JPH0423809B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing ceramic electronic components such as capacitors and multilayer substrates.

Conventional structure and its problems It is generally known that in the manufacturing process of multilayer ceramic capacitors, cutting marks for each green chip are printed on the surface of a green sheet before firing; It is also known to print an identification mark after sintering that remains on the chip by causing a sintering/diffusion reaction. However, since the cutting mark must not remain after firing, the composition of the identification mark and the printing ink are different, and the printing processes for the cutting mark and the identification mark are different. In addition, if the same printing ink is used, a cutting mark 2 may be printed on the edge of the green sheet 1 that is not used for the green chip, and an identification mark 3 may be printed on the green chip part, as shown in Figure 1. . However, in this case, there was a drawback that the deviation in cutting could not be clearly detected or confirmed because no cutting mark was marked on the green chip portion.

OBJECTS OF THE INVENTION The present invention aims to eliminate the above-mentioned conventional drawbacks, and aims to make it possible to obtain excellent ceramic electronic components by a simple method.

Structure of the Invention In order to achieve the above object, the method for manufacturing ceramic electronic components of the present invention provides printing ink containing a second porcelain material on the top surface of a green sheet made of a mixture of a first porcelain material and a synthetic resin binder. By printing the green sheet, the cutting mark and identification mark are simultaneously printed, and after firing, only the cutting mark is removed by barrel polishing.

DESCRIPTION OF EMBODIMENTS Examples of the present invention will be described below based on the drawings. FIG. 2 shows an embodiment of the invention. The green sheet 1 consists of an aggregate of green chips 4 and an unnecessary end portion, and has a cutting mark 2 and an identification mark 3 printed on its upper surface. This cutting mark 2
and identification mark 3 are printed at the same time using the same ink made of the same material, and after firing the green chip, the porcelain material contained in the green chip and the porcelain material contained in the printing ink for the mark react and diffuse during sintering, resulting in color development. and remain as a mark. This state is shown in FIG. 3 as a cross section of the ceramic chip 8. FIG. 3 is a cross-sectional view of the green chip 4 before firing in FIG. 2 taken along the broken line 5, and shows the chip after firing. In the fired state, the green chip 4 has a surface as shown by the solid line 6, and when barrel polished, it is polished to the surface as shown by the broken line 7.

Here, since the cutting mark 2 is used as a positioning line when cutting the green sheet, it is often thinner than the identification mark 3 such as the direction. That is, compared to the identification mark 3, the cutting mark 2 can be said to have a sufficiently narrow width. In this case, cut mark 2
The depth of diffusion into the ceramic chip 8 is shallower than that of the identification mark 3. Furthermore, the cutting mark 2 is always located at the end of the ceramic chip 8, and the amount of polishing in barrel polishing increases toward the end, so the width of the cutting mark, the diffusion depth during firing, and the amount of barrel polishing should be adjusted appropriately. By setting, only the cutting mark 2 can be removed and the identification mark 3 can be left.

Effects of the Invention As described above, according to the present invention, printing ink of the same material can be used for the cutting mark and the identification mark, and both can be printed at the same time.Furthermore, ceramic electronic components can be produced by barrel polishing after firing. It is possible to provide a very rational manufacturing method in which only unnecessary cutting marks can be removed after firing through the steps normally required for .

[Brief explanation of drawings]

FIG. 1 is a top view of a conventional green sheet, FIG. 2 is a top view of a green sheet showing an embodiment of the present invention, and FIG. 3 is a sectional view of a ceramic chip thereof. 1... Green sheet, 2, 3... Mark, 4
...Green chip, 8...Ceramic chip.

Claims (1)

[Claims] 1. By printing an ink containing a second porcelain material on the upper surface of a green sheet made of a mixture of a first porcelain material and a synthetic resin binder, cutting portions for cutting the green sheet into a plurality of pieces are formed. simultaneously creating a mark and a mark that remains on the individual piece for identification after the individual piece is sintered by the reaction between the first porcelain material and the second porcelain material when the individual piece is fired; A method for manufacturing ceramic electronic parts, characterized in that only the mark at the cut portion is removed and the identification mark is left by barrel polishing the individual pieces.