JPH0422820B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a plate-shaped body delivery device used in manufacturing equipment such as semiconductor manufacturing equipment.

BACKGROUND ART Conventionally, some devices for delivering a plurality of plate-like bodies stack a plurality of plate-like bodies and send out one plate at a time starting from the topmost plate.

Problems to be Solved by the Invention However, the conventional plate-shaped body delivery device as described above cannot replenish plate-shaped bodies during operation.

Means for Solving the Problems The present invention provides a storage section for storing a plurality of plate-like bodies in a stacked state, and a single plate-like body located at the bottom of the plurality of plate-like bodies. The second plate-like body from the bottom of the plurality of plate-like bodies is loaded with a feeding means that is movably provided to discharge the plurality of plate-like bodies, and is biased by an elastic member in a direction in which the plurality of plate-like bodies are fed out. a movable link member having a holding member rotatably provided to hold the holding member, and when the link member is moved by the delivery means in a direction opposite to the urging direction thereof, the holding member is lowered. The second plate-shaped body is rotated to release the second plate-shaped body from the second plate-shaped body.

Effect With the above configuration, when the lowermost plate of a plurality of stacked plate-like bodies is being fed out by the feeding means, the second plate-like body from the bottom is held by the holding member. do.

Embodiment What is shown in FIG. 2 is a plate-shaped body on which a semiconductor wafer (not shown) is placed.

Reference numeral 1 denotes a plate-like body, which is approximately square and has a total of eight pairs of notches 2 at four corners. 3 is a V-shaped notch provided in the center of each side of the plate-shaped body 1.

Reference numeral 4 denotes an opening provided at the center of the plate body 1, into which a wafer is placed.

What is shown in FIG. 1 is a sectional perspective view of a main part of an embodiment of the delivery device of the present invention.

Reference numerals 5 and 6 designate tables, which are connected by connecting plates 7 and 8 to form a groove 9 therebetween, and posts 10 to 13 having an L-shaped cross section are provided at the four corners to open the storage section. It consists of And post 10
The heights 1 to 13 are the heights of several plate bodies 1 stacked one on top of the other.

14 is a guide shaft provided directly below the groove 9, and the plate body 1 is attached to this guide shaft 14.
A movable body 16 having a delivery means 15 for delivery is movably mounted.

Support members 17 and 18 support both ends of the guide shaft 14.

Reference numerals 19, 20, 21, and 22 are holding means, which hold the link member 25 by links 23 and 24, respectively.
It is linked with

26 and 27 are elastic members for returning the links 23 and 24, respectively.

What is shown in FIG. 3 is part of a semiconductor manufacturing apparatus using the present invention.

Here, 28 is an X-Y table, which includes a table 29 on which the plate body 1 is placed, and this table 29.
It consists of an X-axis drive device 30 that drives the table 29 along the X-axis, and a Y-axis drive device 31 that drives the table 29 along the Y-axis.

32 is a storage device for the empty plate body 1.

The plate-shaped body delivery device of the present invention has the structure described above, and its operation will be explained below.

First, as shown in FIG.
Several sheets of the plate-like body 1 are stacked between the sheets 3 and 3. Next, when the movable body 16 is moved in the direction of arrow A on the guide shaft 14, the link member 25, which had been pushed by the sending means 15, is moved by the return elastic members 26 and 27 as shown in FIG. do.

Therefore, by moving the link member 25 via the links 26 and 27, the holding means 19 to 22
comes out toward the plate-like body 1 and enters the notch 2.

Further, as shown in FIG. 6, when the plate body 1 is taken out from the post 13 by the delivery means 15, the second plate body 1 from the bottom falls down, but the holding means 19 to 22 is inserted into the notch 2, so that the second plate-like body 1 is attached to the holding means 1.
It is supported by 9 to 22 and does not fall to the tables 5 and 6.

The plate main body 1 taken out by the delivery means 15 moves in the direction of arrow C and is placed on the table 29, where a large number of dies are taken out from the plate by a pick-up (not shown) and the empty plate is removed. The main body further moves in the direction of arrow D and is stored in the storage device 32.

Next, as shown in FIG. 7, since the plate body 1 is supported by the holding means 19 to 22, the delivery means 15 does not catch on the plate body 1 and moves the movable body 16 in the direction of arrow B. can be moved to

Then, when the sending means 15 returns further in the direction of arrow B, the link member 25 is moved by the sending means 15 against the elastic force of the return elastic members 26 and 27, so that the holding means 19 to 22 are moved to the notch 2. The plate body 1 is retracted further and falls onto the tables 5 and 6, returning to the state shown in FIG. 4, and the above operation is repeated.

During this operation, when the number of plate bodies 1 stacked between the posts 10 to 13 decreases, plate bodies 1 may be added from the top.

Effects of the Invention As described above, the present invention has a storage section in which a plurality of plate-like bodies are stacked and stored, and a discharging means for discharging the lowest plate-like body among the plate-like bodies is provided at the lower part of the storage section. A holding member is provided to hold the plate-like body one level above the lowest plate-like body during the period when the means is discharging the plate-like body and during the period when the discharging means returns to the origin before discharging the plate-like body. Therefore, in the present invention, the plate-like bodies can be fed from the lowest stage, and the plate-like bodies can be fed while the plate-like bodies are being fed.

[Brief explanation of drawings]

FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a perspective view of a plate main body used in the present invention,
FIG. 3 is a perspective view of a main part of a semiconductor manufacturing apparatus using the present invention, and FIGS. 4 to 7 are side views showing the operation process of an embodiment of the present invention. 1... Plate body main body, 2... Notch, 5, 6...
... Table, 10-13 ... Post, 14 ... Guide shaft, 15 ... Delivery means, 16 ... Moving body, 19-22 ... Holding means, 23, 24 ... Link, 25 ... Link member, 26 , 27... Elastic member for return.

Claims (1)

[Claims] 1. A storage section for storing a plurality of plate-shaped bodies in a stacked state, and a delivery unit movably provided to discharge the one plate-shaped body located at the bottom of the plurality of plate-shaped bodies. means, and is rotatably provided to hold the second plate from the bottom of the plurality of plate-like bodies while being biased by an elastic member in the direction of sending out the plurality of plate-like bodies. a movable link member having a holding member, and when the link member is moved by the sending means in a direction opposite to the urging direction thereof, the holding member releases the second plate-like member from the bottom. A delivery device characterized in that it rotates so as to rotate.