JPH0422155A - Marking equipment for electronic device - Google Patents

Abstract

PURPOSE:To prevent the generation of marking irregularity and double marking, and restrain the decrease of marking quality, by reciprocating a marking head with one-half revolution between a marking ink supplying surface and an electronic device marking surface. CONSTITUTION:When a rack 34b2 and a pinion 38 are engaged with each other and a pulse motor 37 is operated, a printing type 39a of a marking head 39 comes into contact with an endless belt 24, and then revolves by half. Further, when a gear apparatus is made to ascend and the pulse motor is operated in the state that a rack 34b1 and the pinion 38 are engaged with each other, the printing type 39a of the marking head 39 comes into contact with the surface of a semiconductor device 28 to be marked, and then returns to the initial state after one-half revolution. Hence imperfect marking like double marking is not generated, and clear marking is enabled because the air in the recessed parts of a printing type is easily relieved.

Description

[Detailed Description of the Invention] [Summary] The purpose of this invention is to improve the printing quality and productivity of a completed electronic device marking device, and to improve the printing quality and productivity. A marking device for an electronic device that performs a required marking process, wherein at least a marking head whose printing type is attached to a curved surface forming a part of a cylinder is arranged in parallel with the diameter of the curved surface. The electronic device is configured to include means for rolling and reciprocating by half a rotation along the curved surface between the surface and the surface to be printed on the electronic device.

[Industrial application field]

The present invention relates to a stamping process for completed electronic devices, and particularly to a stamping apparatus for electronic devices that improves productivity by beautifully and reliably stamping even electronic devices with large print surfaces.

[Conventional technology]

FIG. 2 is a block diagram showing an example of the main parts of a conventional stamping device, and FIG. 3 is a diagram showing another example.

Note that in the figure, a case where the electronic device is a semiconductor device will be described.

In FIG. 2 illustrating the case of the curved surface offset method, the marking ink supply roller l has an ink kneading roller 2 that rotates in contact with each other, and the ink supply roller l
Stamping ink (hereinafter simply referred to as ink) that is constantly supplied to
3, the supply amount is limited by a supply plate 4 set close to the surface of the roller 1, and then the ink is supplied to the surface of the ink kneading roller 2 in a substantially uniform thickness.

Further, the type roller 5 to which the required printed type 5a is attached protruding from the surface is arranged so that the surface of the printed type 5a is in contact with the ink kneading roller 2,
Further, a marking roller 7, which rotates in conjunction with the printing type roller 5 by, for example, a chain mechanism 6, is arranged at such intervals that its surface just contacts the surface of the printing type 5a.

Therefore, the printing type 5a of the printing roller 5 supplied with ink from the ink mixing roller 2 can be directly transferred to the printing roller rough.

The stamping roller 7 is constructed so that its circumference is exactly an integral multiple of the circumference of the type roller 5. Therefore, an integral number of the same spots on the surface of the stamping roller 7 become the spots to be transferred and, in turn, the spots to be stamped.

On the other hand, a rubber roller 8 is disposed at a position corresponding to the stamping roller 7, and the semiconductor device 9 to be stamped is pushed out while being pressed from both sides while being sandwiched between the stamping roller 7 and the rubber roller 8. It is configured so that

The semiconductor devices 9 are supplied to the marking area by using a stopper that operates in synchronization with the rotation of the marking roller 7 to supply the semiconductor devices 9 to be stamped, which are aligned and stored on an inclined carrier 11 equipped with a stopper 10 that moves up and down. This is done by allowing the pieces to fall naturally one by one with the movement of step 10, and catching them at predetermined positions using the above-mentioned stamping roller 7 and rubber roller 8.

A marking device having such a configuration has the advantage of being inexpensive as it does not require a particularly complicated mechanism, and can print in any manner regardless of the size or minute irregularities of the marking area of the semiconductor device. There is an advantage that it can be done.

However, the location of the printing roller 7 where the printing is transferred from the type roller 5 is always the same as described above.

Therefore, as the number of times of transfer increases, the transfer area, that is, the area to be stamped onto the semiconductor device, becomes partially depressed, resulting in a deterioration in the quality of the stamp, such as inability to perform reliable stamping.

Furthermore, if there is any looseness in the chain mechanism 6, etc. that corresponds to the rotation between the type roller 5 and the stamping roller 7, a shift will occur in the transfer position of the type roller 7 from the type roller, resulting in the printed content. There is a drawback that a phenomenon of double stamping occurs where the two stamps overlap.

In FIG. 3 illustrating the planar direct method, a marking ink supply roller l equipped with a supply plate 4 and an ink mixing roller 2 are shown.
is equivalent to that explained in FIG.

The rubber idler 16, which is held by a holding shaft 15 in contact with or away from the ink mixing roller 2, is movable, for example, in the horizontal direction by the holding shaft 15, which is connected to a mechanism (not shown). It has become.

Therefore, when the stamping ink 3 is supplied to the stamping ink supply roller l as explained in FIG. 2 while the rubber idler 16 is in contact with the ink kneading roller 2, the supply plate 4
The marking ink 3, whose supply amount is limited, is supplied to the surface of the rubber idler 16 via the ink kneading roller 2 to a thickness similar to that of the rubber idler 16.

On the other hand, at a predetermined position within the movement range of the rubber idler 16,
For example, type 1 that protrudes from the bottom? A stamping jig 17 to which a is attached is arranged so as to be movable up and down, and a carrier 18 on which a semiconductor device to be stamped is set is placed at a corresponding position below the stamping jig 7. is located.

Therefore, when the holding shaft 15 is reciprocated as shown by the arrow a after supplying the stamp ink to the rubber idler 16 in the above-described manner, the stamp ink is supplied to the type 17a of the stamp jig 17 at the position already indicated by the broken line, for example. be able to.

By lowering the marking jig 17 in the direction of arrow C, a desired mark can be applied to the surface of the semiconductor device 9 at the corresponding position.

A stamping device having such a configuration can be constructed at a low cost as in the case shown in FIG. 2, and has the advantage that the quality of stamping does not deteriorate even after long-term use (and there is no occurrence of double stamping).

However, since the surface of the typeface 17a is flat, if the flatness of the surface to be stamped is poor, uneven marking will occur, and if the stamping area is wide, it will be difficult to apply a --like stamp over the entire area, resulting in There is a drawback that the quality of the seal tends to deteriorate.

[Problem to be solved by the invention]

Conventional marking devices have problems in that, in the case of the curved surface offset method, the marking quality deteriorates as the number of markings increases, and the phenomenon of double marking tends to occur, and in the case of the flat surface direct method, There is a problem in that if the flatness of the surface is poor, uneven printing is likely to occur, and if the printing area is wide, the printing quality is likely to deteriorate.

[Means to solve the problem]

The above-mentioned problem is a marking device for an electronic device that performs a required marking process on the flat stamping surface of an electronic device that is stationary on a carrier, and the curved surface that constitutes a part of the cylinder is used as the attachment surface of the printing type. An electronic device comprising at least means for rolling and reciprocating half a rotation along the curved surface between a printing ink supply surface and a printing surface of the electronic device, which are arranged in parallel with the diameter of the curved surface as an interval. This is solved by the printing device.

[For production]

By taking advantage of the respective merits of the curved surface offset method and the planar direct method described above, it is possible to prevent uneven printing and double marking, and to suppress deterioration in printing quality.

In the present invention, by making the marking head equipped with a curved surface for adhering printed characters rotationally movable so that the curved surface sequentially contacts the surface of an electronic device, the curved surface direct contact which has the features of both of the above methods is achieved. The system constitutes a stamping device.

Therefore, even electronic devices with large print surfaces can be beautifully and reliably stamped.

〔Example〕

FIG. 1 is a diagram showing an example of the configuration of the main parts of a stamping device that implements the present invention.

Note that the figure assumes that the electronic differential chair is a semiconductor device as in FIG. 3.

In FIG. 1, the marking ink supply roller 21 has an ink mixing roller 22 that rotates in contact with each other.
Stamping ink 3 constantly supplied to the ink supply roller 21
The amount of ink to be supplied is limited by a supply plate 23 set close to the surface of the roller 21, and then the ink is supplied to the surface of the ink kneading roller 22 in a substantially uniform thickness.

Further, 24 in the figure, which partially contacts the surface of the ink kneading roller 22, are two guide rollers 25a and 25b.
The belt 24 is an endless belt serving as a printing ink supply surface that constantly rotates in the same direction, and the belt 24 is tensioned by a tension roller 26.

Therefore, the surface of the endless belt 24, which is in constant contact with the ink kneading roller 22, has a constant thickness of ink 3 formed thereon, so that it can be used as a printing ink supply surface.

Further, at a predetermined position facing the surface of the endless belt 24, a carrier rail 27 is provided parallel to the surface of the heald 24.
A semiconductor device 28 to be stamped is placed on the carrier rail 27 by, for example, an extrusion arm (not shown).
is transferred continuously and intermittently.

On the other hand, a gear drive plate 31 having, for example, a vertical dovetail groove 31a is fixed to a predetermined position on the housing wall 30a of the stamping device 30 with screws 32, and another housing wall perpendicular to the housing wall 30a is A shaft 33 is fixed at a predetermined position of the housing wall 30b, with a key 33a embedded over its entire length orthogonally to the housing wall 30b.

Among these, the gear drive plate 31 is provided with a gear device 34 having a U-shape in side view and having a dovetail 34a on the back side that fits into the dovetail groove 31a. As shown in the figure a, it is mounted so that it can move up and down, and in particular, the up and down movement of the gear device 34 can be controlled by an air cylinder 35 that is provided in contact with the lower surface of the gear device 34.

Furthermore, racks 34b+ are provided at the tips of the upper and lower sides of the gear device 34 so as to face each other inwardly over the entire width thereof.
34bz is formed.

The other shaft 33, which is fixed to the housing wall 30b so as to pass through the inner pocket of the gear device 34 in the width direction, is provided with a key 33a that moves along the longitudinal direction (direction b) without rotating. A block 36 that can be used is attached,
Further, the block 36 has the racks 34tl+, 34
The rack 34b includes a pulse motor 37 having a pinion 38 fixed to a rotating shaft 37a, which fits into the rack 34b.

34b2, or in particular, the diameter of the pinion 38 in this case is smaller than the distance between the facing racks 34b+ and 34b2 of the gear device 34 (
Further, half of the circumference thereof is formed to be equal to the length of the racks 34bi and 34b.

Therefore, the pinion 38 can be engaged with either one side of the racks 34b1 and 34b2 by moving the gear device 34 up and down in the direction a, but for example, the pinion 38 is engaged with the rack 34b2 as shown in the figure. At times, the above-mentioned pulse motor 37 is operated to drive the pinion 38.
When the pinion 38 is rotated in the r1 direction, the pinion 38 and hence the block 36 rotates half a rotation while moving in the b1 direction in the figure, and when the above-mentioned pulse motor 37 is operated while the pinion 38 is engaged with the rack 34b, the The pinion 38 and thus the block 36 rotate half a rotation while moving in the opposite direction.

Further, on a shaft 38a projecting from the pinion 38 to the opposite side of the pulse motor 37, a fan-shaped marking head 39 having printed characters 39a projecting from the curved surface of the tip is fixed with its central axis aligned. .

Therefore, when the printed characters 39a of the marking head 39 face upward, for example, the printed characters 39a appear on the endless belt 2 mentioned above.
By arranging the endless belt 24 and the carrier rail 27 so that the printed characters 39a contact the surface of the semiconductor device 28 mentioned above when the printed characters 39a face down, A desired mark can be applied to the surface of the semiconductor device 28 to be marked.

That is, when the rack 34b2 and the pinion 38 are fitted together and the pulse motor 37 is operated, the printed characters 3 of the marking head 39 are
9a draws a locus shown by broken line C and once contacts the endless belt 24, it makes a half turn and is located at the position shown by d.

Furthermore, raise the gear device and connect the rack 34b1 and binon 3.
When the pulse motor 37 is operated with 8 fitted, the printed characters 39a- of the marking head 39 draw a locus shown by the broken line e, come into contact with the surface of the semiconductor device 28 to be marked, and then turn half a turn to return to the initial state shown in the figure. Returning to the stamped semiconductor device 2
A desired seal can be placed on the surface of 8.

Particularly in this case, the printed characters 39a attached to the curved surface of the marking head 39 are directly transferred onto the semiconductor device 28 to be marked.

Therefore, marking errors such as double marking do not occur, and at the same time, air in the valleys of the printed characters can escape easily, so that beautiful printing can be performed.

Furthermore, even if the stamping area is wide or the stamping area has some unevenness, reliable stamping can be performed.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to provide a printing apparatus for electronic devices that can print beautifully and reliably even on electronic devices with large print surfaces, and that improves productivity.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing an example of the configuration of the main parts of a stamping device that implements the present invention, FIG. 2 is a diagram showing an example of the construction of the main parts of a conventional stamping device, and FIG. 3 is a diagram showing another example. . In the figure, 3 is the stamping ink, 2I is the stamping ink supply roller, 22 is the ink mixing roller, 23 is the supply plate, 24 is the endless belt (the stamping rollers 25a and 25b are the kite rollers, 26 is the tension roller, 27 is the carrier rail, 28 is a semiconductor device to be stamped, 30 is a stamping device, 31 is a gear drive plate, 32 is a screw, 33a is a key 34 is a gear device, 36 is a block, 37a is a rotating shaft, 38a is a shaft, 39a is a typeface, respectively. 30a and 30b are the housing wall, 31a is the dovetail groove, 33 is the shaft, 34b+34b2 is the rack, 35 is the air cylinder, 37 is the pulse motor, 38 is the pinyon, 39 is the marking head, and the ink supply surface) Conventional sewing [ [The main part of the main part of the building is shown in Figure 2.

Claims (1)

[Claims] A marking device for an electronic device that performs a required marking process on a flat marking surface of an electronic device stationary on a carrier, wherein a curved surface forming a part of a cylinder is used as a printing type (39a). The marking head (39), which serves as the application surface of
) and the stamping surface of the electronic device (28), comprising means for rolling and reciprocating half a rotation along the curved surface between the stamping surface of the electronic device (28) and the stamping surface of the electronic device (28).