JPH0422335B2 - - Google Patents

Info

Publication number
JPH0422335B2
JPH0422335B2 JP59101436A JP10143684A JPH0422335B2 JP H0422335 B2 JPH0422335 B2 JP H0422335B2 JP 59101436 A JP59101436 A JP 59101436A JP 10143684 A JP10143684 A JP 10143684A JP H0422335 B2 JPH0422335 B2 JP H0422335B2
Authority
JP
Japan
Prior art keywords
semiconductor device
measuring
handling device
handling
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59101436A
Other languages
Japanese (ja)
Other versions
JPS60245142A (en
Inventor
Ryozo Fujiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP59101436A priority Critical patent/JPS60245142A/en
Publication of JPS60245142A publication Critical patent/JPS60245142A/en
Publication of JPH0422335B2 publication Critical patent/JPH0422335B2/ja
Granted legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置の検査装置に利用されるハ
ンドリング装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a handling device used in a semiconductor device inspection device.

〔従来技術〕[Prior art]

一般に半導体装置(トランジスタ・IC等)の
製造工程において、半導体装置の電気的特性を検
査する工程に使われる検査装置を大別すると測定
装置とハンドリング装置と区別できる。
In general, inspection equipment used in the process of testing the electrical characteristics of semiconductor devices in the manufacturing process of semiconductor devices (transistors, ICs, etc.) can be broadly classified into measuring equipment and handling equipment.

本発明は該ハンドリング装置の半導体装置を保
持して測定用コンタクタに接続させる測定部の構
成に関し、電気的測定における測定装置への障害
を防止できる構成を提供するものである。
The present invention relates to the configuration of a measuring section for holding a semiconductor device of the handling device and connecting it to a measuring contactor, and provides a configuration that can prevent damage to the measuring device during electrical measurements.

一般にハンドリング装置の測定部は第2図a,
bに示すように半導体装置1を移動させるシユー
ター2と、該半導体装置を測定装置のテストヘツ
ド3に取り付けた測定用のコンタクタ4へ電気的
に接続させる為の保持部5とから構成される。
Generally, the measuring part of the handling device is shown in Figure 2a,
As shown in FIG. 3B, it is composed of a shooter 2 for moving a semiconductor device 1, and a holding section 5 for electrically connecting the semiconductor device to a measurement contactor 4 attached to a test head 3 of a measuring device.

この様なハンドリング装置において、被測定用
半導体装置の電気的特性の測定を行なう時に、ハ
ンドリング装置に発生するハム・雑音等の障害信
号が、該ハンドリング装置の保持部5を介して該
被測定用半導体装置1へ誘導され、電気的特性の
測定に支障をきたす場合があつた。
In such a handling device, when measuring the electrical characteristics of a semiconductor device under test, interference signals such as hum and noise generated in the handling device are transmitted to the device under test via the holding section 5 of the handling device. In some cases, the particles were guided to the semiconductor device 1, causing trouble in measuring electrical characteristics.

特に低雑音・電気圧利得の小信号増幅用半導体
装置を測定する場合に安定した測定ができない問
題があつた。
In particular, when measuring semiconductor devices for small signal amplification with low noise and electric voltage gain, there was a problem that stable measurements could not be made.

〔発明の目的〕[Purpose of the invention]

本発明は従来の欠点を解消して、ハンドリング
装置内を移動する半導体装置の電気的特性を測定
する時に、電気的環境条件を測定装置で決定され
る構成としたものである。
The present invention solves the conventional drawbacks and provides a structure in which electrical environmental conditions are determined by a measuring device when measuring the electrical characteristics of a semiconductor device moving within a handling device.

〔発明の構成〕[Structure of the invention]

本発明は半導体装置を検査する検査装置に利用
されるハンドリング装置において、半導体装置を
保持して測定用コンタクタに挿入させる保持部を
導電体で構成し、該保持部をハンドリング装置の
筐体に電気的に絶縁させて取付け、該保持部を測
定装置と電気的に接続させるようにしたことを特
徴とする半導体装置用ハンドリング装置である。
The present invention provides a handling device used in an inspection device for testing semiconductor devices, in which a holding portion for holding a semiconductor device and inserting it into a measurement contactor is made of a conductive material, and the holding portion is connected to a housing of the handling device. This is a handling device for a semiconductor device, characterized in that the holding portion is electrically connected to a measuring device.

〔実施例〕〔Example〕

以下、本発明を第1図a,bに示す実施例にし
たがつて詳細に説明する。
Hereinafter, the present invention will be explained in detail according to the embodiment shown in FIGS. 1a and 1b.

本発明においては半導体装置1を移動させるシ
ユーター2の基本構造は第2図の従来例と実質的
に同じであり、測定装置のテストヘツド3とコン
タクタ4も実質的に同じである。本発明は、半導
体装置1を保持する部分5を誘導体で構成すると
ともに、該テストヘツド3に電極棒6を植設す
る。
In the present invention, the basic structure of the shooter 2 for moving the semiconductor device 1 is substantially the same as that of the conventional example shown in FIG. 2, and the test head 3 and contactor 4 of the measuring device are also substantially the same. In the present invention, the portion 5 that holds the semiconductor device 1 is made of a dielectric, and the electrode rod 6 is implanted in the test head 3.

又、該導電体からなる保持部5を絶縁材料で作
られた絶縁部7を介してハンドリング装置の筐体
8に取付けたものである。したがつて、本実施例
においては、被測定用半導体装置1をコンタクタ
4へ挿入した時に、保持部5と電極棒6とを接触
させて、電気的には測定装置のテストヘツド3と
保持部5とが同電位になる様に接続する。
Further, the holding part 5 made of the conductive material is attached to the housing 8 of the handling device via an insulating part 7 made of an insulating material. Therefore, in this embodiment, when the semiconductor device under test 1 is inserted into the contactor 4, the holding part 5 and the electrode rod 6 are brought into contact, and the test head 3 of the measuring device and the holding part 5 are electrically connected. Connect so that they are at the same potential.

この様な構成を採用することで、被測定用半導
体装置1を保持する機構はハンドリング装置とし
て動作するが、該保持部5に関しては電気的に測
定装置の一部分として機能することになる。特に
半導体装置1の周囲を導電体からなる保持部5で
囲むと、電気的にシールド効果(又はガード効
果)を得られ、ハンドリング装置からの障害信号
を効果的に防止できる。
By adopting such a configuration, the mechanism that holds the semiconductor device under test 1 operates as a handling device, but the holding section 5 electrically functions as a part of the measuring device. In particular, if the semiconductor device 1 is surrounded by the holding portion 5 made of a conductive material, an electrical shielding effect (or guarding effect) can be obtained, and interference signals from the handling device can be effectively prevented.

したがつて、本実施例においては半導体装置の
電気的特性を検査する検査装置に利用されるハン
ドリング装置の該半導体装置を保持する部分の構
成を変更することで従来技術を用いたハンドリン
グ装置を容易に改良できることを示している。
Therefore, in this embodiment, by changing the configuration of the portion of the handling device that holds the semiconductor device used in the inspection device that inspects the electrical characteristics of the semiconductor device, the handling device using the conventional technology can be easily replaced. This shows that it can be improved.

〔発明の効果〕〔Effect of the invention〕

本発明は以上説明したように、半導体装置の検
査装置の測定性能に影響を与える障害信号をなく
すことができ、ハンドリング装置からの測定性能
への悪影響をなくして半導体装置の電気的特性を
正確に測定できる効果を有するものである。
As explained above, the present invention can eliminate interference signals that affect the measurement performance of semiconductor device inspection equipment, eliminate the negative influence on measurement performance from handling equipment, and accurately measure the electrical characteristics of semiconductor devices. It has a measurable effect.

【図面の簡単な説明】[Brief explanation of drawings]

第1図a,bは本発明による半導体装置用ハン
ドリング装置の一実施例を示す概略説明図で、a
は正面図、bは側面図、第2図a,bは従来装置
の説明図で、aは正面図、bは側面図である。 1……被測定用の半導体装置、2……シユータ
ー、3……テストヘツド、4……コンタクター、
5……保持部、6……電極棒、7……絶縁体、8
……ハンドリング装置の筐体。
FIGS. 1a and 1b are schematic explanatory diagrams showing one embodiment of a handling device for semiconductor devices according to the present invention;
2 is a front view, b is a side view, and FIGS. 2a and 2b are explanatory diagrams of a conventional device, where a is a front view and b is a side view. 1... Semiconductor device to be measured, 2... Shooter, 3... Test head, 4... Contactor,
5... Holding part, 6... Electrode rod, 7... Insulator, 8
...The housing of the handling device.

Claims (1)

【特許請求の範囲】[Claims] 1 半導体装置を検査する検査装置に利用される
ハンドリング装置において、半導体装置を保持し
て測定用コンタクタへ挿入させる保持部を導電体
で構成し、該保持部をハンドリング装置の筐体に
電気的に絶縁させて取付け、該保持部を測定装置
と電気的に接続させたことを特徴とする半導体装
置用ハンドリング装置。
1. In a handling device used in an inspection device for testing semiconductor devices, the holding portion that holds the semiconductor device and inserts it into the measurement contactor is made of a conductor, and the holding portion is electrically connected to the housing of the handling device. A handling device for a semiconductor device, characterized in that the device is mounted insulated and the holding portion is electrically connected to a measuring device.
JP59101436A 1984-05-19 1984-05-19 Handling apparatus for semiconductor device Granted JPS60245142A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59101436A JPS60245142A (en) 1984-05-19 1984-05-19 Handling apparatus for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59101436A JPS60245142A (en) 1984-05-19 1984-05-19 Handling apparatus for semiconductor device

Publications (2)

Publication Number Publication Date
JPS60245142A JPS60245142A (en) 1985-12-04
JPH0422335B2 true JPH0422335B2 (en) 1992-04-16

Family

ID=14300638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59101436A Granted JPS60245142A (en) 1984-05-19 1984-05-19 Handling apparatus for semiconductor device

Country Status (1)

Country Link
JP (1) JPS60245142A (en)

Also Published As

Publication number Publication date
JPS60245142A (en) 1985-12-04

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