JPH0423134U - - Google Patents
Info
- Publication number
- JPH0423134U JPH0423134U JP1990063833U JP6383390U JPH0423134U JP H0423134 U JPH0423134 U JP H0423134U JP 1990063833 U JP1990063833 U JP 1990063833U JP 6383390 U JP6383390 U JP 6383390U JP H0423134 U JPH0423134 U JP H0423134U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- heat sink
- semiconductor device
- sealed semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990063833U JPH0423134U (pt) | 1990-06-15 | 1990-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990063833U JPH0423134U (pt) | 1990-06-15 | 1990-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0423134U true JPH0423134U (pt) | 1992-02-26 |
Family
ID=31594233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990063833U Pending JPH0423134U (pt) | 1990-06-15 | 1990-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423134U (pt) |
-
1990
- 1990-06-15 JP JP1990063833U patent/JPH0423134U/ja active Pending