JPH0422350B2 - - Google Patents

Info

Publication number
JPH0422350B2
JPH0422350B2 JP59195443A JP19544384A JPH0422350B2 JP H0422350 B2 JPH0422350 B2 JP H0422350B2 JP 59195443 A JP59195443 A JP 59195443A JP 19544384 A JP19544384 A JP 19544384A JP H0422350 B2 JPH0422350 B2 JP H0422350B2
Authority
JP
Japan
Prior art keywords
light emitting
chips
connector
series
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59195443A
Other languages
Japanese (ja)
Other versions
JPS6175570A (en
Inventor
Masami Tsurumi
Toshihide Kawamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP59195443A priority Critical patent/JPS6175570A/en
Publication of JPS6175570A publication Critical patent/JPS6175570A/en
Publication of JPH0422350B2 publication Critical patent/JPH0422350B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

【発明の詳細な説明】 [技術分野] 本発明は、多数の発光ダイオードを直並列接続
した車両用灯具の光源部をユニツト化する方法に
関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for unitizing a light source section of a vehicle lamp in which a large number of light emitting diodes are connected in series and parallel.

[技術的背景] 車両用灯具(ストツプ・テールランプなど)の
光源として、多数の発光ダイオードを直並列接続
したものを用いることが考えられている。その場
合、発光ダイオードの駆動電圧を考慮すると、発
光ダイオードの直列接続数は4個あるいは5個と
なるが、個別素子を並べたのでは発光ダイオード
の向きにバラツキが生じたり、互いの接続に多く
の時間を要するようになる。
[Technical Background] It has been considered to use a large number of light emitting diodes connected in series and parallel as a light source for vehicle lamps (stop lights, tail lamps, etc.). In that case, considering the drive voltage of the light emitting diodes, the number of light emitting diodes connected in series will be 4 or 5, but if individual elements are arranged side by side, the orientation of the light emitting diodes will vary, and there will be many connections between them. It will take a long time.

[発明の目的] 本発明の目的は、数個直列の発光ダイオードの
配列が整然とし、しかも接続が簡単かつ確実な光
源ユニツトの製造方法を提供することにある。
[Object of the Invention] An object of the present invention is to provide a method for manufacturing a light source unit in which several light emitting diodes connected in series are arranged in an orderly manner and the connection is simple and reliable.

[発明の概要] 本発明は、リードフレームに多数の発光ダイオ
ードチツプをボンデイングし、レンズとして透明
樹脂のモールドを行つた後、数個のチツプが直列
接続状態となるようにタイバーカツトを行い、次
いでコネクタ部材の取付け及びケースの取付けを
行つて、コネクタを有するブロツク状の光源ユニ
ツトとすることを特徴とするものである。
[Summary of the Invention] The present invention involves bonding a large number of light emitting diode chips to a lead frame, molding transparent resin as a lens, cutting tie bars so that several chips are connected in series, and then This is characterized in that a connector member is attached and a case is attached to form a block-shaped light source unit having a connector.

[実施例] 第1図a〜d及び第2図は本発明の一実施例を
示すもので、第1図aに示すようにリードフレー
ム1の対をなす一方のリードの先端に発光ダイオ
ードチツプ2をボンデイングし、これを他方のリ
ードにワイヤ3により接続する。
[Embodiment] Figures 1a to d and 2 show an embodiment of the present invention.As shown in Figure 1a, a light emitting diode chip is attached to the tip of one of the leads of the lead frame 1. 2 is bonded and connected to the other lead by wire 3.

次に、各チツプ2を透明樹脂4によつてモール
ドし〔第1図b〕、数個、例えば4個直列となる
ようにタイバーカツトを行う〔第1図b〕。この
後、電流制限抵抗5及びコネクタ部材6をハイブ
リツト方式と同様な工程で取付け〔第1図c〕、
ケース7を取付ける。このケース取付けにより、
ケース7の両端に雄型コネクタ6Aと雌型コネク
タ6Bを形成し、第1図d及び第2図に示すよう
なブロツク状の光源ユニツト10とする。
Next, each chip 2 is molded with transparent resin 4 [FIG. 1b], and tie bars are cut so that several chips, for example, four chips are connected in series [FIG. 1b]. After this, the current limiting resistor 5 and the connector member 6 are installed in the same process as in the hybrid method [Fig. 1c],
Install case 7. By installing this case,
A male connector 6A and a female connector 6B are formed at both ends of the case 7, forming a block-shaped light source unit 10 as shown in FIGS. 1d and 2.

なお、上記実施例ではケース7の両端に雄型、
雌型コネクタ6A,6Bを形成したが、第3図に
示すようにケース7′の両側面にばね状の電極8
を組み込み、レール状の電極と接触させて所望配
列に組み立てることも可能である。
In the above embodiment, there are male molds and
Although the female connectors 6A and 6B are formed, spring-like electrodes 8 are provided on both sides of the case 7' as shown in FIG.
It is also possible to assemble it into a desired arrangement by incorporating it and bringing it into contact with rail-shaped electrodes.

[効果] 以上のように本発明によれば、リードフレーム
にボンデイングした多数の発光ダイオードチツプ
を数個直列状態でタイバーカツトを行い、これに
コネクタ部材を取付け、ケース取付を行つて、コ
ネクタを有するブロツク状とするので、断線によ
る不点灯や光度ムラなどがある場合には部分的に
取替えることが容易である。また、コネクタ形状
の選択により任意の形に実装できる。更に、4個
あるいは5個を直列接続した状態でタイバーカツ
トを行つてブロツク化するので、各チツプの接続
が確実になるとともに、配列も整然としたものに
なる。
[Effects] As described above, according to the present invention, a large number of light emitting diode chips bonded to a lead frame are cut in series by tie bar cutting, a connector member is attached thereto, a case is attached, and a connector is formed. Since it is shaped like a block, it is easy to partially replace it if there is a problem with non-lighting or uneven brightness due to wire breakage. Furthermore, the connector can be mounted in any shape by selecting the shape of the connector. Furthermore, since four or five chips are connected in series and then cut with tie bars to form a block, each chip can be connected reliably and the arrangement can be made orderly.

【図面の簡単な説明】[Brief explanation of drawings]

第1図a〜dは本発明の一実施例を示す工程説
明図、第2図は同実施例の光源ユニツトの外観を
示す斜視図、第3図は他の形状の光源ユニツトの
外観を示す斜視図である。 1……リードフレーム、2……発光ダイオード
チツプ、3……ワイヤ、4……透明樹脂、5……
電流制限抵抗、6……コネクタ部材。
Figures 1 a to d are process explanatory diagrams showing one embodiment of the present invention, Figure 2 is a perspective view showing the appearance of a light source unit of the same embodiment, and Figure 3 shows the appearance of a light source unit of another shape. FIG. 1... Lead frame, 2... Light emitting diode chip, 3... Wire, 4... Transparent resin, 5...
Current limiting resistor, 6... Connector member.

Claims (1)

【特許請求の範囲】[Claims] 1 リードフレームに多数の発光ダイオードチツ
プをボンデイングする工程と、前記チツプにレン
ズとして透明樹脂をモールドする工程と、前記チ
ツプが数個直列接続となる状態でタイバーカツト
を行う工程と、タイバーカツトを行つたリードフ
レームにコネクタ部材を取付け、更にケースを取
付けて、コネクタを有するブロツク状とする工程
とを含む車両用灯具の光源ユニツトの製造方法。
1 A step of bonding a large number of light emitting diode chips to a lead frame, a step of molding a transparent resin onto the chips as a lens, a step of cutting a tie bar with several of the chips connected in series, and a step of cutting the tie bar. A method for manufacturing a light source unit for a vehicle lamp, which includes the steps of: attaching a connector member to a lead frame, and further attaching a case to form a block shape having a connector.
JP59195443A 1984-09-18 1984-09-18 Manufacture of light source unit of lamp implement for vehicle Granted JPS6175570A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59195443A JPS6175570A (en) 1984-09-18 1984-09-18 Manufacture of light source unit of lamp implement for vehicle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59195443A JPS6175570A (en) 1984-09-18 1984-09-18 Manufacture of light source unit of lamp implement for vehicle

Publications (2)

Publication Number Publication Date
JPS6175570A JPS6175570A (en) 1986-04-17
JPH0422350B2 true JPH0422350B2 (en) 1992-04-16

Family

ID=16341148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59195443A Granted JPS6175570A (en) 1984-09-18 1984-09-18 Manufacture of light source unit of lamp implement for vehicle

Country Status (1)

Country Link
JP (1) JPS6175570A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5284790A (en) * 1990-01-03 1994-02-08 Karpinski Arthur A Method of fabricating monolithic laser diode array
US5221641A (en) * 1991-06-21 1993-06-22 Rohm Co., Ltd. Process for making light emitting diodes
US5660461A (en) * 1994-12-08 1997-08-26 Quantum Devices, Inc. Arrays of optoelectronic devices and method of making same
JP2006344420A (en) * 2005-06-07 2006-12-21 Alps Electric Co Ltd LED lamp module

Also Published As

Publication number Publication date
JPS6175570A (en) 1986-04-17

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