JPH04236255A - Antistatic methacrylic resin composition - Google Patents
Antistatic methacrylic resin compositionInfo
- Publication number
- JPH04236255A JPH04236255A JP424791A JP424791A JPH04236255A JP H04236255 A JPH04236255 A JP H04236255A JP 424791 A JP424791 A JP 424791A JP 424791 A JP424791 A JP 424791A JP H04236255 A JPH04236255 A JP H04236255A
- Authority
- JP
- Japan
- Prior art keywords
- methacrylic resin
- parts
- weight
- resin composition
- antistatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 11
- 239000000113 methacrylic resin Substances 0.000 title claims description 22
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 claims abstract description 10
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical group COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000011347 resin Substances 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 7
- 239000011342 resin composition Substances 0.000 abstract description 4
- 238000002156 mixing Methods 0.000 abstract description 3
- 238000005406 washing Methods 0.000 abstract description 3
- 125000005641 methacryl group Chemical group 0.000 abstract 4
- -1 fatty acid esters Chemical class 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- VBICKXHEKHSIBG-UHFFFAOYSA-N beta-monoglyceryl stearate Natural products CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- CCRCUPLGCSFEDV-UHFFFAOYSA-N cinnamic acid methyl ester Natural products COC(=O)C=CC1=CC=CC=C1 CCRCUPLGCSFEDV-UHFFFAOYSA-N 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- YWJUZWOHLHBWQY-UHFFFAOYSA-N decanedioic acid;hexane-1,6-diamine Chemical compound NCCCCCCN.OC(=O)CCCCCCCCC(O)=O YWJUZWOHLHBWQY-UHFFFAOYSA-N 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 150000002148 esters Chemical group 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- MCVVUJPXSBQTRZ-ONEGZZNKSA-N methyl (e)-but-2-enoate Chemical compound COC(=O)\C=C\C MCVVUJPXSBQTRZ-ONEGZZNKSA-N 0.000 description 1
- CCRCUPLGCSFEDV-BQYQJAHWSA-N methyl trans-cinnamate Chemical compound COC(=O)\C=C\C1=CC=CC=C1 CCRCUPLGCSFEDV-BQYQJAHWSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- KZCOBXFFBQJQHH-UHFFFAOYSA-N octane-1-thiol Chemical compound CCCCCCCCS KZCOBXFFBQJQHH-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- PNOXUQIZPBURMT-UHFFFAOYSA-M potassium;3-(2-methylprop-2-enoyloxy)propane-1-sulfonate Chemical compound [K+].CC(=C)C(=O)OCCCS([O-])(=O)=O PNOXUQIZPBURMT-UHFFFAOYSA-M 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【0001】0001
【0001】0001
【0002】0002
【産業上の利用分野】本発明は、優れた帯電防止性を有
するメタクリル樹脂組成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a methacrylic resin composition having excellent antistatic properties.
【0003】0003
【0002】0002
【0004】0004
【従来の技術】メタクリル樹脂は、その優れた透明性、
良好な機械的特性ならびに加工性により、照明器具、看
板あるいは各種装飾品など幅広く使用されている。しか
しながら、その表面固有抵抗が非常に高いために樹脂表
面にほこり等が付着して汚れやすく、その改良が望まれ
ている。[Prior art] Methacrylic resin has excellent transparency and
Due to its good mechanical properties and workability, it is widely used in lighting equipment, signboards, and various decorative items. However, since the surface resistivity is very high, dust and the like easily adhere to the resin surface and make it dirty, and an improvement is desired.
【0005】[0005]
【0003】従来、このようなメタクリル樹脂の帯電防
止性能を向上させるためにはシリコン系化合物を塗布し
たり、各種の界面活性剤、多価アルコールの脂肪酸エス
テルあるいはスルホン酸基を有する化合物を練り込んだ
りする方法が提案されている。[0003] Conventionally, in order to improve the antistatic performance of such methacrylic resins, it has been necessary to coat silicone compounds, incorporate various surfactants, fatty acid esters of polyhydric alcohols, or compounds having sulfonic acid groups. A method has been proposed.
【0006】[0006]
【0004】0004
【0007】[0007]
【発明が解決しようとする課題】しかしながら、シリコ
ン系化合物を用いる方法は一般に高価であるためコスト
的に極めて不利であり、また、界面活性剤を用いた場合
では実用に供しての十分な効果が得られていない。一方
、脂肪酸エステルを練り込んだりする方法では、通常の
常識的な添加量では有効な帯電防止能の向上は認められ
ず、やむを得ず脂肪酸エステルを多量に添加する必要が
ある。この場合、得られた樹脂の耐熱性を著しく低下さ
せてしまい、成形加工上に大きく制限をきたすという問
題がある。[Problems to be Solved by the Invention] However, methods using silicon compounds are generally expensive and therefore extremely disadvantageous in terms of cost, and methods using surfactants are not sufficiently effective for practical use. Not obtained. On the other hand, in the method of kneading fatty acid ester, no effective improvement in antistatic ability is observed with the usual common sense addition amount, and it is unavoidable to add a large amount of fatty acid ester. In this case, there is a problem in that the heat resistance of the obtained resin is significantly reduced, which greatly limits the molding process.
【0008】[0008]
【0005】また、スルホン酸基を有する化合物を添加
する方法では、顕著な帯電防止能の向上を示すが、一度
の水洗によってその効果は著しく低下するなど永久性に
問題が残る。このように、メタクリル樹脂の帯電防止に
関しては多くのさまざまな方策がなされているにもかか
わらず、有効な解決策が見つかっていないのが現状であ
る。[0005] Furthermore, the method of adding a compound having a sulfonic acid group shows a remarkable improvement in antistatic ability, but there remains a problem with its permanence, as the effect is significantly reduced by one-time washing with water. As described above, although many various measures have been taken to prevent electrification of methacrylic resin, no effective solution has yet been found.
【0009】[0009]
【0006】[0006]
【0010】0010
【課題を解決するための手段】そこで、本発明者らはこ
のような現状に鑑み鋭意検討した結果、ポリエーテルエ
ステルアミドをメタクリル樹脂に配合することにより、
耐熱性を損ねることなく成形性を維持したまま、かつ優
れた永久帯電防止性を有するメタクリル樹脂組成物が得
られることを見い出し本発明を完成するに至った。[Means for Solving the Problems] Therefore, as a result of intensive studies in view of the current situation, the present inventors found that by blending polyether ester amide with methacrylic resin,
The present inventors have discovered that it is possible to obtain a methacrylic resin composition that maintains moldability without impairing heat resistance and has excellent permanent antistatic properties, and has completed the present invention.
【0011】[0011]
【0007】即ち、本発明はメチルメタクリレート単位
を70重量%以上有するメタクリル樹脂[I]70〜9
8重量部およびポリエーテルエステルアミド[II]3
0〜2重量部(合計100重量部)からなる帯電防止性
メタクリル樹脂組成物である。That is, the present invention provides a methacrylic resin [I] 70-9 having 70% by weight or more of methyl methacrylate units.
8 parts by weight and polyether ester amide [II] 3
This is an antistatic methacrylic resin composition containing 0 to 2 parts by weight (100 parts by weight in total).
【0012】0012
【0008】本発明のメタクリル樹脂[I]は、メチル
メタクリレート単位を70重量%以上有するものであり
、メチルメタクリレートと共重合可能な他の単量体とし
ては、メタクリル酸エチル、メタクリル酸ブチル、メタ
クリル酸シクロヘキシルなどのメタクリル酸アルキルエ
ステル類;アクリル酸メチル、アクリル酸エチル、アク
リル酸ブチルなどのアクリル酸アルキルエステル類;ス
チレン、ビニルトルエン、αーメチルスチレンなどの芳
香族ビニル化合物;アクリロニトリル、メタクリロニト
リルなどのシアン化ビニル単量体;桂皮酸メチル、クロ
トン酸メチル、無水マレイン酸などの酸無水物;N−フ
ェニルマレイミド、N−(Oークロロフェニルマレイミ
ド)、N−エチルマレイミド、N−シクロヘキシルマレ
イミドなどのマレイミド類などが挙げられ、これらは単
独であるいは2種以上を組み合わせて用いることができ
る。また、これらの樹脂をイミド化反応によりイミド化
した樹脂、あるいはゴム変性した樹脂も用いることがで
きる。The methacrylic resin [I] of the present invention has methyl methacrylate units in an amount of 70% by weight or more, and other monomers copolymerizable with methyl methacrylate include ethyl methacrylate, butyl methacrylate, and methacrylate. Methacrylic acid alkyl esters such as cyclohexyl acrylate; Acrylic acid alkyl esters such as methyl acrylate, ethyl acrylate, and butyl acrylate; Aromatic vinyl compounds such as styrene, vinyltoluene, and α-methylstyrene; Acrylonitrile, methacrylonitrile, etc. Vinyl cyanide monomers; acid anhydrides such as methyl cinnamate, methyl crotonate, and maleic anhydride; maleimides such as N-phenylmaleimide, N-(O-chlorophenylmaleimide), N-ethylmaleimide, and N-cyclohexylmaleimide These can be used alone or in combination of two or more. Furthermore, resins obtained by imidizing these resins by an imidization reaction, or resins obtained by rubber modification can also be used.
【0013】[0013]
【0009】また、メタクリル樹脂[I]は、得られる
樹脂組成物100重量部中70〜98重量部用いられ、
70重量部未満では機械的強度の低下が比較的大きく、
一方98重量部を超えると帯電防止性が発現されず好ま
しくない。The methacrylic resin [I] is used in an amount of 70 to 98 parts by weight based on 100 parts by weight of the resulting resin composition.
If it is less than 70 parts by weight, the decrease in mechanical strength is relatively large;
On the other hand, if it exceeds 98 parts by weight, antistatic properties will not be exhibited, which is not preferable.
【0014】なお、メタクリル樹脂[II]は、25℃
のクロロホルム中で測定した固有粘度[η]が0.03
〜0.1 /gの範囲のものが好ましい。[0014] The methacrylic resin [II] is heated at 25°C.
The intrinsic viscosity [η] measured in chloroform is 0.03
The range of 0.1 to 0.1/g is preferable.
【0015】[0015]
【0010】次に、本発明において用いられるポリエー
テルエステルアミド[II]は、(a)11ーアミノウ
ンデカン酸およびカプロラクタムなどの炭素原子数6以
上のアミノカルボン酸ラクタム、もしくはヘキサメチレ
ンジアミンーアジピン酸塩およびヘキサメチレンジアミ
ンーセバシン酸塩などの炭素原子数6以上のジアミンと
ジカルボン酸の塩、(b)ポリ(エチレンオキシド)グ
リコールなどの数平均分子量200〜6000のポリ(
エチレンオキシド)グリコールおよび(C)テレフタル
酸あるいはイソフタル酸などの炭素原子数4〜20のジ
カルボン酸から構成され、ポリエーテルエステル単位が
95〜10重量%であるものを指す。Next, the polyether ester amide [II] used in the present invention is (a) an aminocarboxylic acid lactam having 6 or more carbon atoms such as 11-aminoundecanoic acid and caprolactam, or hexamethylene diamine-adipic acid. salts and salts of diamines and dicarboxylic acids having 6 or more carbon atoms such as hexamethylene diamine sebacate; (b) poly(ethylene oxide) having a number average molecular weight of 200 to 6,000 such as
(ethylene oxide) glycol and (C) dicarboxylic acid having 4 to 20 carbon atoms, such as terephthalic acid or isophthalic acid, and refers to a polyether ester unit containing 95 to 10% by weight.
【0016】[0016]
【0011】このポリエーテルエステルアミド[I]は
添加量が多くなるにつれて帯電防止能は良くなるが、3
0重量部を超える添加では熱変形温度の低下が著しくな
る。また2重量部未満の少量添加では有効な帯電防止能
は得られない。したがって、成形品の外観や加工性など
を考慮すれば、2〜30重量部の添加が望ましい。The antistatic ability of this polyether ester amide [I] improves as the amount added increases, but 3
If more than 0 parts by weight is added, the heat distortion temperature will drop significantly. In addition, if a small amount of less than 2 parts by weight is added, effective antistatic ability cannot be obtained. Therefore, in consideration of the appearance and processability of the molded product, it is desirable to add 2 to 30 parts by weight.
【0017】[0017]
【0012】本発明のメタクリル樹脂組成物を製造する
には、メタクリル樹脂[I]にポリエーテルエステルア
ミド[II]を混合し、さらに押出機を使用して溶融混
合させた後ペレット状に成形するのが好ましい。In order to produce the methacrylic resin composition of the present invention, polyether ester amide [II] is mixed with methacrylic resin [I], and the mixture is melt-mixed using an extruder and then formed into pellets. is preferable.
【0018】[0018]
【0013】[0013]
【0019】[0019]
【実施例】以下、実施例により、本発明を具体的に説明
する。なお、実施例中の「%」、「部」はそれぞれ「重
量%」、「重量部」を示す。[Examples] The present invention will be specifically explained below with reference to Examples. Note that "%" and "parts" in the examples indicate "% by weight" and "parts by weight", respectively.
【0020】なお、各物性値の測定は、次の方法で行っ
た。[0020]Measurement of each physical property value was carried out by the following method.
【0021】全光線透過率 ASTMーD1003に準じて測定した。[0021] Total light transmittance Measured according to ASTM-D1003.
【0022】熱変形温度 ASTM−D648に準じて測定した。[0022] Heat distortion temperature Measured according to ASTM-D648.
【0023】表面固有抵抗値
1)射出成形直後、この成形板を23℃、50%湿度の
恒温室に24時間放置後、超絶縁抵抗計((株)アドバ
ンテスト製、TR−8601)で測定した。さらに測定
後、蒸留水で十分洗浄してから表面の水分を取り除いた
後、23℃、50%の恒温室に24時間放置して再度測
定した。Surface specific resistance value 1) Immediately after injection molding, the molded plate was left in a constant temperature room at 23°C and 50% humidity for 24 hours, and then measured using a super insulation resistance meter (manufactured by Advantest Co., Ltd., TR-8601). . After the measurement, the sample was thoroughly washed with distilled water to remove moisture from the surface, and then left in a constant temperature room at 23° C. and 50% for 24 hours and measured again.
【0024】2)1)の操作後、成形板を23℃、50
%湿度の恒温室に100日間放置後、同じく超絶縁抵抗
計を用いて測定した。2) After the operation in 1), the molded plate was heated at 23°C and 50°C.
% humidity for 100 days, and then measured using the same super insulation resistance meter.
【0025】[0025]
【0014】メタクリル樹脂[I]の製造メチルメタク
リレート97部とメチルアクリレートを3部の割合で混
合した単量体100部にn−オクチルメルカプタンの0
.22部を溶解し、重合触媒としてアゾビスイソブチロ
ニトリル0.1部、離型剤としてステアリルアルコール
0.1部、懸濁重合分散剤としてメタクリル酸メチルと
3ーメタクリロイルオキシプロパンスルホン酸カリウム
の共重合体0.01部、硫酸ナトリウム0.15部、水
145部を撹拌器および温度計付きガラス製フラスコ重
合装置に混入し、80℃で重合させ内温がピークに達し
た後95℃で30分間保持後冷却し、濾過、水洗、乾燥
することによりビーズ状のメタクリル樹脂を得た。Production of methacrylic resin [I] 100 parts of a monomer prepared by mixing 97 parts of methyl methacrylate and 3 parts of methyl acrylate with 0% of n-octyl mercaptan.
.. 0.1 part of azobisisobutyronitrile as a polymerization catalyst, 0.1 part of stearyl alcohol as a mold release agent, and methyl methacrylate and potassium 3-methacryloyloxypropanesulfonate as suspension polymerization dispersants. 0.01 part of the copolymer, 0.15 parts of sodium sulfate, and 145 parts of water were mixed into a glass flask polymerization apparatus equipped with a stirrer and a thermometer, and polymerized at 80°C. After the internal temperature reached a peak, the mixture was heated to 95°C. After holding for 30 minutes, the mixture was cooled, filtered, washed with water, and dried to obtain a beaded methacrylic resin.
【0026】[0026]
【0015】実施例1〜4
表1に示す割合のメタクリル樹脂[I]とポリエーテル
エステルアミド[II](ATOCHEM社製:ペバッ
クス(R)4011MA00)を撹拌混合し、400m
mφの押出機にて混練ペレット化した後、射出成形機に
よって250℃で100×100×2mmの平板を作製
した。得られた成形板の全光線透過率、熱変形温度、表
面固有抵抗値を測定した。結果を表1に示す。Examples 1 to 4 Methacrylic resin [I] and polyether ester amide [II] (manufactured by ATOCHEM Co., Ltd.: Pebax (R) 4011MA00) in the proportions shown in Table 1 were stirred and mixed.
After kneading and pelletizing using an mφ extruder, a flat plate of 100×100×2 mm was produced at 250° C. using an injection molding machine. The total light transmittance, heat deformation temperature, and surface resistivity of the obtained molded plate were measured. The results are shown in Table 1.
【0027】[0027]
【0016】比較例1
ポリエーテルエステルアミドを添加することなく、メタ
クリル樹脂[I]のみで実施例と同様に実験を行った。
結果を表1に示す。Comparative Example 1 An experiment was conducted in the same manner as in the example using only methacrylic resin [I] without adding polyether ester amide. The results are shown in Table 1.
【0028】[0028]
【0017】比較例2
メタクリル樹脂[I]98部にドデシルベンゼンスルホ
ン酸ナトリウムを2部加えて実施例と同様に実験を行っ
た。結果を表1に示す。Comparative Example 2 An experiment was conducted in the same manner as in the example except that 2 parts of sodium dodecylbenzenesulfonate was added to 98 parts of methacrylic resin [I]. The results are shown in Table 1.
【0029】[0029]
【0018】比較例3
メタクリル樹脂[I]93部にステアリン酸モノグリセ
リド7部を加えて実施例と同様に実験を行った。結果を
表1に示す。Comparative Example 3 An experiment was conducted in the same manner as in Example except that 7 parts of stearic acid monoglyceride was added to 93 parts of methacrylic resin [I]. The results are shown in Table 1.
【0030】[0030]
【0019】[0019]
【0031】[0031]
【表1】[Table 1]
【0032】[0032]
【0020】表1の結果から、本発明の樹脂組成物はい
ずれも良好な帯電防止性を示し、しかも表面水洗や経時
変化によって変化せずに永久性を有することがわかる。
さらに熱変形温度の低下もなく、成形加工が可能である
といえる。From the results in Table 1, it can be seen that all of the resin compositions of the present invention exhibit good antistatic properties and are permanent without changing due to surface washing with water or changes over time. Furthermore, it can be said that molding is possible without a decrease in heat deformation temperature.
【0033】[0033]
【0021】[0021]
【0034】[0034]
【発明の効果】本発明のメタクリル樹脂組成物は優れた
帯電防止能を有し、かつ水洗によってその性能が失われ
ることがないため、工業上優れた効果を奏する。Effects of the Invention The methacrylic resin composition of the present invention has excellent antistatic ability and does not lose its performance even when washed with water, so it exhibits excellent industrial effects.
Claims (1)
%以上有するメタクリル樹脂[I]70〜98重量部お
よびポリエーテルエステルアミド[II]30〜2重量
部(合計100重量部)からなる帯電防止性メタクリル
樹脂組成物。Claim 1: An antistatic methacrylic resin comprising 70 to 98 parts by weight of methacrylic resin [I] having 70% by weight or more of methyl methacrylate units and 30 to 2 parts by weight of polyether ester amide [II] (100 parts by weight in total). Composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP424791A JPH04236255A (en) | 1991-01-18 | 1991-01-18 | Antistatic methacrylic resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP424791A JPH04236255A (en) | 1991-01-18 | 1991-01-18 | Antistatic methacrylic resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04236255A true JPH04236255A (en) | 1992-08-25 |
Family
ID=11579214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP424791A Pending JPH04236255A (en) | 1991-01-18 | 1991-01-18 | Antistatic methacrylic resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04236255A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08120147A (en) * | 1994-09-01 | 1996-05-14 | Sanyo Chem Ind Ltd | Transparent antistatic acrylic resin composition |
| WO2001014471A3 (en) * | 1999-08-25 | 2001-07-26 | Cyro Ind | Electrostatic-dissipative multipolymer compositions |
-
1991
- 1991-01-18 JP JP424791A patent/JPH04236255A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08120147A (en) * | 1994-09-01 | 1996-05-14 | Sanyo Chem Ind Ltd | Transparent antistatic acrylic resin composition |
| WO2001014471A3 (en) * | 1999-08-25 | 2001-07-26 | Cyro Ind | Electrostatic-dissipative multipolymer compositions |
| US6673873B1 (en) | 1999-08-25 | 2004-01-06 | Cyro Industries | Electrostatic-dissipative multipolymer compositions |
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