭素数
が少なくとも5、好ましくは少なくとも10の(アリ−
ル)脂肪族炭化水素であり、R2は、互いに独立して、
水素又は式(V)及び(VI)Here, R1 independently represents an (aryl) group having at least 5 carbon atoms, preferably at least 10 carbon atoms.
R) is an aliphatic hydrocarbon, and R2 are independently of each other,
Hydrogen or formulas (V) and (VI)
【0074】[0074]
【化9】[Chemical formula 9]
【0075】に対応する残基であり、水素が好ましく、
R3及びR4は、互いに独立して、炭素数が2−10で
複素原子を含んでいても良く、直鎖又は分枝鎖状、開鎖
又は環状、脂肪族又は芳香族が可能な二価の炭化水素で
あり、炭素数が2−6のアルキレン基が好ましく、特に
R3の場合はC2H4、及びR4の場合はC4H8が好
ましく、mは、1−50、好ましくは1−10の値の整
数であり、nは、式(II)及び(IV)の化合物がベ
−スとするポリアミドアミンの平均分子量(Mn)が少
なくとも500、好ましくは少なくとも1000であり
、50,000g/mol−1以上ではないように選ん
だ整数であり、式(II)及び(IV)に対応する添加
物はどのような末端基(例えばアミン又はカルボキシル
)を持つことも可能である、に対応するアミド及び/又
は尿素0.1−15重量%、及び任意にC)A)及びB
)の合計に対して200重量%までの慣用の添加剤を含
むことを特徴とするポリアミド成型材料。A residue corresponding to [0075], preferably hydrogen,
R3 and R4 are independently bivalent carbon atoms having 2 to 10 carbon atoms, which may contain heteroatoms, and which can be linear or branched, open chain or cyclic, aliphatic or aromatic. Hydrogen, preferably an alkylene group having 2-6 carbon atoms, particularly preferably C2H4 for R3, and C4H8 for R4, m is an integer with a value of 1-50, preferably 1-10. , n is such that the average molecular weight (Mn) of the polyamidoamine on which the compounds of formulas (II) and (IV) are based is at least 500, preferably at least 1000, and not more than 50,000 g/mol-1. , and the additives corresponding to formulas (II) and (IV) can have any terminal group (e.g. amine or carboxyl). 1-15% by weight, and optionally C) A) and B
Polyamide molding materials, characterized in that they contain up to 200% by weight of customary additives, based on the total of
【0076】2.第1項に記載のポリアミド成型材料に
おいて、式(I)−(IV)に対応する化合物を好まし
くは0.5−8重量%、最も好ましくは1−5重量%の
量で使用することを特徴とするポリアミド成型材料3.
第1及び2項に記載のポリアミド成型材料において、中
でも化合物1−26を特に添加剤B)として使用するこ
とを特徴とするポリアミド成型材料。2. Polyamide molding material according to paragraph 1, characterized in that the compounds corresponding to formulas (I)-(IV) are used in an amount of preferably 0.5-8% by weight, most preferably 1-5% by weight. Polyamide molding material 3.
3. Polyamide molding material according to claims 1 and 2, characterized in that, in particular, compound 1-26 is used as additive B).
【0077】4.第1−3項に記載のポリアミド成型材
料において、式(I)−(III)に対応する化合物を
使用することが好ましく、式(I)において基R1が好
ましくは炭素数が少なくとも12の脂肪族基、特にC1
2H35、C15H31、C17H35、C20H41
、C21H43及びC22H45である化合物を単一で
又は混合物として使用することが最も好ましく、炭素数
が6以下の酸、例えばなかでも酢酸、も使用することが
できることを特徴とするポリアミド成型材料。4. In the polyamide molding material according to item 1-3, it is preferable to use compounds corresponding to the formulas (I) to (III), in which the group R1 in the formula (I) is preferably an aliphatic compound having at least 12 carbon atoms. groups, especially C1
2H35, C15H31, C17H35, C20H41
, C21H43 and C22H45, either singly or in mixtures, and acids having up to 6 carbon atoms, for example acetic acid, among others, can also be used.
【0078】5.第1−4項に記載のポリアミド成型材
料において、PA 6,PA 66又はそれらの混
合物及びPA 6又はPA 66を基にするコポリ
マ−の使用が特に好ましいことを特徴とするポリアミド
成型材料。5. Polyamide molding material according to paragraphs 1-4, characterized in that the use of PA 6, PA 66 or mixtures thereof and copolymers based on PA 6 or PA 66 is particularly preferred.
【0079】6.第1−4項に記載のポリアミド成型材
料において、添加剤C)として使用する物質が特に単一
又は混合物における、強化素材(ガラス繊維、無機充填
剤など)、ポリマ−アロイ成分(特に耐衝撃性改良剤)
、他の流動性改良剤、慣用の滑剤及び離型剤、顔料及び
染料、UV安定剤、酸化防止剤、吸水性の減少のための
フェノ−ル性化合物(特にビス−フェノ−ル及び(アル
キル)フェノ−ル−ホルムアルデヒド 縮合物)及び
難燃剤であることを特徴とするポリアミド成型材料。6. In the polyamide molding compositions according to paragraph 1-4, the substances used as additive C) are, in particular, single or in mixtures, reinforcing materials (glass fibers, inorganic fillers, etc.), polymer alloy components (in particular impact-resistant improver)
, other flow improvers, customary lubricants and mold release agents, pigments and dyes, UV stabilizers, antioxidants, phenolic compounds (especially bis-phenols and (alkyl) ) A polyamide molding material characterized in that it is a phenol-formaldehyde condensate) and a flame retardant.
【0080】7.高分子量ポリアミドに流動性改良剤を
添加して製造する流動性の良いポリアミド成型材料の製
造法において、溶媒を含まない1段階以上の段階でA)
85−99.9重量%の高分子量ポリアミドをB)第1
項に記載の一般式(I)−(IV)のアミド及び/又は
尿素0.1−15%に加え、任意にA)及びB)の合計
に対して200重量%までの従来の添加物C)を加える
ことを特徴とする方法。7. In a method for producing a polyamide molding material with good fluidity, which is produced by adding a fluidity improver to a high molecular weight polyamide, in one or more steps that do not contain a solvent A)
B) 85-99.9% by weight of high molecular weight polyamide
0.1-15% of amides of the general formulas (I)-(IV) and/or urea as described in Section 1 and optionally up to 200% by weight of conventional additives C, based on the sum of A) and B). ).
【0081】8.第1−6項に記載の流動性の良いポリ
アミド成型材料の、成型品、シート製品、繊維、半製品
、複合材料の製造及び射出成型、押し出し成型、引抜き
成型、フィルム堆積又は溶融物からの仕上げ法として公
知の他の方法による他の製品の製造における利用。8. Production of molded articles, sheet products, fibers, semi-finished products, composite materials and finishing from injection molding, extrusion molding, pultrusion, film deposition or melting of the polyamide molding materials with good flowability as described in paragraphs 1-6. Use in the manufacture of other products by other methods known as methods.
【0082】9.第1−6項に記載のポリアミド成型材
料の、成型品、シート製品、繊維、半製品、複合材料及
び他の製品。9. Molded articles, sheet products, fibers, semi-finished products, composite materials and other products of the polyamide molding materials according to paragraphs 1-6.
Claims (3)
いて、 A)85−99.9重量%のこれまでに公知のポリアミ
ド、 B)一般式(I)−(IV) 【化1】 ここでR1は、互いに独立して、炭素数が少なくとも5
、好ましくは少なくとも10の(アリ−ル)脂肪族炭化
水素であり、R2は、互いに独立して、水素又は式(V
)及び(VI) 【化2】 に対応する残基であり、水素が好ましく、R3及びR4
は、互いに独立して、炭素数が2−10で複素原子を含
んでいても良く、直鎖又は分枝鎖状、開鎖又は環状、脂
肪族又は芳香族が可能な二価の炭化水素であり、炭素数
が2−6のアルキレン基が好ましく、特にR3の場合は
C2H4、及びR4の場合はC4H8が好ましく、mは
、1−50、好ましくは1−10の値の整数であり、n
は、式(II)及び(IV)の化合物がベ−スとするポ
リアミドアミンの平均分子量(Mn)が少なくとも50
0、好ましくは少なくとも1000であり、50,00
0g/mol−1以上ではないように選んだ整数であり
、式(II)及び(IV)に対応する添加剤は任意の末
端基(例えばアミン又はカルボキシル)を持つこともで
きる、に対応するアミド及び/又はウレア0.1−15
重量%、及び任意にC)A)及びB)の合計に対して2
00重量%までの従来の添加剤を含むことを特徴とする
ポリアミド成型材料。Claim 1: A polyamide molding material with good fluidity, comprising: A) 85-99.9% by weight of a previously known polyamide; B) a general formula (I)-(IV) [Formula 1] where R1 is , independently of each other, the number of carbon atoms is at least 5
, preferably at least 10 (aryl)aliphatic hydrocarbons, R2 are independently of each other hydrogen or of the formula (V
) and (VI) are residues corresponding to [Formula 2], preferably hydrogen, and R3 and R4
are, independently of each other, divalent hydrocarbons having 2-10 carbon atoms, which may contain heteroatoms, and which may be linear or branched, open-chain or cyclic, aliphatic or aromatic. , an alkylene group having 2-6 carbon atoms is preferred, in particular C2H4 for R3 and C4H8 for R4, m is an integer with a value of 1-50, preferably 1-10, n
The polyamidoamine on which the compounds of formulas (II) and (IV) are based has an average molecular weight (Mn) of at least 50
0, preferably at least 1000, and 50,00
an integer chosen not to be greater than or equal to 0 g/mol-1, and the additives corresponding to formulas (II) and (IV) can also have any terminal group (e.g. amine or carboxyl). and/or urea 0.1-15
% by weight, and optionally C) 2 relative to the sum of A) and B)
Polyamide molding material characterized in that it contains up to 00% by weight of conventional additives.
において、中でも化合物1−26を特に添加剤B)とし
て使用するポリアミド成型材料。2. A polyamide molding material according to claim 1, in which compound 1-26 is used in particular as additive B).
添加して製造する流動性の良いポリアミド成型材料の製
造法において、無溶媒1段階以上の段階でA)85−9
9.9重量%の高分子量ポリアミドをB)請求項1に記
載の一般式(I)−(IV)のアミド及び/又は尿素0
.1−15%に加え、任意にA)及びB)の合計に対し
て200重量%までの慣用の添加剤C)を加えることを
特徴とする方法。Claim 3: In a method for producing a polyamide molding material with good fluidity, which is produced by adding a fluidity improver to a high molecular weight polyamide, in one or more solvent-free stages, A) 85-9
9.9% by weight of the high molecular weight polyamide and B) the amide and/or urea of general formula (I)-(IV) according to claim 1.
.. 1-15% and optionally up to 200% by weight, based on the sum of A) and B), of customary additives C).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4000626A DE4000626A1 (en) | 1990-01-11 | 1990-01-11 | POLYAMIDE MOLDS WITH IMPROVED PROCESSABILITY |
| DE4000626.3 | 1990-01-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04211452A true JPH04211452A (en) | 1992-08-03 |
Family
ID=6397881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3010376A Pending JPH04211452A (en) | 1990-01-11 | 1991-01-07 | Polyamide molding material with improved processability |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5071896A (en) |
| EP (1) | EP0436894A3 (en) |
| JP (1) | JPH04211452A (en) |
| DE (1) | DE4000626A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008520610A (en) * | 2004-11-19 | 2008-06-19 | グラクソ グループ リミテッド | Amide and peptide derivatives of tetraalkylenepentamine as transfection agents |
| JP2023108186A (en) * | 2022-01-25 | 2023-08-04 | Dic株式会社 | Additive for polyamide resin |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5280060A (en) * | 1990-08-02 | 1994-01-18 | Sumitomo Chemical Company, Limited | Thermoplastic resin composition containing a fluidity modifier |
| JP2956160B2 (en) * | 1990-08-02 | 1999-10-04 | 住友化学工業株式会社 | Thermoplastic resin composition |
| US6111001A (en) * | 1998-11-24 | 2000-08-29 | Ppg Industries Ohio, Inc. | Compositions containing rheology modifiers with functional group-containing polymers |
| KR20140144704A (en) * | 2012-03-20 | 2014-12-19 | 바스프 에스이 | Urea compounds for improving the solid state properties of polyamide resins |
| CN109280362B (en) * | 2018-09-20 | 2021-05-25 | 广州增城市大发塑胶颜料有限公司 | Thermoplastic polyurethane open master batch and application thereof |
| IT201900018551A1 (en) * | 2019-10-11 | 2021-04-11 | Nachmann S R L | USE OF AMIDES AS PLASTICANTS FOR POLYAMIDES |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3935161A (en) * | 1973-02-24 | 1976-01-27 | Basf Aktiengesellschaft | Process for stabilizing polyamides |
| DE2324689A1 (en) * | 1973-05-16 | 1974-12-05 | Bayer Ag | AGAINST YELLOWING STABILIZED ANTISTATIC POLYAMIDE COMPOUNDS |
| DE2964673D1 (en) * | 1978-10-27 | 1983-03-10 | Toray Industries | Highly rigid polyamide composition and a method for its manufacture |
| CA1202759A (en) * | 1982-06-29 | 1986-04-08 | Du Pont Canada Inc. | Nylon film with improved slip characteristics and process therefor |
| JPS60192765A (en) * | 1984-03-15 | 1985-10-01 | Mitsubishi Petrochem Co Ltd | Thermoplastic resin composition having improved moldability |
-
1990
- 1990-01-11 DE DE4000626A patent/DE4000626A1/en not_active Withdrawn
- 1990-12-20 EP EP19900124858 patent/EP0436894A3/en not_active Withdrawn
- 1990-12-24 US US07/632,536 patent/US5071896A/en not_active Expired - Fee Related
-
1991
- 1991-01-07 JP JP3010376A patent/JPH04211452A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008520610A (en) * | 2004-11-19 | 2008-06-19 | グラクソ グループ リミテッド | Amide and peptide derivatives of tetraalkylenepentamine as transfection agents |
| JP2023108186A (en) * | 2022-01-25 | 2023-08-04 | Dic株式会社 | Additive for polyamide resin |
Also Published As
| Publication number | Publication date |
|---|---|
| DE4000626A1 (en) | 1991-07-18 |
| US5071896A (en) | 1991-12-10 |
| EP0436894A3 (en) | 1992-10-28 |
| EP0436894A2 (en) | 1991-07-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5416172A (en) | Transparent polyamide compositions having high resistance to chemical agents | |
| US3729527A (en) | Thermoplastic polymer blends of polyamides and polyarylsulfones | |
| JPH05202288A (en) | Thermoplastic molding compound and its production | |
| EP0029566B1 (en) | Process for the production of a polyamide base resin composition | |
| JPH06504304A (en) | polyamide composition | |
| JPH02382B2 (en) | ||
| JPH02225561A (en) | Thermoplastic molding material | |
| EP0049103B2 (en) | Polymeric materials and thermoplastic resin compositions | |
| JPH08311199A (en) | Polyesteramide composition | |
| GB2194540A (en) | Impact-resistant polyamide alloys | |
| JPH04211452A (en) | Polyamide molding material with improved processability | |
| CA2000123A1 (en) | Ductile, blow moldable composition containing a styrene-maleimide copolymer bearing pendant carboxyl or hydroxyl groups | |
| US5128401A (en) | Polyamide molding compounds | |
| GB2058101A (en) | Thermoplastic nylon moulding resins | |
| JPS6332098B2 (en) | ||
| JPS62243647A (en) | Polyamide molding material | |
| JPS6153356A (en) | Polyphenylene sulfide resin composition | |
| US4891405A (en) | Moldable styrene-maleic anhydride/polybutylene terephthalate composition | |
| EP2426173B1 (en) | Wholly aromatic liquid crystal polyester resin compound having improved mould-release properties, and a production method therefor | |
| JP2695491B2 (en) | Polyamide / polyolefin resin composition | |
| JP2515915B2 (en) | Method for producing polyamide resin | |
| US5183852A (en) | Polyblends containing polyurethane, polymer and siloxane crosslinker | |
| JPS6086162A (en) | Polyamide resin composition | |
| JPH036262A (en) | Polyamide molding composition containing fine polyarylene sulfide | |
| JPS6086161A (en) | Polyamide resin composition |