JPH0423134U - - Google Patents
Info
- Publication number
- JPH0423134U JPH0423134U JP6383390U JP6383390U JPH0423134U JP H0423134 U JPH0423134 U JP H0423134U JP 6383390 U JP6383390 U JP 6383390U JP 6383390 U JP6383390 U JP 6383390U JP H0423134 U JPH0423134 U JP H0423134U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- heat sink
- semiconductor device
- sealed semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000008188 pellet Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案に用いた放熱板の平面図、第２
図は放熱板を樹脂封止するために上部金型と下部
金型に挿入した状態の工程を説明した樹脂封止型
半導体装置の金型の断面図、第３図は従来の放熱
板の正面図である。
５……半導体ペレツト、１……放熱板、７……
上部金型、８……下部金型、９……第１空間、１
１……第１ポート、１０……第２空間、１２……
第２ポート。
Figure 1 is a plan view of the heat sink used in this invention, Figure 2
The figure is a cross-sectional view of a mold for a resin-sealed semiconductor device, illustrating the process of inserting a heat sink into an upper mold and a lower mold for resin-sealing, and Figure 3 is a front view of a conventional heat sink. It is a diagram. 5... Semiconductor pellet, 1... Heat sink, 7...
Upper mold, 8... Lower mold, 9... First space, 1
1...First port, 10...Second space, 12...
2nd port.
Claims (1)
して樹脂封止型半導体装置を製造する上部金型お
よび下部金型を有する樹脂封止型半導体装置の金
型において、前記放熱板および前記半導体ペレツ
トを樹脂封止するとき、前記上部金型と放熱板に
よつて画成される第１空間に連通する第１ポート
を前記上部金型に設けるとともに、前記下部金型
と放熱板によつて画成される第２空間に第２ポー
トを前記下部金型に設けたことを特徴とする樹脂
封止型半導体装置の金型。 (2) 前記第１空間に連通する第１ポート、およ
び前記第２空間に連通する第２ポートの開口度を
それぞれ独立して任意に設定できる請求項１記載
の樹脂封止型半導体装置の金型。[Scope of Claim for Utility Model Registration] (1) A mold for a resin-sealed semiconductor device having an upper mold and a lower mold for manufacturing a resin-sealed semiconductor device by resin-sealing a semiconductor pellet and a heat sink. When sealing the heat sink and the semiconductor pellet with resin, a first port communicating with a first space defined by the upper mold and the heat sink is provided in the upper mold, and A mold for a resin-sealed semiconductor device, characterized in that a second port is provided in the lower mold in a second space defined by a mold and a heat sink. (2) The resin-sealed semiconductor device according to claim 1, wherein the opening degree of the first port communicating with the first space and the second port communicating with the second space can be independently set as desired. Type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6383390U JPH0423134U (en) | 1990-06-15 | 1990-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6383390U JPH0423134U (en) | 1990-06-15 | 1990-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0423134U true JPH0423134U (en) | 1992-02-26 |
Family
ID=31594233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6383390U Pending JPH0423134U (en) | 1990-06-15 | 1990-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423134U (en) |
-
1990
- 1990-06-15 JP JP6383390U patent/JPH0423134U/ja active Pending